• Journal of Energy Engineering
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• v.5 no.1
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• pp.65-71
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• 1996

Decomposition reaction of methanol was conducted on Ni-Cu/SiO$_2$catalysts with several variables. Variables used in this study are S.V(Space Velocity), partial pressure of methanol, reaction temperature, and composition rate of Ni-Cu. The range of S.V is 10,000-30,000h$\^$-1/, the temperature range is 150-400$^{\circ}C$ and values of Cu/(Ni＋Cu) are 0, 0.25, 0.5, 0.75, and 1. Over Ni/SiO$_2$, and Ni-Cu/SiO$_2$, the conversion rate of decomposition reaction of methanol arrived at 100% with increasing of temperature. At this time the selectivity of CO on Ni/SiO$_2$, was suddenly decreased, but on Ni-Cu/SiO$_2$, it was still sustained highly. The main products of reaction were CO and H$_2$, and by-products were CO$_2$ and CH$_4$mainly.

• Journal of the Korean Chemical Society
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• v.31 no.6
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• pp.509-519
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• 1987

The tetradentate Schiff base ligand, 3,4-bis(salicylidene diimine) toluene, have been prepared by the reaction of salicylaldehyde with 3,4-diaminotoluene by Duff method. The Schiff base ligand reacts with Ni(II), Co(II), and Cu(II) ions to form new complexes, [Ni(o-BSDT)${\cdot}(H_2O)_2$], [Co(o-BSDT)${\cdot}(H_2O)$], and [Cu(o-BSDT)]. It seems that Ni(II) and Ni(II) complexes are hexacoordinated with the Schiff base ligand and two molecules of water, while the Cu(II) complexes are tetracoordinated with the Schiff base. The mole ratio of tetradentate Schiff base ligand to metals was found to be 1 : 1. The redox chemistry of these complexes was investigated by polarography and cyclic voltammetry with glassy carbon electrode in DMSO with 0.1M TEAP${\cdot}$[Ni(o-BSDT)${\cdot}(H_2O)_2$] hav EC reaction mechanisms which undergo a irreversible electron transfer followed by a fast chemical reaction. [Co(o-BSDT)${\cdot}(H_2O)_2$] undergoes a reduction of Co(II) to Co(I) and a oxidation of Co(II) to Co(III), and [Cu(o-BSDT)] undergoes a reduction of Cu(II) to Cu(I).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.2
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• pp.120-125
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• 2006

By employing a rapid solidification method and atmospheric annealing at $450^{\circ}C-1hr$, we were able to manufacture inexpensively granular CuCo alloy ribbons with thickness of $20{\mu}m$ showing giant magnetoresistance (GMR) ratio of more than 5% at a high magnetic field of 0.5T. To verify maximum MR effect, the MR ratio, saturation magnetization, and microstructure change were investigated with Co contents between 5 and 30 at%. It was possible to obtain GMR ratios of 5.2% at 1.2T, and 3% at 0.5T, which implies an appropriate MR for industrial purpose at a Co content of $8{\sim}l4%$. MR ratio was reduced rapidly at a Co content below 5% due to superparamagnetic effect and at a Co content above 20% due to agglomeration of Co clusters. Surface oxidation during rapid solidification and atmospheric annealing did not have much affect on MR ratio. Our result implies that our economic CuCo granular alloy ribbons may be appropriate for high magnetic field sensor applications with wide content range of $8{\sim}14$ at%Co.

• Journal of the Korean Ceramic Society
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• v.46 no.4
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• pp.429-435
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• 2009

In this study, we investigated microstructure and the CO gas sensing properties of Ag-CuO-$SnO_2$ thin films prepared by co-evaporation and subsequently thermal oxidation at air atmosphere. The sensitivity of a Cu-Sn films, thermally oxidized at $600^{\circ}C$, is strongly affected by the amount of Cu. At Cu:7 wt%-Sn:93 wt%, the film exhibited a maximum sensitivity of ${\sim}2.3$ to CO gas of 1000 ppm at $300^{\circ}C$. In contrast, the sensitivity of a Sn-Ag film did not change significantly with the amount of Ag. An enhanced sensitivity of ${\sim}3.7$ was observed in the film with a composition of Ag:3 wt%-Cu:4 wt%-Sn:93 wt%, when thermally oxidized at $600^{\circ}C$. In addition, this thin film shows a response time of ${\sim}80$ sec and a recovery time of ${\sim}450$ sec to 1000 ppm CO gas. The results demonstrate that the CO sensitivity of the Ag-CuO-$SnO_2$ thin films may be closely associated with coexistence of $SnO_2$ and SnO phase, decrease in average particle size, and a porous microstructure. We also suggest that co-evaporation and followed by thermal oxidation is a very simple and effective method to prepare oxide gas sensor thin films.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.106-114
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• 1992

Abstract-Quantitative surface analysis of Co-Ni and Au-Cu alloys by XPS and SIMS was studied. For Co-Ni alloy, quantitative XPS analysis could be done within 1-2% relative error with pure element standards without any correction. For Au-Cu, quantitative XPS analysis was not possible without any correction. But it could be done with standard alloys of various composition within 1-2% relative error. Without standard alloys, Au-Cu alloys could be analyzed by XPS within 10% relative error with pure element standards. For SIMS analysis of Co-Ni alloys, the relative secondary ion yields of Co+/Nit has linear relation with ratio of each composition so that quantitative SIMS analysis was possible for Co-Ni alloys. Preliminary results of XPS round robin test of VAMAS-SCA Japan Project are given.

• Applied Chemistry for Engineering
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• v.35 no.1
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• pp.1-7
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• 2024

Mn-M/Al₂O₃ (M = Cu, Fe, Co, and Ce) catalysts were prepared for simultaneous oxidation of NO, CO, and CH₄, and their oxidation activities were compared. The Mn-Cu/ Al₂O₃ catalyst with the best simultaneous oxidation activity was characterized by XRD, Raman, XPS, and O₂-TPD analysis. The result of XRD indicated that Mn and Cu existed as complex oxides in the Mn-Cu/Al₂O₃ catalyst. Raman and XPS results showed that electron transfer between Mn ions and Cu ions occurred during the formation of the Mn-O-Cu bond in the Mn-Cu/Al₂O₃ catalyst. The XPS O 1s and O₂-TPD analyses showed that the Mn-Cu/Al₂O₃ catalyst has more adsorbed oxygen species with high mobility than the Mn/Al₂O₃ catalyst. The high simultaneous oxidation activity of the Mn-Cu/Al₂O₃ catalyst is attributed to these results. Gas-phase NO promotes the oxidation reactions of CO and CH₄ in the Mn-Cu/Al₂O₃ catalyst while suppressing the NO oxidation reaction. These results were presumed to be because the oxidized NO was used as an oxidizing agent for CO and CH₄. On the other hand, the oxidation reactions of CO and CH₄ competed on the Mn-Cu/Al₂O₃ catalyst, but the effect was not noticeable because the catalyst activation temperature was different.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.48-48
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• 2002

• Journal of the Korean Magnetics Society
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• v.3 no.4
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• pp.314-319
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• 1993

The Effects of additional element X (X = Si, Mo, Cu, Gd) on magnetic properties and microstructure of Co-1Zat%Cr-Zat%Ta/Cr-X magnetic thin film were investigated. The thickness changes of Cr-X underlayer and CoCrTa magnetic layer were in the range of $1000~2000\AA$ and $200~800\AA$. respectively. Substrate temperatures were controlled from $100^{\circ}C$ to $200^{\circ}C$. Increase of coercivity by about 100~200 Oe was observed in CoCrTa/Cr-X thin films compared to those without additional X element. Cu was the most effective additional element for increasing coercivity. CoCrTa/Cr-Cu thin film shows relatively high coercivity in $1500\AA$ underlayer thickness and $600\AA$ magnetic layer thickness.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.456-460
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• 1995

Giant magnetoresistance(GMR) of $Cu_{85-x}Co_{15}Ni_{x}$ melt-spu ribbons is closely correlated with the microstructure produced by the spinodal decomposition. The solid solution range is extanded by the replacement of Cu by Ni in the as-quenched state. The wavelengths obtained by subsequent isothermal aging in Cu-Co-Ni ribbons are shorter than those in Cu-Co binary ribbons, resulting in the increase of the surface-to-volume ratio. The largest MR ratio of 8 % in high field has been achieved in the $Cu_{80}Co_{15}Ni_{5}$ aged ribbon. The field dependence of MR ratio in low fields becomes larger with the Ni content.

• Journal of Surface Science and Engineering
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• v.39 no.6
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• pp.276-281
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• 2006

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.