• Title/Summary/Keyword: Cu-rich phase

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Chalcogenide 기반 메모리 소자의 스위칭 특성 향상을 위한 광학패턴 형성

  • Park, Ju-Hyeon;Han, Chang-Jo;Gang, Ji-Su;Lee, Dal-Hyeon;Nam, Gi-Hyeon;Jeong, Hong-Bae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.185-185
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    • 2010
  • Programmable Metallization Cell (PMC) Random Access Memory is based on the electrochemical growth and removal of electrical nanoscale pathways in thin films of solid electrolytes. In this study, we investigated the nature of thin films formed by the photo doping of copper ions into chalcogenide materials for use in programmable metallization cell devices. These devices rely on metal ions transport in the film so produced to create electrically programmable resistance states. The results imply that a Cu-rich phase separates owing to the reaction of Cu with free atoms from chalcogenide materials.

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Microstructure and Mechanical Properties of Sn-3.5wt.%Ag Solder with Bi Addition (Bi를 첨가한 Su-3.5wt.%Ag 땜납의 미세조직 및 기계적 성질)

  • Lee, Kyung-Ku;Baek, Dae-Hwa;Seo, Youn-Jong;Lee, Doh-Jae
    • Journal of Korea Foundry Society
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    • v.21 no.4
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    • pp.239-245
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    • 2001
  • Microstructure and mechanical properties of Sn-3.1 wt.%Ag-6.9 wt.%Bi system solders on Cu-substrate were studied. The Sn3.1 wt.%Ag-6.9 wt.%Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy consists of Bi-rich phase and $Ag_3Sn$ precipitate in {\beta}-Sn$ matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1Ag-6.9Bi alloy is better than that of Sn-3.5 wt.%Ag alloy at all test conditions.

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Effects of Mg Addition to Cu/Al2O3 Catalyst for Low-Temperature Water Gas Shift (LT-WGS) Reaction

  • Zakia Akter Sonia;Ji Hye Park;Wathone Oo;Kwang Bok Yi
    • Clean Technology
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    • v.29 no.1
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    • pp.39-45
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    • 2023
  • To investigate the effects of Mg addition at different aging times and temperatures, Cu/MgO/Al2O3 catalysts were synthesized for the low-temperature water gas shift (LT-WGS) reaction. The co-precipitation method was employed to prepare the catalysts with a fixed Cu amount of 30 mol% and varied amounts of Mg/Al. Synthesized catalysts were characterized using XRD, BET, and H2-TPR analysis. Among the prepared catalysts, the highest CO conversion was achieved by the Cu/MgO/Al2O3 catalyst (30/40/30 mol%) with a 60 ℃ aging temperature and a 24 h aging time under a CO2-rich feed gas. Due to it having the lowest reduction temperature and a good dispersion of CuO, the catalyst exhibited around 65% CO conversion with a gas hourly space velocity (GHSV) of 14,089 h-1 at 300 ℃. However, it has been noted that aging temperatures greater or less than 60 ℃ and aging times longer than 24 h had an adverse impact, resulting in a lower surface area and a higher reduction temperature bulk-CuO phase, leading to lower catalytic activity. The main findings of this study confirmed that one of the main factors determining catalytic activity is the ease of reducibility in the absence of bulk-like CuO species. Finally, the long-term test revealed that the catalytic activity and stability remained constant under a high concentration of CO2 in the feed gas for 19 h with an average CO conversion of 61.83%.

The Effect of Au Addition on the Hardening Mechanism in Ag-20wt% Pd-20wt% Cu (Ag-20wt% Pd-20wt% Cu 3원합금(元合金) 및 Au첨가합금(添加合金)의 시효경화특성(時效硬化特性))

  • Park, M.H.;Bae, B.J.;Lee, H.S.;Lee, K.D.
    • Journal of Technologic Dentistry
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    • v.19 no.1
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    • pp.21-35
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    • 1997
  • The Ag-Pd-Cu alloys containing a small amount of Au is commonly used for dental purposes, because this alloy is cheaper than Au-base alloys for clinical use. However, the most important characteristic of this alloy is age-hardenability, which is not exhibited by other Ag-base dental alloys. The specimens used were Ag-20Pd-20Cu ternary alloy and Au addition alloy. These alloys were melted and casted by induction electic furace and centrifugal casting machine in Ar atmoshpere. These specimens were solution treated for 2hr at $800^{\circ}C$ and were then quenched into iced water, and aged at $350{\sim}550^{\circ}C$ Age-hardening characteristics of the small Au-containing Ag-pPd-Cu dental alloys were investigated by means of hardness testing, X-ray diffraction and electron microscope observations, electrical resistance, differential scanning calorimetric, emergy dispersed spectra and electron probe microanalysis. Principal results are as follows : Hardening occured in two stages, I. e., stage I in low temperature and stage II in high temperature regions, during continuous aging. The case of hardening in stage I was due to the formation of the Llo type face centered tetragonal PdCu-ordered phase in the grain interior and hardening in stage I was affedted by the Cu concentration. In stage II, decomposition of the $\alpha$ solid solution to a PdCu ordered phase(L1o type) and an Agrich ${\alpha}2$ phase occurred and a discontiunous precipitation occurred at the grain boundary. Form the electron microscope study, it was concluded that the cause of age-hardening in this alloy is the precipitation of the PdCu ordered phase, which has AuCu I type face-centered tetragonal structure. Precipitation procedure was ${\alpha}\to{\alpha}+{\alpha}2+PdCu\to{\alpha}1+{\alpha}2+PdCu$ at Pd/Cu = 1 Ag-Pd-Cu alloy is more effective dental alloy as ageing treatment and is suitable to isothermal ageing at $450^{\circ}C$.

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Magnetic Behaviors of Isolated Fe-Co-Ni Nanoparticles in a Random Arrangement

  • Yang, Choong Jin;Kim, Kyung Soo;Wu, Jianmin
    • Journal of Magnetics
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    • v.6 no.3
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    • pp.94-100
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    • 2001
  • Fe-Co-Ni particles with an average size of 45 and 135 nm are characterized in terms of magnetic phase transformation and magnetic properties at room temperature. BCC structure of Fe-Co-Ni spherical particles can be synthesized from Fe-Co-Ni-Al-Cu precursor films by heating at 600-80$0^{\circ}C$ for the phase separation of Fe-Co rich Fe-Co-Ni particles, followed by a post heating at $600^{\circ}C$ for 5 hours. The average size of nanoparticles was directly determined by the thickness of precursor films. Exchange interactive hysteresis was observed for the nano-composite (Fe-Co-Ni)+(Fe-Ni-Al) films resulting from the short exchange interface between ferromagnetic Fe-Co-Ni particles surrounded by almost papramagnetic Ni-Al-Fe matrix. Arraying the isolated Fe-Co-Ni nano-particles in a random arrangement on $Al_2O_3$substrate the particle assembly showed a behavior of dipole interactive ferromagnetic clusters depending on their volume and inter-particle distance.

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Microstructural properties of Pt-doped $YBa_{2}Cu_{3}O_{7-x}$ high $T_c$ superconductor prepared by melting method.

  • Song, Jin-Tae
    • Proceedings of the Materials Research Society of Korea Conference
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    • 1992.05a
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    • pp.16-16
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    • 1992
  • We have studied the effect of platinum addition on the supercon ducting properties of YB $a_2$C $u_3$$O_{7-x}$ (123) compound and elucidated the mechanism of fine dispersion of $Y_2$BaCu $O_{5}$(211) particles in YB $a_2$C $u_3$$O_{7-x}$ superconductor prepared by melting method from the metallurgical point of view. In this study, BaCu $O_2$ and CuO-rich phase unreacted during the peritecitc reaction markedly decreased by the 211 powder addition. The 211 particle of Pt-fee sintered samples exhibited 8~10$\mu$m in size, but in 1wt%Pt-added sample, 211 particles were finely dispersed in 123 matrix and the size of 211 particle was about 1~2$\mu$m. And, the critical temperature( $T_{c. zero}$) of Pt doped samples was 91.5K and the transport critical current density ( $J_{c}$) of Pt-doped samples was much more than 10$^4$A/$\textrm{cm}^2$. The high $J_{c}$ and fine dispersion of 211 particles of Pt doped YB $a_2$C $u_3$$O_{7-x}$ superconductor are attributed to $Ba_4$CuP $t_2$ $O_{8}$ compounds formed during the partial melting, which were considered als nucleation sites of 211 particles, rather than Pt inself.han Pt inself.

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Microstructural and Mechanical Characteristics of Al-Si-Cu Die Casting Alloy for Engine Mount Bracket (엔진 마운트 브라켓용 다이캐스팅 Al-Si-Cu 합금의 미세조직과 기계적 특성)

  • Chyun, In-Bum;Hong, Seung-Pyo;Kim, Chung-Seok
    • Journal of the Korean Society for Heat Treatment
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    • v.27 no.6
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    • pp.281-287
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    • 2014
  • Microstructural and mechanical characteristics of Al-6Si-2Cu alloy for engine mount bracket prepared by gravity casting (as-cast) and die-casting (as-diecast) process have been investigated. For the microstructural characterization, the inductively coupled plasma mass spectrometry (ICP-MS), optical microscope (OM), scanning electron microscope (SEM) and electron probe microanalysis (EPMA) analyses are conducted. For the intermetallic phases, the X-ray diffraction (XRD) and energy dispersive spectroscopy (EDS) are also conducted with quantitative and qualitative analysis. Micro Vickers hardness and static tensile test are achieved in order to measure mechanical properties of alloys. Secondary dendrite arm spacing (SDAS) of as-cast and as-diecast show 37um and 18um, respectively. A large amount of coarsen eutectic Si, $Al_2Cu$ intermetallic phase and Fe-rich phases are identified in the Al-6Si-2Cu alloy. Mechanical properties of gravity casting alloy are much higher than those of die-casting alloy. Especially, yield strength and elongation of gravity casting alloy show 2 times higher than die-casting alloy. After shot peening, shot peening refined the surface grains and Si particles of the alloys by plastic deformation. The surface hardness value shows that shot peening alloy has higher value than unpeening alloy.

Fabrication of SmBCO Coated Conductors using IBAD-MgO Template (IBAD-MgO 템플릿을 이용한 SmBCO 박막선재의 제조)

  • Ha, Hong-Soo;Kim, Ho-Sup;Yang, Ju-Saeng;Jung, Yae-Hyun;Kim, Ho-Kyum;Yoo, Kwon-Kuk;Ko, Rock-Kil;Song, Kyu-Jeong;Ha, Dong-Woo;Oh, Sang-Soo;Yeom, Do-Jun;Park, Chan;Yoo, Sang-Im;Moon, Seong-Hyun;Joo, Jin-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.30-31
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    • 2006
  • We have fabricated SmBCO coated conductor on IBAD-MgO substrates using unique co-evaporation method. The batch type co-deposition system was specially designed and named as EDDC(evaporation using drum m dual chamber) that is possible to deposit superconducting layer with different composition ratio at low temperature of $700^{\circ}C$. In this study, we have investigated the influence of SmBCO phase composition and texture of IBAD-MgO template on the critical current density. We have changed the deposition rates of Sm, Ba and Cu during co-evaporation to examine the optimal composition ratio shown better critical current density. The composition ratio and surface morphology of SmBCO coated conductors were analyzed by the EDX and SEM, respectively. A higher critical current density was measured at superconducting phase composition ratio of Ba deficiency, Sm or Cu rich compared to the Sm1Ba2Cu3Ox stoichiometry.

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Effect of Samarium Addition on Microstructure and Thermal Conductivity of Al-Si-Cu Aluminum Alloy (Sm 첨가에 따른 Al-Si-Cu 알루미늄 합금의 미세조직 및 열전도도 변화)

  • Choi, Jin-Ju;Kang, Yubin;Im, Byoungyong;Lee, Chan-Gi;Kim, Hangoo;Park, Kwang Hoon;Kim, Dae-Guen
    • Korean Journal of Materials Research
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    • v.30 no.1
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    • pp.31-37
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    • 2020
  • In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 ㎛ were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

Effect of the Deposition Time onto Structural Properties of Cu2ZnSnS4 Thin Films Deposited by Pulsed Laser Deposition (펄스 레이저 증착법으로 제작한 Cu2ZnSnS4 박막의 구조 특성 변화에 대한 증착 시간 효과)

  • Byeon, Mirang;Bae, Jong-Seong;Hong, Tae-Eun;Jeong, Euh-Duck;Kim, Shinho;Kim, Yangdo
    • Korean Journal of Materials Research
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    • v.23 no.1
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    • pp.7-12
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    • 2013
  • The $Cu_2ZnSnS_4$ (CZTS) thin film solar cell is a candidate next generation thin film solar cell. For the application of an absorption layer in solar cells, CZTS thin films were deposited by pulsed laser deposition (PLD) at substrate temperature of $300^{\circ}C$ without post annealing process. Deposition time was carefully adjusted as the main experimental variable. Regardless of deposition time, single phase CZTS thin films are obtained with no existence of secondary phases. Irregularly-shaped grains are densely formed on the surface of CZTS thin films. With increasing deposition time, the grain size increases and the thickness of the CZTS thin films increases from 0.16 to $1{\mu}m$. The variation of the surface morphology and thickness of the CZTS thin films depends on the deposition time. The stoichiometry of all CZTS thin films shows a Cu-rich and S-poor state. Sn content gradually increases as deposition time increases. Secondary ion mass spectrometry was carried out to evaluate the elemental depth distribution in CZTS thin films. The optimal deposition time to grow CZTS thin films is 150 min. In this study, we show the effect of deposition time on the structural properties of CZTS thin film deposited on soda lime glass (SLG) substrate using PLD. We present a comprehensive evaluation of CZTS thin films.