Browse > Article
http://dx.doi.org/10.3740/MRSK.2020.30.1.31

Effect of Samarium Addition on Microstructure and Thermal Conductivity of Al-Si-Cu Aluminum Alloy  

Choi, Jin-Ju (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE))
Kang, Yubin (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE))
Im, Byoungyong (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE))
Lee, Chan-Gi (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE))
Kim, Hangoo (NEDEC)
Park, Kwang Hoon (Program in Metals and Materials Process Engineering, Inha University)
Kim, Dae-Guen (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE))
Publication Information
Korean Journal of Materials Research / v.30, no.1, 2020 , pp. 31-37 More about this Journal
Abstract
In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 ㎛ were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.
Keywords
Al-Si-Cu al alloy; rare earth; Sm; hardness; thermal conductivity;
Citations & Related Records
연도 인용수 순위
  • Reference
1 L. F. Mondolfo, Aluminum alloys : structure and properties, p.759, Elsevier, London (2013).
2 K. R. Ravi, R. M. Pillai, K. R. Amaranathan, B. C. Pai and M. Chakraborty, J. Alloys Compd., 456, 201 (2008).   DOI
3 J. K. Chen, H. Y. Hung, C. F. Wang and N. K. Tang, J. Mater. Sci., 50, 5630 (2015).   DOI
4 Y. H. Cho, H. W. Kim, J. M. Lee and M. S. Kim, J. Mater. Sci., 50, 7271 (2015).   DOI
5 Y. L, Shen, A, Needleman and S. Suresh, Metall. Mater. Trans. A, 25, 839 (1994).   DOI
6 R. Chein and G. Huang, Appl. Therm. Eng., 24, 2207 (2004).   DOI
7 F. L. Tan and C. P. Tso, Appl. Therm. Eng., 24, 159 (2004).   DOI
8 D. D. L. Chung, J. Mater. Eng. Perform., 10, 56 (2001).   DOI
9 H. S. Huang, Y. C. Weng, Y. W. Chang, S. L. Chen and M. T. Ke, Int. Commun. Heat Mass Transfer., 37, 140 (2010).   DOI
10 C. W. Kim, J. I. Choi, S. W. Kim, Y. C. Kim and C. S. Kang, ICAA13 Pittsburgh. Springer Cham., 237 (2012).
11 K. Nogita, S. D. McDonald and A. K. Dahle, Mater. Trans., 45, 323 (2004).   DOI
12 H. Qiu, H. Yan and Z. Hu, J. Mater. Res., 29, 1270 (2014).   DOI
13 Y. RAO, H. Yan and Z. Hu, J. Rare Earths, 31, 916 (2013).   DOI
14 Z. HU, H. Yan and Y. Rao, Trans. Nonferrous Met. Soc. China., 23, 3228 (2013).   DOI
15 H. Liao, Y. Sun and G. Sun, Mater. Sci. Eng., A, 335, 62 (2002).   DOI
16 J. Asensio-Lozano and B. Suarez-Pena, Scr. Mater., 54, 943 (2006).   DOI
17 H. Qiu, H. Yan and Z. Hu, J. Alloys Compd., 567, 77 (2013).   DOI
18 H. S. Kang, W. Y. Yoon, K. H. Kim, M. H. Kim, Y. P. Yoon and I. S. Cho, Mater. Sci. Eng., A, 449, 334 (2007).   DOI
19 S. Z. Lu and A. Hellawell, J. Cryst. Growth, 73, 316 (1985).   DOI
20 B. Suarez-Pena and J. Asensio-Lozano, Mater. Charact., 57, 218 (2006).   DOI
21 T. Kobayashi, Mater. Sci. Eng., A, 280, 8 (2000).   DOI
22 C. Chong, Z. X. LIU, R. Bo, M. X. WANG, Y. G. WENG and Z. Y. LIU, Trans. Nonferrous Met. Soc. China, 17, 301 (2007).   DOI
23 S. Weixi, G. Bo, T. Ganfeng, L. Shiwei, H. Yi and Y. Fuxiao, J. Rare Earths, 28, 367 (2010).   DOI
24 F. Stadler, H. Antrekowitsch, W. Fragner, H. Kaufmann, E. R. Pinatel and P. J. Uggowitzer, Mater. Sci. Eng., A, 560, 481 (2013).   DOI