• Journal of the Korean Magnetics Society
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• v.1 no.2
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• pp.37-41
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• 1991

Amorphous $Fe_{68.5}Co_5M_3Cu_1Si_{13.5}B_9(M=Nb, Mo, Mn, Cr)$ alloys were prepared by using rapidly quenching techinque and were annealed above their crystallization temperatures. Coercive force, initial permeability and AC power loss of the annealed $Fe_{68.5}Co_5M_3Cu_1Si_{13.5}B_9(M=Nb, Mo, Mn, Cr)$ alloys have been studied systematically. Nanocrystallines are formed in the annealed alloys which include Mo and Nb. Remarkably improved soft magnetic properties are obtained in the alloys whose average grain size is around 10 nm. However, soft magnetic properties of the alloys are degraded when grain size is less than IOnm or larger than 15nm. It is considered that the degradation of soft magnetic properties in the alloys whose average grain size is less than 10 nm is due to the Fe-rich amorphous phase retained at grain boundary during the initial crystallization process.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.995-1000
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• 2011

The microstructure of Cu-24 wt.%Ag filamentary nanocomposite fabricated by a thermo-mechanical process has been investigated by transmission electron microscopy (TEM) observations. This study is focused on the stability of Ag filaments formed by cold drawing; the effects of thermal treatment on the precipitation behavior and distribution of Ag-rich precipitates were also investigated. The Ag filaments elongated along the <111> orientation were observed in Cu-rich ${\alpha}$ phase of the as-drawn specimen and the copper matrix and the silver filament have a cube on cube orientation relationship. Annealing at temperatures lower than $200^{\circ}C$ for the as-drawn specimen caused insignificant change of the fibrous morphology but squiggly interfaces or local breaking of the elongated Ag filaments were easily observed with annealing at $300^{\circ}C$. When samples were annealed at $400^{\circ}C$, discontinuous precipitation was observed in supersaturated Cu solid solution. Ag precipitates with a thickness of 7-20 nm were observed along the <112> direction and the orientation relationship between the copper matrix and the Ag precipitates maintained the same orientation relationship in the as-drawn specimen. The interface between the copper matrix and the Ag precipitates is parallel to {111} and micro-twins were observed in the Ag precipitates.

• Korean Journal of Metals and Materials
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• v.47 no.10
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• pp.605-612
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• 2009

The suitability of twin roll strip casting for Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni brazing alloy (known as HS-49D) was examined in the present work and the mechanical properties and microstructure of the strip were also investigated. The effect of annealing heat treatment on the properties was also studied. The new manufacturing process has applications in the production of the brazing alloy. XRD and microstructural analyses of the Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni strip revealed a eutectic microstructure of an Ag-rich matrix (FCC) and a Cu-rich phase (FCC) regardless of heat treatment. The results of mechanical tests showed tensile strength of 434 MPa and 80% elongation for the twin roll casted strip. Tensile results showed decreasing strengths and increasing elongation with annealing heat treatment. Microstructural evolution and fractography were also investigated and related to the mechanical properties.

• Korean Journal of Materials Research
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• v.6 no.7
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• pp.684-691
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• 1996

To enhance the formation of Bi,Sr,Ca,Cu,O,(Bi-2223) single phase in a shorter reaction time, the intermediate compounds such as Bi,Sr,CuO,(Bi-2201). BizSr,CaCuz08(Bi-2212) and (Ca, Sr,, ,9)CuOz in the Bi-Sr-Ca-Cu-0 system were used as the precursors. The formation of Bi-2223 was enhanced in the mixture of Bi-2201 and (Ca, ,,Sr, 119)C~eOsZpe,c ially from the mixture with (Ca, 9I Sr, ,,)CuO,-rich composition compared to Bi, iPb, 4Sr2Ca,Cu3010-cxo mposition. The formation of Bi- 2223 essentially completed within 60h at 860$^{\circ}$C and 870$^{\circ}$C. However, a small amount of the remnant Bi-2212 phase did not disappear even after a prolonged reaction at 870'C. The merit of the proposed synthetic method using the intermediate precusors can be summarized as a shorter reaction time for the formation of Bi-2223 phase, in addition to a smaller amount of second phases compared to the conventional solid-state reaction method.

• Transactions on Electrical and Electronic Materials
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• v.9 no.6
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• pp.227-230
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• 2008

Programmable Metallization Cell (PMC) Random Access Memory is based on the electrochemical growth and removal of electrical nanoscale pathways in thin films of solid electrolytes. In this study, we investigated the nature of thin films formed by the photo doping of copper ions into chalcogenide materials for use in programmable metallization cell devices. These devices rely on metal ions transport in the film so produced to create electrically programmable resistance states. The results imply that a Cu-rich phase separates owing to the reaction of Cu with free atoms from chalcogenide materials.

• Journal of Korea Foundry Society
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• v.10 no.5
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• pp.399-407
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• 1990

The effect of thermal cycling and isothermal exposure on the high temperature microstructural stability of unidirectionally solidified $Al-CuAl_2$ eutectic composite has been studied. A coarsening procedures of lamellar eutectic structures were initiated at growth fault region because of diffusion through low angle boundary at this region. It was considered that thermally induced residual stresses produced by thermal cycling were high enough to increase the dislocation density in Al-rich matrix phase. However, it was also considered that dislocations generated by these high thermal stresses were annihilated at high temperature by stress relaxation. Consequently, the thermal cycling up to 1440 cycles between 20 and $520^{\circ}C$ did not affect the microstructural stability.

• Journal of Welding and Joining
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• v.12 no.3
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• pp.48-55
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• 1994

In this experiment, to find optimum brazing conditions for Cu/Stainless Steel brazing using filler metals of Ag-Cu-Zn-Cd system, first of all spreading ratio was tested on 304 stainless Steel and low carbon steel. And then shear test of brazed joint was executed. As the result of that, the shear strengths of brazed joints were the range of 60-90 MPa. Through microstructure analysis for brazed interface layer, We found as follows. Firstly interface layer increased as time increased. Secondly continuous layer of Ag-Cd compound was observed along the side of stainless steel. Also by means of EDS analysis for fracture surface, ductile fracture was occurred and precipitates on the fracture surface were found to include Cr, Mn, Si in Ag-rich phase.

• Journal of Powder Materials
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• v.23 no.6
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• pp.432-436
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• 2016

We investigate the microstructural and magnetic property changes of $DyH_2$, $Cu+DyH_2$, and $Al+DyH_2$ diffusion-treated NdFeB sintered magnets with the post annealing (PA) temperature. The coercivity of all the diffusion-treated magnets increases with increasing heat treatment temperature except at $910^{\circ}C$, where it decreases slightly. Moreover, at $880^{\circ}C$, the coercivity increases by 3.8 kOe in Cu and 4.7 kOe in Al-mixed $DyH_2$-coated magnets, whereas this increase is relatively low (3.0 kOe) in the magnet coated with only $DyH_2$. Both Cu and Al have an almost similar effect on the coercivity improvement, particularly over the heat treatment temperature range of $790-880^{\circ}C$. The diffusivity and diffusion depth of Dy increases in those magnets that are treated with Cu or Al-mixed $DyH_2$, mainly because of the comparatively easy diffusion path provided by Cu and Al owing to their solubility in the Nd-rich grain boundary phase. The formation of a highly anisotropic $(Nd,\;Dy)_2Fe_{14}B$ phase layer, which acts as the shell in the core-shell-type structure so as to prevent the reverse domain movement, is the cause of enhanced coercivity of diffusion-treated Nd-Fe-B magnets.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.23-28
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• 2009

We investigated the wafer-level MEMS capping process for which cavity formation in Si wafer was not required. Ni caps were formed by electrodeposition on 4" Si wafer and Ni rims of the Ni caps were bonded to the Cu rims of bottom Si wafer by using epoxy. Then, top Si wafer was debonded from the Ni cap structures by using SnBi layer of low melting temperature. As-evaporated SnBi layer was composed of double layers of Bi and Sn due to the large difference in vapor pressures of Bi and Sn. With keeping the as-evaporated SnBi layer at $150^{\circ}C$ for more than 15 sec, SnBi alloy composed of eutectic phase and Bi-rich $\beta$ phase was formed by interdiffusion of Sn and Bi. Debonding between top Si wafer and Ni cap structures was accomplished by melting of the SnBi layer at $150^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.496-499
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• 2000

In order to investigate the effect of Ge addition to the Cu Matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt％ Ge alloy were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240 h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$Sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$.