• 제목/요약/키워드: Cu-free

검색결과 880건 처리시간 0.022초

무연 솔더 볼의 공정조건 최적화에 관한 연구 (A Study on the Process Condition Optimization of Lead Free Solder Ball)

  • 김경섭;선용빈;장호정;유정희;김남훈;장의구
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.126-129
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    • 2002
  • This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

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Immersion Ag가 도금된 Cu기판을 가진 Pb-free solder 접합부의 신뢰성 평가 (Reliability evaluation of Pb-free solder joint with immersion Ag-plated Cu substrate)

  • 윤정원;정승부
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년도 춘계 학술대회 개요집
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    • pp.30-32
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    • 2006
  • The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

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Sn-CU계 다원 무연솔더의 미세구조와 납땜특성 (Microstructures and Solderability of Multi-composition Sn-Cu Lead-free Solders)

  • 김주연;배규식
    • 한국재료학회지
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    • 제15권9호
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    • pp.598-603
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    • 2005
  • To develope new lead-free solders with the melting temperature close to that of Sn-37Pb$(183^{\circ}C)$, Sn-0.7Cu-5Pb-1Ga, Sn-0.7Cu-5Pb-1Ag, Sn-0.7Cu-5Pb-5Bi-1Ag, and Sn-0.7Cu-SBi-1Ag alloys were composed by adding low-netting elements such as Ga, Bi, Pb, and Ag to Sn-0.7Cu. Then the melting temperatures, microstructures, wettability, and adhesion properties of these alloys were evaluated. DSC analysis showed that the melting temperature of Sn-0.7Cu-SPb-1Ga was $211^{\circ}C$, and those of other alloys was in the range of $192\~200^{\circ}C$. Microstructures of these alloys after heat-treatment at $150^{\circ}C$ for 24 hrs were basically composed of coarsely- grown $\beta-Sn$ grains, and $Cu_6Sn_5$ and $Ag_3Sn$ intermetallic precipitates. Sn-0.7Cu-5Pb-1Ga and Sn-0.7Cu-5Pb-5Bi-1Ag showed excellent wettability, while Sn-0.7Cu-5Bi-1Ag and Sn-0.7Cu-5Pb-5Bi-1Ag revealed good adhesion strength with the Cu substrates. Among 4 alloys, Sn-0.7Cu-5Pb-5Bi-1Ag with the lowest melting temperature $(192^{\circ}C)$ and relatively excellent wettability and adhesion strength was suggested to be the best candidate solder to replace Sn-37Pb.

Modification of Cu,Zn-Superoxide Dismutase by Oxidized Catecholamines

  • Kang, Jung-Hoon
    • BMB Reports
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    • 제37권3호
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    • pp.325-329
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    • 2004
  • Oxidation of catecholamines may contribute to the pathogenesis of Parkinson's disease (PD). The effect of the oxidized products of catecholamines on the modification of Cu,Zn-superoxide dismutase (SOD) was investigated. When Cu,Zn-SOD was incubated with the oxidized 3,4-dihydroxyphenylalanine (DOPA) or dopamine, the protein was induced to be aggregated. The deoxyribose assay showed that hydroxyl radicals were generated during the oxidation of catecholamines in the presence of copper ion. Radical scavengers, azide, N-acetylcysteine, and catalase inhibited the oxidized catecholamine-mediated Cu,Zn-SOD aggregation. Therefore, the results indicate that free radicals may play a role in the aggregation of Cu,Zn-SOD. When Cu,Zn-SOD that had been exposed to catecholamines was subsequently analyzed by an amino acid analysis, the glycine and histidine residues were particularly sensitive. These results suggest that the modification of Cu,Zn-SOD by oxidized catecholamines might induce the perturbation of cellular antioxidant systems and led to a deleterious cell condition.

Sn/Cu 도금액의 보충이 도금제품의 도금피막특성에 미치는 영향 (The Supplement of Sn/Cu, Plating Solution Affects in Plating Skim Quality of the Plating Product)

  • 전택종;고준빈;이동주
    • 한국정밀공학회지
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    • 제26권7호
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    • pp.112-119
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    • 2009
  • The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

친환경 법규 대응을 위한 복합재 브레이크의 Cu Free 마찰재 개발에 관한 연구 (A Study on the Development of Cu Free Friction Material of Composite Brake to Response Eco-friendly Regulation)

  • 심재훈;이중희;신웅희;임동원;현은재
    • 자동차안전학회지
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    • 제14권2호
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    • pp.90-95
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    • 2022
  • Composite material is widely used in the automotive industries because it has excellent mechanical properties and is possible to reduce weight due to the low density. However, there is a new obstacle to meet environment regulation like Cu less or Cu free regulation for the friction material. Although it is strongly demanded, there are few research results about that unfortunately. Unless this problem is not solved properly, it is impossible to apply composite brake system to vehicle. In this paper, a new eco-friendly friction material for composite brake system is represented to respond these regulations. To do this, friction characteristics between existing low steel friction material and new eco-friendly friction material are verified to secure performances for brake system such as effect characteristic, fade characteristic and wear characteristic. And composite brake gets the equivalent or better performance compared to a low steel friction material. Finally, this result contributes to the study of major principles for the development of eco-friendly friction material in the future.

Fine-pitch 소자 적용을 위한 bumpless 배선 시스템 (Bumpless Interconnect System for Fine-pitch Devices)

  • 김사라은경
    • 마이크로전자및패키징학회지
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    • 제21권3호
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    • pp.1-6
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    • 2014
  • 차세대 전자소자는 입출력(I/O) 핀 수의 증가, 전력소모의 감소, 소형화 등으로 인해 fine-pitch 배선 시스템이 요구되고 있다. Fine-pitch 특히 10 um 이하의 fine-pitch에서는 기존의 무연솔더나 Cu pillar/solder cap 구조를 사용할 수 없기 때문에 Cu-to-Cu bumpless 배선 시스템은 2D/3D 소자 구조에서 매우 필요한 기술이라 하겠다. Bumpless 배선 기술로는 BBUL 기술, 접착제를 이용한 WOW의 본딩 기술, SAB 기술, SAM 기술, 그리고 Cu-to-Cu 열압착 본딩 기술 등이 연구되고 있다. Fine-pitch Cu-to-Cu interconnect 기술은 연결 방법에 상관없이 Cu 층의 불순물을 제거하는 표면 처리 공정, 표면 활성화, 표면 평탄도 및 거칠기가 매우 중요한 요소라 하겠다.

BGA 무연솔더(Sn-3.0Ag-0.5Cu)와 무전해 Ni-W-P 도금층 계면의 열 안정성에 대한 연구 (Study on Thermal Stability of the Interface between Electroless Ni-W-P Deposits and BGA Lead-Free Solder (Sn-3.0Ag-0.5Cu))

  • 신동희;조진기;강성군
    • 마이크로전자및패키징학회지
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    • 제17권1호
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    • pp.25-31
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    • 2010
  • 본 연구에서는 무연 솔더 중 우수한 특성을 보여 실용화된 Sn-3.0Ag-0.5Cu 조성의 솔더를 사용하여 2주 동안의 시효조건에서 W의 함량이 무전해 Ni-W-P 도금층과 솔더와의 계면에서의 IMC 생성에 미치는 영향에 대해서 조사하였다. 도금층내 인의 함량은 8 wt.%로 고정하였고, 텅스텐의 함량은 각각 0, 3, 6 및 9 wt.%로 변화시켰으며, 모든 시료는 $255^{\circ}C$에서 리플로우한 후, $200^{\circ}C$에서 2주 동안 시효처리하였다. 각각의 시료에서 $(Cu,Ni)_6Sn_5$$(Ni,Cu)_3Sn_4$의 IMC가 관찰되었으며, 시효처리시간의 증가에 따라 UBM과 무연납의 계면에서 생성된 IMC가 증가함을 보였고, W의 함량이 높을수록 열적 안정성이 증가하여 $Ni(W)_3P$의 생성 속도를 늦춰 그에 따른 영향으로 IMC의 두께가 증가함을 보였다.

F-free 구리 전구용액을 이용한 YBCO 박막 제조 (Fabrication of YBCO films in MOD processing using F-free Cu precursor solution)

  • 김영국;유재무;고재웅;정국채;김영준;한봉수
    • 한국초전도ㆍ저온공학회논문지
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    • 제7권3호
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    • pp.5-8
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    • 2005
  • Superconducting YBCO films were successfully fabricated by MOD process using F-free Cu precursor solution. In this study. a chemically modified precursor solution for MOD Processing was synthesized using metal-organic salts and F-free Cu precursor. It was shown that crack-free and uniform precursor films were formed after calcination in humidified oxygen atmosphere. Less than 3 hours are required to finish the calcination process. XRD measurement shows that $BaF_2,\;CuO,\;Y_2O_3$ are major constituent of precursor films. Furthermore. YBCO films without any secondary phases were successfully fabricated after annealing in wet $Ar/O_2$ prepared on a $LaA1O_3$ single crystal substrate $(10mm{\times}10mm)$ gives transport Ic of 10A at 77K. This chemical modification approach is a possible candidate for improving MOD-processing of YBCO coated conductor.

잔류 염소가 포함된 해수에서의 Cu-Ni 합금의 부식 거동 연구 (A Study on the Corrosion of Cu-Ni Alloy in Chlorinated Seawater for Marine Applications)

  • 정근수;윤병영;임채선
    • Corrosion Science and Technology
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    • 제17권4호
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    • pp.176-182
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    • 2018
  • Corrosion of the Cu alloy with 10wt% Ni in stagnant seawater with residual free chlorine was investigated. Despite that fact that Cu alloys are widely used for seawater applications due to their stubborn resistance to chloride attack, not much is known as to how the residual free chlorine in seawater affects corrosion of Cu and its alloys. In this work, immersion tests were conducted in the presence of different levels of chlorine for 90-10 Cu-Ni samples, one of the most frequently used Cu alloys for seawater application, mostly in shipbuilding. The results revealed no evidence for accelerated corrosion of the Cu-Ni alloy even in the presence of 5 ppm residual chlorine in seawater, signifying that the Cu-Ni alloy can be more tolerant to residual chlorine that has been commonly cited by the shipbuilding industry. However, comparison of polarization behavior of the alloy samples in the presence of different electrolytes with different concentrations of residual chlorine suggests that higher concentration of chlorine could increase the corrosion rate of the Cu-Ni alloy. Furthermore, it is suggested that microorganisms in the seawater could increase the corrosion rate of the Cu-Ni alloy by encouraging exfoliation of the corrosion product off the metal surface.