• Journal of the Korean Electrochemical Society
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• v.9 no.1
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• pp.34-39
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• 2006

Electrochemical properties of Cu foil current collector with a $Li_{0.5}La_{0.5}TiO_3$ Cu a Si thin film deposited by r.f sputtering as an anode for Li free battery were evaluated. The Cu foil current collectors were lied in and out of plasma during sputtering process. The X-ray diffraction results indicated that the as-deposited Si and $Li_{0.5}La_{0.5}TiO_3$ thin films in and out of plasma did not show any crystalline difference. The $Li_{0.5}La_{0.5}TiO_3$ film in plasma and Si film out of plasma showed better cyclability since crystalline $Li_{0.5}La_{0.5}TiO_3$ has much higher ionic conductivity and crystalline Si film is much sensitive far volume change during charge-discharge process. These results suggested that the deposition of amorphous Si on Cu foil current collector is much better for fabrication of Li free battery and it can be useful for the unique battery with a cycling number constraint of below 10.

• Resources Recycling
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• v.11 no.2
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• pp.3-13
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• 2002

The characteristics of cyanide decomposition in aqueous phase by hydrogen peroxide have been explored in an effort to develop a process to recycle waste water. The self-decomposition of $H_2O$$_2$at pH 10 or below was minimal even in 90 min., with keeping about 90% of $H_2O$$_2$undissociated. On the contrary, at pH 12 only 9% of it remained during the same time. In the presence of copper catalyst at 5 g Cu/L, complete decomposition of $H_2$O$_2$was accomplished at pH 12 even in a shorter time of 40 min. The volatility of free cyanide was decisively dependent on the solution pH: the majority of free cyanide was volatilized at pH 8 or below, however, only 10% of it was volatilized at pH 10 or above. In non-catalytic cyanide decomposition, the free cyanide removal was incomplete in 300 min. even in an excessive addition of $H_2$$O_2$at a $H_2$$O_2$/CN molar ratio of 4, with leaving behind about 8% of free cyanide. On the other hand, in the presence of copper catalyst at a Cu/CN molar ratio of 0.2, the free cyanide was mostly decomposed in only 16 min. at a reducedH202/CN molar ratio of 2. Ihe efnciency of HBO2 in cyanide decomposition decreased with increasing addition of H2O2 since the seu-decomposition rate of $H_2$$O_2$increased. At the optimum $H_2$$O_2$/mo1ar ratio 0.2 of and Cu/CN molar ratio of 0.05, the free cyanide could be completely decomposed in 70 min., having a self-decomposition rate of 22 mM/min and a H$_2$$O_2$ efficiency of 57%.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.110-110
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• 1999

• Proceedings of the Korean Magnestics Society Conference
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• 1997.11a
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• pp.30-31
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• 1997

• Proceedings of the Materials Research Society of Korea Conference
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• 2000.11a
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• pp.164-164
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• 2000

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.72-72
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• 2005

• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.360-364
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• 2018

A facile method to fabricate freestanding CuO nanoleaves and CuO nanowires-based films was demonstrated. $Cu(OH)_2$ nanoleaves and nanowires were prepared by a hydrolysis reaction in aqueous solution including pyridine and NaOH with the tailored concentrations at room temperature. The films of freestanding CuO nanoleaves and CuO nanowires can be successfully obtained via the simple vacuum infiltration following a thermal dehydration reaction. The morphologies and crystallinity of the $Cu(OH)_2$ nanoleaves/nanowires and CuO nanoleaves/nanowires were characterized by XRD, SEM, TEM and FT-IR. The films fabricated with freestanding CuO nanoleaves and nanowires in this study may be applicable for building high-efficiency organic binder-free devices, such as gas sensors, batteries, photoelectrodes for water splitting and so on.

• Journal of Welding and Joining
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• v.30 no.2
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.665-670
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• 2009

Lead-free piezoelectric ($Na_{1/2}K_{1/2}$)$NbO_3$ ceramics doped with CuO and $MnO_2$ were fabricated using the conventional oxide-mixing technique. With increasing content of CuO and $MnO_2$, the dielectric constant(${\varepsilon}_{33}$) and mechanical quality factor($Q_m$) value increased, while electromechanical coupling factor($K_p$) and piezoelectric constant($d_{33}$) decreased. The piezoelectric and dielectric properties ($Na_{1/2}K_{1/2}$)$NbO_3$ ceramics doped with CuO 2.461 wt% and $MnO_2$ 0.538 wt% at sintered temperature $1050\;^{\circ}C$ were attained ${\varepsilon}_{33}$ = 403, $K_p$ = 15, $Q_m$ = 122 and $d_{33}$ = 36 pC/N. Based on response surface methodology results using design of experiment, it was concluded that ($Na_{1/2}K_{1/2}$)$NbO_3$ doped with CuO 0.477 wt% and $MnO_2$ 0.269 wt% has possibility composition of being used for piezoelectric transformer.

• Journal of Magnetics
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• v.2 no.3
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• pp.96-100
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• 1997

A spin valve structure of NiO(40 nm)/Co(2 nm)/Cu(2.6 nm)/Co(x nm)/Ta(5 nm) has been investigated for the application of magnetic random access memory (MRAM). The spin valve structure exhibited very large difference in the coercivities between pinned and free layers, a relatively high GMR ratio, and a low free layer coercivity. The spin valves were prepared by sputtering and were characterized by dc 4-point probe, and VSM. The spin valves with combined free layer exhibited a maximun GMR ratio of 10.4% with a free layer coercivity of about 82 Oe. The spin valves with a single 10 nm thick a-CoNbZr free layer exhibited a GMR ratio of about 4.3% with a free layer coercivity of about 12 Oe. The GMR ratio of the spin valves increased by addition of Co between Cu and a-CoNbZr. It has been confirmed that the coercivity of free layer can be decreased by increasing the thickness of a-CoNbZr. It has been confirmed that the coercivity of free layer can be decreased by increasing the thickness of a-CoNbZr layer without losing the GMR ratio substantially, which was mainly due to high resistivity of the amorphous "layers".