• 한국재료학회지
• /
• 제34권3호
• /
• pp.163-169
• /
• 2024

As the limitations of Moore's Law become evident, there has been growing interest in advanced packaging technologies. Among various 3D packaging techniques, Cu-SiO₂ hybrid bonding has gained attention in heterogeneous devices. However, certain issues, such as its high-temperature processing conditions and copper oxidation, can affect electrical properties and mechanical reliability. Therefore, we studied depositing only a heterometal on top of the Cu in Cu-SiO₂ composite substrates to prevent copper surface oxidation and to lower bonding process temperature. The heterometal needs to be deposited as an ultra-thin layer of less than 10 nm, for copper diffusion. We established the process conditions for depositing a Co film using a Co(EtCp)₂ precursor and utilizing plasma-enhanced atomic layer deposition (PEALD), which allows for precise atomic level thickness control. In addition, we attempted to use a growth inhibitor by growing a self-assembled monolayer (SAM) material, octadecyltrichlorosilane (ODTS), on a SiO₂ substrate to selectively suppress the growth of Co film. We compared the growth behavior of the Co film under various PEALD process conditions and examined their selectivity based on the ODTS growth time.

• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
• /
• pp.936-936
• /
• 2006

Bulk amorphous materials have been intensively studied to apply for various advanced industry fields due to their high mechanical, chemical and electrical properties. These materials have been produced by several techniques such as mechanical alloying, melt spinning and gas atomization, etc. Among them, the atomization is the most potential technique for commercialization due to high cooling rate during solidification of the melt and mass productivity. However, the amorphous powders still have some limitations because of their low ductility and toughness. Therefore, intensive efforts have to be carried out to increase the ductility and toughness. In this study, the Ni-based amorphous powder was produced by the gas atomization process. And in order to increase the ductile toughness, ductile Cu phase was coated on the Ni amorphous powder by spray drying process. The characteristics of the as-synthesis powders have been examined and briefly mentioned. The master alloy with $Ni_{57}Zr_{20}Ti_{16}Si_2Sn_3$ was prepared by vacuum induction melting furnace with graphite crucible and mold. The atomization was conducted at $1450^{\circ}C$ under the vacuum of $10^{-2}$ torr. The gas pressure during atomization was varied from 35 to 50 bars. After making the Ni amorphous powders, the spray drying was processed to produce the Cu -coated Ni amorphous composite powder. The amorphous powder and Cu nitrate solution were mixed together with a small amount of binder and then it was sprayed at temperature of $130^{\circ}C$ and rotating speed of 15,000 R.P.M.

• 한국전기전자재료학회논문지
• /
• 제36권5호
• /
• pp.531-535
• /
• 2023

Mechanoluminescence (ML) is a phenomenon where the application of mechanical force to ML materials generates an electric field and produces light, holding significant promise as an eco-friendly technology. However, challenges in commercializing ML technology has arisen due to its low brightness and short luminous lifetime. To address this, in this work, we enhance ML efficiency by mixing carbon nanotubes (CNTs) into a ZnS: Cu embedded in a polydimethylsiloxane composite ML device. The inclusion of CNTs boosts ML intensity by 98% compared to devices without CNTs, as the increasing CNT fraction elevates conductivity, thereby amplifying ML intensity. However, this increase in CNT fraction also leads to enhanced light absorption within the device. Consequently, we observe a trend where ML intensity rises initially but declines beyond a CNT fraction of 0.0015 wt%. Based on these findings, we anticipate that our research will make valuable contributions to the advancement of electrical powerless mechanoluminescent technology.

• Applied Microscopy
• /
• 제45권2호
• /
• pp.37-43
• /
• 2015

In present work, work-hardening behavior of TiCu-based bulk metallic glass composite with B2 particles has been studied by systemic structural and mechanical investigations. After yield, pronounced work-hardening of the alloy was clearly exhibited, which was mainly related to the martensitic transformation as well as the deformation twinning in B2 particles during deformation. At the early plastic deformation stage (work-hardening stage), the stress-induced martensitic transformation from B2 phase to B19' phase and deformation-induced twinning of B19' phase was preferentially occurred in the around interface areas between B2 phase and amorphous matrix by stress concentration. The higher hardness value was observed in vicinity of interface within the B2 particles which are probably connected with martensitic transformation and deformation twinning. This reveals that the work-hardening phenomenon of this bulk metallic glass composite is a result of the hardening of B2 particles embedded in amorphous matrix.

• 소성∙가공
• /
• 제18권6호
• /
• pp.500-507
• /
• 2009

Tensile deformation behavior with different strain rate was investigated. $Zr_{56.2}Ti_{13.8}Nb_{5.0}Cu_{6.9}Ni_{5.6}Be_{12.5}$(bulk metallic glass alloy possessed crystal phase which was called $\beta$-phase of dendrite shape, mean size of $20{\sim}30{\mu}m$ and occupied 25% of the total volume) was used in this study. Maximum tensile strength was obtained as 1.74GPa at strain rate $10^2s^{-1}$ and minimum strength was found to be 1.6GPa at $10^{-1}s^{-1}$. And then, maximum plastic deformation occurred at the strain rate of $5{\times}10^{-2}s^{-1}$ and represented 1.75%, though minimum plastic deformation showed 0%. In the specific range of strain rate, relatively higher plastic deformation and lower ultimate tensile strength were found with lots of shear bands. The fractographical observation after tensile test indicated that vein like pattern on the fracture surface was well developed especially in the above range of strain rate.

• 한국재료학회지
• /
• 제20권9호
• /
• pp.472-477
• /
• 2010

$Al_2O_3$ has received wide attention with established use as a catalyst and growing application in structural or functional ceramic materials. On the other hand, the boehmite (AlO(OH)) obtained by sol-gel process has exhibited a decrease in surface area during phase transformation due to a decline in surface active site at high temperature. In this work, $Al_2O_3$-CuO/ZnO (ACZ) and $Al_2O_3$-CuO/CeO (ACC) composite materials were synthesized with aluminum isopropoxide, copper (II) nitrate hemi (pentahydrate), and cerium (III) nitrate hexahydrate or zinc (II) nitrate hexahydrate. Moreover, the Span 80 as the template block copolymer was added to the ACZ/ACC composition to make nano size particles and to keep increasing the surface area. The ACZ/ACC synthesized powders were characterized by Thermogravimetry-Differential Thermal analysis (TG/DTA), X-ray Diffractometer (XRD), Field-Emmision Scanning Electron Microscope (FE-SEM), Bruner-Emmett-Teller (BET) surface analysis and thermal electrical conductivity (ZEM-2:M8/L). An enhancement of surface area with the addition to Span 80 surfactant was observed in the ACZ powders from 105 $m^2$/g to 142 $m^2$/g, and the ACC powders from 103 $m^2$/g to 140 $m^2$/g, respectively.

• 한국분말재료학회지
• /
• 제27권4호
• /
• pp.333-338
• /
• 2020

In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu₃P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/㎠. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.351.1-351.1
• /
• 2016

While conventional electronic devices have been fabricated on the rigid and brittle Si based wafer as a semiconducting substrate, future devices are increasingly finding applications where flexibility and stretchability are further integrated to enable emerging and wearable devices. To achieve high flexibility and stretchability, various approaches are investigated such as polymer based conducting composite, thin metal films on the polymer substrate, and structural modifications for stretchable electronics. In spite of many efforts, it is still a challenge to identify a solution that offers both high stretchability and superior electrical properties. In this paper, we introduce a highly stretchable entangled-mesh graphene showing a potential to address such requirements as stretchability and good electrical performance. Entangle-mesh graphene was synthesized by CVD graphene on the Cu foil. To analyze the mechanical properties of entangled-mesh graphene, endurance and stretching tester have been used.

• 한국표면공학회지
• /
• 제36권4호
• /
• pp.347-355
• /
• 2003

Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

• 한국분말재료학회지
• /
• 제14권4호
• /
• pp.230-237
• /
• 2007

The fabrication of Fe alloy-40 wt.%TiC composite materials using spark plasma sintering process after ball-milling was studied. Raw powders to fabricate Fe alloy-TiC composite were Fe alloy, $TiH_{2}$ and activated carbon. Fe alloy powder was Distaloy AE (4%Ni-1%Cu-0.5%Mo-0.01%C-bal.%Fe) made by Hoeganes company with better toughness and lower melting point. These powders were ball-milled in horizontal attrition ball mill at a ball-to-powder weight ratio of 30 : 1. After that, these mixture powders were sintered by using spark plasma sintering apparatus for 5 min at $1200-1275^{\circ}C$ in vacuum atmosphere under $10^{-3}$ torr. DistaloyAE-40 wt.%TiC composite was directly synthesized by dehydrogenation and carburization reaction during sintering process. The phase transformation of as-milled powders and sintered materials was confirmed using X-ray diffraction (XRD) and transmission electron microscope (TEM). The density and harness materials was measured in order to confirm the densification behavior. In case of DistaloyAE-40 wt.%TiC composite retained for 5 min at $1275^{\circ}C$, it has the relative density of about 96% through the influence of rapid densification and fine TiC particle reinforced Fe-based composites materials.