• Korean Journal of Materials Research
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• v.26 no.7
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• pp.376-381
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• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

• Journal of the Korean institute of surface engineering
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• v.41 no.3
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• pp.109-113
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• 2008

High strength 7xxx series Al-Zn-Mg alloy have been investigated for using light weight automotive parts especially for bump back beam. The composition of commercial 7xxx aluminum has the Zn/Mg ratio about 3 and Cu over 2 wt%, but this composition isn't adequate for appling to automotive bump back beam due to its high resistance to extrusion and bad weldability. In this study the Zn/Mg ratio was increased for better extrusion and Cu content was reduced for better welding. With this new composition we investigated the effect of composition on the resistivity against stress corrosion cracking. As the Zn/Mg ratio is increased fracture energy obtained by slow strain rate test was decreased, which means degradation of SCC resistance. While the fracture energy was increased with Cu contents although it is below 1%, which means improvement of SCC resistance. These effects of composition change on the SCC resistivity were identified by observing the fracture surface and crack propagation.

• Journal of Korea Foundry Society
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• v.30 no.4
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• pp.137-141
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• 2010

The effects of Zn amounts on the castability and tensile properties of Al-Zn-Mg-Cu alloys were investigated for development of high strength die casting aluminium alloys. Al-Zn-Mg-Cu alloys with 3.5% Zn showed high cast cracking tendency and poor mold filling behaviour. Al-Zn-Mg-Cu alloys with 5wt% Zn and 7wt% Zn had the tensile strengths of 300~400MPa and the elongations of 2~18%. The effect of Zn on the tensile strength of Al-Zn-Mg-Cu alloys was insignificant, but Al-Zn-Mg-Cu alloy with high Zn amount had lower elongation.

• Journal of the Korean institute of surface engineering
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• v.27 no.4
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• pp.223-233
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• 1994

It is well known that compositionally modulated Cu-Ni alloy can be produced by an electrochemical method in Ni sulfate solution containing trace amount of Cu. a mathematical model is presented to describe the current distribution and weight percent of Cu in Ni layer on the rotating disk electrode. The model includes convective-diffusion equation, the Laplace's equation and various overpotentials, and is solved numerically. The thickness of Cu layer is almost uniform whereas the thickness of Ni layer as well as the Ni/Cu weight ratio are increased approaching to the edge of the disk. These results agree well with the experimental values. The ohmic potential drop is suggested as a major cause of a nonuniformity in Ni layer. The optimum plating condition for the fabrication of susperlattice is proposed based on the results of this study.

• Journal of the korean Society of Automotive Engineers
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• v.10 no.4
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• pp.85-96
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• 1988

The optimum cutting condition for rake angle in turning was investigated in (6-4) Brass and Al alloy. Results of experiments in (6-4) Brass and Al alloy are as follow. Specific cutting resistance becames higher as the depth of cutting, feed or cutting velocity decreases at same rake angle and resistance appear low value 20.deg., 25.deg.(6-4)brass, 0.deg. 20.deg.(Al alloy). The optimum cutting condition for(6-4) Brass is depth of cutting 0.5mm, rake angle 25.deg., cutting velocity 80m/min, feed 0.1mm/rev and for Al alloy is depth of cutting 0.1mm, rake angle 0.deg., cutting velocity 200m/min, feed 0.5mm/rev. The rake angle for good roughness is 20.deg. at (6-4) Brass, and that for Al alloy is 15.deg. The roughness is influenced by feed and it has the lowest value at 0.1mm/rev and the cutting condition is influenced by rake angle only.

• Journal of the Korean Magnetics Society
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• v.12 no.1
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• pp.30-33
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• 2002

The Effects of Co-substitution in the nanocrystalline Nd-Fe-B-Mo-Cu alloys were investigated. $\alpha$-Fe based nanocrystalline Nd-Fe-B-Mo-Cu alloys were prepared by crystallization process of amorphous Nd-Fe-B-Mo-Cu alloy produced by rapid solidification process. The substitution of Co resulted in the decrease of grain size and improves the hard magnetic properties. The remanence, coercivity, and Curie temperature of nanocrystalline N $d_4$(F $e_{0.85}$ $Co_{0.15}$)$_{82}$ $B_{10}$M $o_3$Cu alloy showed more improved magnetic properties than those of Co-free alloy. The grain size was measured to be about 15 nm. The coercivity, remanence and maximum energy product were 239 kA/m, 1.41, and 103.5 kJ/ $m^3$, respectively, for the nanocrystalline N $d_4$(F $e_{0.85}$ $Co_{0.15}$)$_{82}$ $B_{10}$M $o_3$Cu alloy annealed for 0.6 ks at 640 $^{\circ}C$.

• Korean Journal of Materials Research
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• v.23 no.4
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• pp.227-232
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• 2013

Al-based alloys have recently attracted considerable interest as structural materials and light weight materials due to their excellent physical and mechanical properties. For the investigation of the potential of Al-based alloys, a surface porous $Al_{88}Cu_6Si_6$ eutectic alloy has been fabricated through a chemical leaching process. The formation and microstructure of the surface porous $Al_{88}Cu_6Si_6$ eutectic alloy have been investigated using X-ray diffraction and scanning electron microscopy. The $Al_{88}Cu_6Si_6$ eutectic alloy is composed of an ${\alpha}$-Al dendrite phase and a single eutectic phase of $Al_2Cu$ and ${\alpha}$-Al. We intended to remove only the ${\alpha}$-Al phase and then the $Al_2Cu$ phase would form a porous structure on the surface with open pores. Both acidic and alkaline aqueous chemical solutions were used with various concentrations to modify the influence on the microstructure and the overall chemical reaction was carried out for 24 hr. A homogeneous open porous structure on the surface was revealed via selective chemical leaching with a $H_2SO_4$ solution. Only the ${\alpha}$-Al phase was successfully leached while the morphology of the $Al_2Cu$ phase was maintained. The pore size was in a range of $1{\sim}5{\mu}m$ and the dealloying depth was nearly $3{\mu}m$. However, under an alkaline NaOH, aqueous solution, an inhomogeneous porous structure on the surface was formed with a 5 wt% NaOH solution and the morphology of the $Al_2Cu$ phase was not preserved. In addition, the sample that was leached by using a 7 wt% NaOH solution crumbled. Al extracted from the Al2Cu phase as ${\alpha}$-Al phase was dealloyed, and increasing concentration of NaOH strongly influenced the morphology of the $Al_2Cu$ phase and sample statement.

• Applied Microscopy
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• v.37 no.2
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• pp.123-133
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• 2007

The strain fields due to precipitates, especially S-phase $(Al_2CuMg)$ particles in Al-2.5Cu-1.5Mg wt.% alloy were first investigated with Large Angle Convergent Beam Electron Diffraction (LACBED) method. The work involves LACBED pattern simulations to estimate possibly the strength of the strain fields. To do this the morphology of S-particle was optimized as a cylindrical shape with $a_s$ axis, and the displacement vector of strain fields was assumed to be perpendicular to $a_s$ axis. With this simple model the reasonable fittings between the observed patterns of the strain fields and simulations were obtained. And in the early aging stage of the alloy the significant strain fields were not observed. As a result of this study it is expected that the strain fields due to S-phase precipitates in the stage with maximum hardness would make a complex networks to possibly contribute to hardiness of the alloy.

• Journal of Electrochemical Science and Technology
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• v.11 no.2
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• pp.172-179
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• 2020

The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of gold with the cartage of 18K and other standard karats that should be observed in the manufacturing of the gold and jewelry artifacts, comparing the rate of gold-copper deposition by direct and pulsed current was done. The rate of deposition with pulse current was significantly higher than direct current. In this process, the duty cycle parameter was effectively optimized by the "one factor at a time" method to achieve maximum deposition rate. Particular parameters in this work were direct and pulse current densities, bath temperature, concentration of gold and cyanide ions in electrolyte, pH, agitation and wetting agent additive. Scanning electron microscopy (SEM) and surface chemical analysis system (EDS) were used to study the effect of deposition on the cross-sections of the formed layers. The results revealed that the Au-Cu alloy layer formed with concentrations of 6gr·L^-1 Au, 55gr·L^-1 Cu, 24 gr·L^-1 KCN and 1 ml·L^-1 Lauryl dimethyl amine oxide (LDAO) in the 0.6 mA·cm^-2 average current density and 30% duty cycle, had 0.841 ㎛·min^-1 Which was the highest deposition rate. The use of electrodeposition of pure and alloy gold thick layers as a production method can reduce the use of gold metal in the production of hallow gold artifacts, create sophisticated and unique models, and diversify production by maintaining standard karats, hardness, thickness and mechanical strength. This will not only make the process economical, it will also provide significant added value to the gold artifacts. By pulsating of currents and increasing the duty cycle means reducing the pulse off-time, and if the pulse off-time becomes too short, the electric double layer would not have sufficient growth time, and its thickness decreases. These results show the effect of pulsed current on increasing the electrodeposition rate of Au-Cu alloy confirming the previous studies on the effect of pulsed current on increasing the deposition rate of Au-Cu alloy.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.47-52
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• 1996

Cl-based gas chemistry is generally used to etching for al alloy metallization. After the etching of Al alloy with Cl-based gas plasma, residual chlorine on Al alloy reacts with H$_{2}$O due to air exposure and results in Al corrosion. In this study, the corrosion phenomena of Al wer examined with XPS(X-ray photoelectron spectroscopy) and SEM (scanning electorn microscopy). It was confirmed that chlorine mainly existed at the grian boundary of Al alloy after plasma etching of Al alloy with cl-based gas chemistry and Al corrosion was largely generated at the grain boundary of Al alloy. And residual chlorine was passivated by sulfur and fluorine which were generated by SF$_{6}$ plasma. These effects of passivation reduced the Al corrosion due to air exposure.