• Applied Chemistry for Engineering
• /
• v.35 no.1
• /
• pp.1-7
• /
• 2024

Mn-M/Al₂O₃ (M = Cu, Fe, Co, and Ce) catalysts were prepared for simultaneous oxidation of NO, CO, and CH₄, and their oxidation activities were compared. The Mn-Cu/ Al₂O₃ catalyst with the best simultaneous oxidation activity was characterized by XRD, Raman, XPS, and O₂-TPD analysis. The result of XRD indicated that Mn and Cu existed as complex oxides in the Mn-Cu/Al₂O₃ catalyst. Raman and XPS results showed that electron transfer between Mn ions and Cu ions occurred during the formation of the Mn-O-Cu bond in the Mn-Cu/Al₂O₃ catalyst. The XPS O 1s and O₂-TPD analyses showed that the Mn-Cu/Al₂O₃ catalyst has more adsorbed oxygen species with high mobility than the Mn/Al₂O₃ catalyst. The high simultaneous oxidation activity of the Mn-Cu/Al₂O₃ catalyst is attributed to these results. Gas-phase NO promotes the oxidation reactions of CO and CH₄ in the Mn-Cu/Al₂O₃ catalyst while suppressing the NO oxidation reaction. These results were presumed to be because the oxidized NO was used as an oxidizing agent for CO and CH₄. On the other hand, the oxidation reactions of CO and CH₄ competed on the Mn-Cu/Al₂O₃ catalyst, but the effect was not noticeable because the catalyst activation temperature was different.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.10 no.1
• /
• pp.36-41
• /
• 2000

We studied the exchange anisotropy of Ni-Fe/Co-Fe/Mn-Ir/Cu/buffer/Si multilayers using D.C magnetron sputtering technique. Generally, Ni-Fe/Mn-Ir/buffer(Cu)/Si multilayers cannot pin the ferromagnetic layer for the lower exchange biased field. We got $H_{ex}$ ex/ increased by two times, after using Cu/Ta as buffer layer to get larger grain size of Mn-Ir layer and inserting very thin Co-Fe layer between the Ni-Fe layer and the Mn-Ir layer to get improved grain-to-grain epitaxy relation at the interface between Ni-Fe layer and Mn-Ir layer. The variation of $H_{ex}$ by thickness of Mn-Ir layer in ferromagnete/Mn-Ir/buffer/Si multilayers is different to that in Mn-Ir/ferromagnete/buffer/Si multilayers, because the volume distribution of grain size of Mn-Ir layer and the exchange energy at the interface between the Mn-Ir and the ferromagnetic layers is different for stacking sequence.

• Journal of the Korean Magnetics Society
• /
• v.12 no.1
• /
• pp.24-29
• /
• 2002

It was observed that exchange bias field was increased with smooth surface and better ${\gamma}$-FeMn formation. Sputtering conditions were varied for the control of the surface roughness and ${\gamma}$-FeMn formation. From the results of Cu deposition as underlayer, it was found that ${\gamma}$-FeMn formation was closely related with the thickness of underlayer. After heat treatment, exchange bias field was increased over three times. This improvement was likely that the crystallites of ${\gamma}$-FeMn were well formed. In Co/Cu/Co/FeMn spin valve structure, magnetoresistance was increased over 1.4 times through the heat treatment. This was due to the disappearance of Co/Cu intermixed dead layer and removal of defect, and this was examined by AES analysis.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.229-229
• /
• 2010

With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.6
• /
• pp.376-380
• /
• 2017

In this paper, we prepared a metal alloy resistor with stable thermal electro motive force (thermal EMF) as well as a low temperature coefficient of resistance (TCR) by adjusting the manganese proportion from 3 to 12 wt% in the Cu-Mn-Ni alloy. Composition of the fabricated metal alloy was investigated using energy dispersive X-ray (EDX) analysis. The TCR of each sample was measured as 44.56, 40.54, 35.60, and 31.56 ppm for Cu-3Mn-2Ni, Cu-5Mn-2Ni, Cu-10Mn-2Ni, and Cu-12Mn-2Ni, respectively. All the resistor samples were available for the F grade (${\pm}1%$ of the allowable error of resistance) high-precision resistor. All the samples satisfied the baseline of high thermal EMF (under 3 mV at $60^{\circ}C$); however, Cu-3Mn-2Ni and Cu-5Mn-2Ni satisfied the baseline of low thermal EMF (under 0.3 mV at $25^{\circ}C$). We were thus able to design and fabricate the metal alloy resistor of Cu-3Mn-2Ni and Cu-5Mn-2Ni to have low TCR and stable thermal EMF at the same time.

• Journal of The Korean Society of Grassland and Forage Science
• /
• v.24 no.1
• /
• pp.11-20
• /
• 2004

This pot experiment was conducted to investigate the effects of combined micronutrient application($T_1$;control, $T_2$; Fe, $T_3$; Fe＋Mn, $T_4$: Fe＋Mn＋Cu, $T_5$ ; Fe＋Mn＋Cu＋Zn, $T_6$ ; Fe＋Mn＋Cu＋Zn＋Mo, $T_7$ ;Fe＋Mn＋Cu＋Zn＋Mo＋B) on forage performance of pure and mixed cultures of orchardgrass and white clover. This 4th part was related to the changes in the contents of micronutrients(Fe, Mn, Cu, Zn, Mo, and B) in forages. The results obtained are summarized as follows: 1. General differences have been showed in the contents of micronutrients based on the treatments, forage species, pure/mixed culture, cutting order, and additional fertilization, especially N. Compared to pure culture, orchardgrass showed relatively high contents of Mn and Zn, and low contents of B and Fe in mixed culture. White clover, however, tended to be exactly opposed to the above trends. The contents of Cu and Mo did not show any differences between pure and mixed cultures. 2. In relative comparison, the $T_7$ influenced negatively on the contents of Cu, Zn, and Mo in orchardgrass. The $T_7$ also influenced negatively on the contents of Mo in white clover. However, the $T_7$ influenced positively on the contents of Mn in orchardgrass, and also influenced positively on the contents of Fe, Mn, and Cu in white clover. Because of the antagonism between Fe and Mn, the Fe contents in both forages were significantly decreased by the $T_3$. Under the various conditions, the differences among Fe contents tended to be more significant in white clover than in orchardgrass. 3. At the $T_6$ and $T_7$, the Mo contents in both forages tended to be relatively high. The Mo contents, however, were somewhat decreased by the $T_7$ 7/. The Mo-toxicity, which was caused by the high Mo-contents, tended to be diminished, and was likely to be prevented by the optimum B/Mo ratio and B application($T_7$ ).

• Journal of The Korean Society of Grassland and Forage Science
• /
• v.24 no.3
• /
• pp.193-200
• /
• 2004

This pot experiment was conducted to investigate the effects of systematic variation application of Fe, Mn, Cu, and Zn on forage performance of orchardgrass and white clover. The treatments of systematic variation were 0/100, 25/75, 50/50, 75/25, and $100/0\%$ in the Fe/Cu(trial-1), Mn/Zn(trial-2), and Fe+Cu/Mn+Zn(trial-3), respectively. The treatments of Fe/Mn/Cu/Zn(trial-4) were composed of $70\%$ in main element and $10\%$ in other 3 elements, respectively. 1. By the systematic variations of Fe, Mn, Cu, and Zn, the yields were more significantly influenced in white clover than in orchardgrass. In addition, the yields of white clover were closely correlated to the trends of root/nodule growth and flowering. In the Fe/Cu trial, the relatively high yields were obtained at the $100/0\%$ in orchardgrass and at the $75/25\%$ in white clover. The yields of white clover were more negatively influenced by the 100/0(Cu control) than by the 0/100(Fe control). The yields of orchardgrass, however, tended to be opposite to the above trends. 2. In the Mn/Zn trial, both forages showed generally high yields at the high ratios of Mn/Zn. Compared with orchardgrass, the yields of white clover were greatly decreased by the Mn-deficiency(low ratio of Mn/Zn). The effects of Zn on forage yields, however, were not recognized. 3. In the Fe+Cu/Mn+Zn trial, the yields of orchardgrass tended to be slightly different among the treatments. The yields of white clover, however, were relatively' high at the 75/25, and showed a severe decrease at the 100/0 in the 2nd half cuts. In the Fe/Mn/Cu/Zn trial, the yields of white clover tended to be relatively high at the Cu and Zn treatments. It was likely to be caused by the balanced Fe/Mn ratio.

• Journal of The Korean Society of Grassland and Forage Science
• /
• v.24 no.2
• /
• pp.93-104
• /
• 2004

This pot experiment was conducted to investigate the effects of combined micronutrient application($T_1$; control, $T_2$; Fe, $T_3$; Fe+Mn, $T_4$; Fe+Mn+Cu, $T_5$ ; Fe+Mn+Cu+Zn, $T_6$ ; Fe+Mn+Cu+Zn+Mo, T$_{7}$; Fe+Mn+Cu+Zn + Mo + B) on forage performance of pure and mixed cultures of orchardgrass and white clover. The fifth part was concerned with the changes in the total and relative contents, uptake amounts, and mutual ratios. of micronutrients in forages. The results obtained are summarized as follows: 1. The relative contents(total contents of 6 micronutrients = 100%) of Fe and Mn were considerably influenced by the antagonism between Fe and Mn, and also were influenced by the differences in Mn-absorption between orchardgrass and white clover. Compared with pure culture, orchardgrass showed high relative contents of Mn, and low relative contents of Fe and B in mixed culture. White clover, however, tended to be exactly opposed to the above trends. In relative contents, the T$_6$ 6/ resulted generally in decrease of Fe. However the $T_7$ resulted in increase of Mn and B. In addition, the $T_7$ resulted in decrease of Cu and Zn in orchardgrass, and Mo in white clover. 2. In general, there were differences in the tendency between the yield changes and the uptake amounts of micronutrients. General differences have been showed in the uptake amounts and mutual ratios of micronutrients based on the forage species, pure/mixed culture, additional fertilization, and antagonism. The uptake amounts of total micronutrients were generally increased by the treatments with increased combination. In uptake amounts, the $T_7$ resulted in the increase of Mn and B, and decrease of Mo. 3. The mutual ratios of Fe/Mn, Fe/Cu, and Mn/Cu were considerably influenced by the antagonism between Fe and Mn. At the $T_7$ , very low ratio of Fe/Mo affected by the T6 tended to be somewhat improved because of the decrease of Mo content． The poor growth of forages at the $T_6$ was improved by the $T_7$ . This fact was likely to be caused by the adequate B/Mo ratio.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.1193-1196
• /
• 2009

Low resistivity interconnection and high-mobility channel are required to realize ultrahigh-definition LCDs such as 4k ${\times}$ 2k TVs. We evaluated fully Cu-based gate and Source/Drain interconnections, consisting of stacked pure-Cu/Cu-Mn layers for TFT-LCDs, and found the underlying Cu-Mn alloy film has superior adhesion to glass substrates and CVD-SiOx films. It was also confirmed that wet etching of the Cu/Cu-Mn films without residues and low contact resistance with both channel IGZO and pixel ITO films can be obtained. It is thus considered that the stacked Cu/Cu-Mn structure is one of candidates to replacing conventionally pure-Cu/refractory metal.

• Applied Microscopy
• /
• v.45 no.1
• /
• pp.9-15
• /
• 2015

In the present study, microstructural evolution in CuCrFeNi, CuCrFeNiMn, and CuCrFeNiMnAl alloys has been investigated. The as-cast CuCrFeNi alloy consists of a single fcc phase with the lattice parameter of 0.358 nm, while the as-cast CuCrFeNiMn alloy consists of (bcc+fcc1+fcc2) phases with lattice parameters of 0.287 nm, 0.366 nm, and 0.361 nm. The heat treatment of the cast CuCrFeNiMn alloy results in the different type of microstructure depending on the heat treatment temperature. At $900^{\circ}C$ a new thermodynamically stable phase appears instead of the bcc solid solution phase, while at $1,000^{\circ}C$, the heat treated microstructure is almost same as that in the as-cast state. The addition of Al in CuCrFeNiMn alloy changes the constituent phases from (fcc1+fcc2+bcc) to (bcc1+bcc2).