• 제목/요약/키워드: Cu-Cu bonding

검색결과 338건 처리시간 0.025초

입자 사이즈에 따른 Cu 필름의 에어로졸 성막 거동에 대한 연구 (Study on Aerosol Deposition Behavior of Cu Films According to Particle Size)

  • 이동원;오종민
    • 한국전기전자재료학회논문지
    • /
    • 제30권4호
    • /
    • pp.235-240
    • /
    • 2017
  • The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.

산화그래핀을 적용한 고반응성 Al/CuO 나노복합재 제조 및 분석 (Fabrication and Characterization of Highly Reactive Al/CuO Nano-composite using Graphene Oxide)

  • 임예슬
    • 한국분말재료학회지
    • /
    • 제26권3호
    • /
    • pp.220-224
    • /
    • 2019
  • The aluminum (Al)/copper oxide (CuO) complex is known as the most promising material for thermite reactions, releasing a high heat and pressure through ignition or thermal heating. To improve the reaction rate and wettability for handling safety, nanosized primary particles are applied on Al/CuO composite for energetic materials in explosives or propellants. Herein, graphene oxide (GO) is adopted for the Al/CuO composites as the functional supporting materials, preventing a phase-separation between solvent and composites, leading to a significantly enhanced reactivity. The characterizations of Al/CuO decorated on GO(Al/CuO/GO) are performed through scanning electron microscopy, transmission electron microscopy, and energy dispersive X-ray spectroscopy mapping analysis. Moreover, the functional bridging between Al/CuO and GO is suggested by identifying the chemical bonding with GO in X-ray photoelectron spectroscopy analysis. The reactivity of Al/CuO/GO composites is evaluated by comparing the maximum pressure and rate of the pressure increase of Al/CuO and Al/CuO/GO. The composites with a specific concentration of GO (10 wt%) demonstrate a well-dispersed mixture in hexane solution without phase separation.

삽입금속 Cu를 적용한 TiAl 합금과 SCM440의 마찰용접 계면의 나노역학물성 평가 (Evaluating Nanomechanical Properties on Interface of Friction-welded TiAl and SCM440 Alloys with Cu as an Insert Metal)

  • 김기영;오명훈;최인철
    • 열처리공학회지
    • /
    • 제34권6호
    • /
    • pp.309-314
    • /
    • 2021
  • Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

A novel low resistivity copper diffusion joint for REBa2Cu3O7-δ tapes by thermocompression bonding in air

  • Wei, Ren;Zhen, Huang;Fangliang, Dong;Yue, Wu;Zhijian, Jin
    • 한국초전도ㆍ저온공학회논문지
    • /
    • 제24권4호
    • /
    • pp.16-24
    • /
    • 2022
  • Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

Zr계 비정질 삽입재를 이용한 Ti-Cu 이종 접합부의 미세조직 형성에 미치는 확산 열처리 온도의 영향 (Effect of the Heat Treatment Temperature on the Brazed Microstructure of Dissimilar Ti and Cu Metals Using a Zr-Base Amorphous Filler)

  • 이정구;이종극;이민구;이창규
    • 열처리공학회지
    • /
    • 제20권1호
    • /
    • pp.17-21
    • /
    • 2007
  • In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

WC-Co/Cu/SM45C강접합에 미세조직 및 접합강도에 미치는 냉각속도의 영향 (Effects of cooling rate on Microstructure and Bond Strength in WC-Co/Cu/SM45C steel joint)

  • 정승부;양훈모
    • Journal of Welding and Joining
    • /
    • 제17권2호
    • /
    • pp.104-111
    • /
    • 1999
  • The interfacial microstructure and bond strength were examined for WC-Co/Cu/SM45C steel join using a nickel-plated copper in vacuum at 1323K for 0.6ks∼3.6ks. After bonding, microstructure in bonding interface was observed by OM(Optical Microscopy), SEM(Scanning Electron Microscopy) and EPMA(Eelectron Probe Micro Analyzer). The oil cooling was carried out at 353K, the cooling rate in air and furnace was 22K/s and 4.4K/s. respectively. It was found that dendritic widths increased with the content of cobalt and bonding times at 1323K. As a whole, bond strength values at the same bonding condition decreased in this order: WC-13wt.%Co/SM45Csteel. WC-8wt.%Co/SM45Csteel and WC-4wt.%Co/SM45Csteel. The bond strength of WC-13wt.%Co/S45C steel joint in oil cooling was 273MPa. This value was greatly higher than those of 125MPa in furnace cooling and 93MPa in air cooling at 1323K for 0.6ks. The bond strength values were found to be closely associated with the content of cobalt in WC-Co and cooling rate.

  • PDF

THIN FILM ADHESION IN Cu/Cr/POLYIMIDE AND Cu/Cu-Cr/POLYIMIDE SYSTEMS

  • Joh, Cheol-Ho;Kim, Young-Ho;Oh, Tae-Sung;Park, Ik-Sung;Yu, Jin
    • 한국표면공학회지
    • /
    • 제29권5호
    • /
    • pp.379-385
    • /
    • 1996
  • Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

  • PDF

포름산 혼합 나노섬유 성장 구리마이크로입자를 이용한 구리 소결 페이스트 합성 (Synthesis of Cu Sintering Paste Using Growth of Nanofiber on Cu Microparticles Mixed with Formic Acid)

  • 전영운;장지웅
    • 공업화학
    • /
    • 제35권2호
    • /
    • pp.96-99
    • /
    • 2024
  • 구리 마이크로입자의 표면을 나노섬유형태의 포름산구리로 합성하고 포름산과 혼합하여 구리판을 접합할 수 있는 소결 페이스트를 합성하였다. 평균 10 ㎛의 구리 마이크로입자는 400 ℃ 이상에서 표면이 산화구리 나노섬유로 합성되고 포름산과 혼합하여 표면이 포름산화된 구리 마이크로입자가 합성된다. 포름산구리는 구리 벌크입자나 나노입자의 녹는점에 비해 낮은 온도인 210 ℃에서 구리로 분해되어 저온 소결로 구리판의 접합이 가능하다. 표면을 나노섬유 형태로 제어하여 표면적을 높여 포름산구리로의 반응속도, 응집에 필요한 접촉면적, 포름산구리의 분해속도 등이 증가하여 짧은 시간에 소결할 수 있도록 하였다.

냉간 및 온간에서의 구리와 알루미늄 압접에 관한 실험적 연구 (Experimental Study on Pressure Welding of Cu and Al at Cold and Warm Temperatures)

  • 심경섭;김용일;장성동;김원술;이용신
    • 한국소성가공학회:학술대회논문집
    • /
    • 한국소성가공학회 2003년도 추계학술대회논문집
    • /
    • pp.225-228
    • /
    • 2003
  • This paper is concerned with pressure welding, which has been known as a main bonding mechanism for the cold and warm clad forming. Bonding characteristics of pressure welding between the copper and aluminum plates are experimentally investigated. Experiments are performed at the cold and warm temperature range with the variation of important factors such as magnitude of pressure, surface roughness of Cu and Al plates, and pressure holding time. It could be concluded that the bonding criterion might be given as a function of bonding pressure and surface roughness for the cold and warm temperature ranges.

  • PDF