• 한국건설순환자원학회논문집
• /
• 제9권3호
• /
• pp.338-347
• /
• 2021

본 논문은 층간 보강재를 보강한 3D 프린팅 콘크리트의 부착강도를 평가하기 위해 수행되었다. 겹침이음 길이에 따라 두 종류의 층간 보강 방법을 고려하였다. 첫 번째 방법은 층간 보강재의 겹침이음을 하지 않았으며, 두 번째 방법은 40mm의 겹침이음을 고려하였다. 또한, 기건양생 조건과 수중양생 조건의 서로 다른 양생 조건을 고려하였다. 실험 변수를 고려하여 3D 프린팅 콘크리트 시편의 압축강도, 쪼갬인장강도 및 휨인장강도를 세가지 하중 방향에서 측정하였다. 압축강도, 쪼갬인장강도 및 휨인장 강도는 하중방향에 영향을 받았다. 특히 3D 프린팅으로 제작한 콘크리트 시편의 층간 부착면에 인장력이 작용하면 쪼갬인장강도 및 휨인장강도가 크게 감소하였다. 그러나 층간 보강재가 보강된 층의 종방향으로 하중이 가해질 때, 프린팅된 시편의 휨인장강도 또는 부착강도는 크게 증가하였다. 또한 기건양생 조건의 휨인장강도 또는 부착강도는 감소하였으며, 기건 양생 조건에 의해 더 많은 공극의 형성을 유발하여 하중에 더 취약해지는 것으로 나타났다.

• 마이크로전자및패키징학회지
• /
• 제25권2호
• /
• pp.1-8
• /
• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.130-131
• /
• 2013

Nanostructured oxides are widely used in heterogeneous catalysis where their catalytic properties are closely associated with the size and morphology at nanometer level. The effect of particle size has been well decumented in the past two decades, but the shape of the nanoparticles has rarely been concerned. Here we illustrate that the redox and acidic-basic properties of oxides are largely dependent on their shapes by taking $Co_3O_4$, $Fe_2O_3$, $CeO_2$ and $La_2O_3$ nanorods as typical examples. The catalytic activities of these rod-shaped oxides are mainly governed by the nature of the exposed crystal planes. For instance, the predominant presence of {110} planes which are rich in active $Co^{3+}$ on $Co_3O_4$ nanorods led to a much higher activity for CO oxidation than the nanoparticles that mainly exposed the {111} planes. The simultaneous exposure of iron and oxygen ions on the surface of $Fe_2O_3$ nanorods have significantly enhanced the adsorption and activation of NO and thereby promoted the efficiency of DeNOx process. Moreover, the exposed surface planes of these rod-shaped oxides mediated the reaction performance of the integrated metal-oxide catalysts. Au/$CeO_2$ catalysts exhibited outstanding stability under water-gas shift conditions owing to the strong bonding of gold particle on the $CeO_2$ nanorods where the formed gold-ceria interface was resistant towards sintering. Cu nanoparticles dispersed on $La_2O_3$ nanorods efficiently catalyzed transfer dehydrogenation of primary aliphatic alcohols based on the uniue role of the exposed {110} planes on the support. Morphology control at nanometer level allows preferential exposure of the catalytically active sites, providing a new stragegy for the design of highly efficient nanostructured catalysts.

• 한국분말재료학회지
• /
• 제13권5호
• /
• pp.321-326
• /
• 2006

Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits fur the use in a variety of microelectronic applications. For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different thermal expansion coefficients of semiconductor chips and packaging materials. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers. The advantages of carbon nanofibers, especially the good thermal conductivity, are utlized to obtain a composite material having a thermal conductivity higher than 400 W/mK. The main challenge is to obtain a homogeneous dispersion of carbon nanofibers in copper. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed. In order to improve the bonding strength between copper and nanofibers, different alloying elements were added. The microstructure and the properties will be presented and the influence of interface modification will be discussed.

• 마이크로전자및패키징학회지
• /
• 제20권4호
• /
• pp.47-52
• /
• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• 한국전기전자재료학회논문지
• /
• 제29권4호
• /
• pp.237-240
• /
• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

• 한국표면공학회지
• /
• 제46권1호
• /
• pp.9-15
• /
• 2013

The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.

• Carbon letters
• /
• 제21권
• /
• pp.68-73
• /
• 2017

We have demonstrated the production of thin films containing multilayer graphene-coated copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs were produced by electrical wire explosion, an easily applied technique for creating hybrid metal nanoparticles. The nanoparticles had average diameters of 10-120 nm and quasi-spherical morphologies. We made a complex-electrodeposited copper thin film (CETF) with a thickness of $4.8{\mu}m$ by adding 300 ppm MGCNs to the electrolyte solution and performing electrodeposition. We measured the electric properties and performed corrosion testing of the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate the number of layers in the graphene films. The resistivity of the bare-electrodeposited copper thin film (BETF) was $2.092{\times}10^{-6}{\Omega}{\cdot}cm$, and the resistivity of the CETF after the addition of 300 ppm MGCNs was decreased by 2% to ${\sim}2.049{\times}10^{-6}{\Omega}{\cdot}cm$. The corrosion resistance of the BETF was $9.306{\Omega}$, while that of the CETF was increased to 20.04 Ω. Therefore, the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or semiconductor devices on the basis of its low resistivity and high corrosion resistance.

• ETRI Journal
• /
• 제38권5호
• /
• pp.981-987
• /
• 2016

We present a cost-effective dual polarization quadrature phase-shift coherent receiver module using a silica planar lightwave circuit (PLC) hybrid assembly. Two polarization beam splitters and two $90^{\circ}$ optical hybrids are monolithically integrated in one silica PLC chip with an index contrast of $2%-{\Delta}$. Two four-channel spot-size converter integrated waveguide-photodetector (PD) arrays are bonded on PD carriers for transverse-electric/transverse-magnetic polarization, and butt-coupled to a polished facet of the PLC using a simple chip-to-chip bonding method. Instead of a ceramic sub-mount, a low-cost printed circuit board is applied in the module. A stepped CuW block is used to dissipate the heat generated from trans-impedance amplifiers and to vertically align RF transmission lines. The fabricated coherent receiver shows a 3-dB bandwidth of 26 GHz and a common mode rejection ratio of 16 dB at 22 GHz for a local oscillator optical input. A bit error rate of $8.3{\times}10^{-11}$ is achieved at a 112-Gbps back-to-back transmission with off-line digital signal processing.

• 한국재료학회지
• /
• 제19권7호
• /
• pp.349-355
• /
• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.