• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.69-74
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• 2017

Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

• Korean Journal of Optics and Photonics
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• v.17 no.4
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• pp.354-358
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• 2006

A silicon lens and an insulator of pyrex, components of a micro-electron column, should be assembled by aligning and stacking simultaneously. An optical alignment of a diffraction beam and a laser welding were employed for the assembly of a source lens and an Einzel lens with precision within $\pm$4% for the maximum aperture size. The experimental condition for optical alignment and laser welding are explained. Anodic bonding was used to assist in stacking lenses. A micro-electron column of smaller apertures assembled with precise alignment and fabrication was tested with a current image of a Cu grid of 9$\mu$m in linewidth, and showed a higher resolution in acceleration mode.

• Fashion & Textile Research Journal
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• v.9 no.1
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• pp.119-123
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• 2007

Dyeing properties of soybean fabrics on gromwell colorants were studied for the effect of dyeing conditions, such as colorants concentration, temperature, time and pH on the dye uptake and effect of mordants on color change, dye uptake and various colorfastness. Antimicrobial activity of soybean fabrics dyed and sim-mordanted with gromwell colorants was examined by shake flask method. Gromwell colorants showed considerably affinity to soybean fabric and its isotherm adsorption curve was Freundlich type. Therefore, it is considered that hydrogen bonding and Van der Waals force were involved in the adsorption of gromwell colorants to soybean fabric. Soybean fabrics showed R color on Al, Cu and Sn mordant, RP color on Cr and Fe mordant, but soybean fabrics showed low dye uptake depending on mordanting treatment. Light colorfastness was increased for Cr and Fe mordants. Staphylococcus aureus reduction rates were above 90% for Cr and Cu mordanted soybean fabrics, and the others were poor. Klebsiella pneumoniae reduction rates soybean fabrics did not show reduction rate hardly.

• Textile Coloration and Finishing
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• v.19 no.4
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• pp.10-17
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• 2007

Chitosan(CS) and cellulose acetate(CA) composite films were prepared using formic acid as a cosolvent by casting, solvent evaporating and neutralization method. This study examines if the blending method, which uses formic acid as a cosolvent is efficient in improving the mechanical properties of CS film, especially wet strength and elongation. Formic acid is an effective cosolvent for the blend of CS and CA. Under wet condition, tensile strength and elongation of the composite films were obviously higher than those of the films made from pure CS. FTIR, DSC, and X-ray diffraction showed that the composite films exhibit a high level of compatibility and that strong interaction between the CS and CA was caused by intermolecular hydrogen bonding. The affinity series of composite film to transition metal ions are Cu(II) > Cd(II) > Cr(III). The adsorption of Cu((II) ion was shown to be highly pH sensitive.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.91-95
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• 2007

Electromigration characteristics of Sn-3.5Ag flip chip solder bump were analyzed using flip chip packages which consisted of Si chip substrate and electroplated Cu under bump metallurgy. Electromigration test temperatures and current densities peformed were $140{\sim}175^{\circ}C\;and\;6{\sim}9{\times}10^4A/cm^2$ respectively. Mean time to failure of solder bump decreased as the temperature and current density increased. The activation energy and current density exponent were found to be 1.63 eV and 4.6, respectively. The activation energy and current density exponent have very high value because of high Joule heating. Evolution of Cu-Sn intermetallic compound was also investigated with respect to current density conditions.

• Journal of Korean Society on Water Environment
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• v.27 no.4
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• pp.486-490
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• 2011

As(V) adsorption on aluminum oxide powder which was recycled from industrial wastes containing aluminum hydroxide was evaluated. Aluminum oxide powder in this study was prepared by calcinating aluminum hydroxide wastes at$550^{\circ}C$. Spectroscopic analysis indicated that the aluminum hydroxide wastes were changed to aluminum oxide by calcination. Arsenic adsorption isotherm was conducted with variation of ionic strength and multiple-ion systems using Ca(II) and Cu(II). As(V) removal showed typical anionic adsorption characteristics that the removal efficiency decreased with increasing pH in single As(V) system as well as in binary and ternary system. More than 80% of As(V) at an initial concentration of $5{\times}10^{-5}$ M was removed from aluminum oxide powder in As(V) single system. The effect of ionic strength on As(V) adsorption was negligible, which indicated the strong bonding between aluminum oxide powder and As(V). The removal efficiency of As(V) was higher in a binary system with Cu(II) than in a binary system with Ca(II).

• Applied Biological Chemistry
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• v.28 no.2
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• pp.68-75
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• 1985

Laboratory experiments were conducted to investigate the effect of compost and humic acid treatment on adsorption of Cd, Zn, and Cu in soils. Three soils differing in physical and chemical properties used in this experiments were Bonyrang (Typic Udifluvents) SL, Gangseo (Aquatic Eutrochrepts) L, and Gyorae (Typic Distrandepts) SiL. Adsorption of Cd, Zn, ana Cu on the soils followed Langmuir isotherm up to 75 ppm of initial concentration. The adsorption maxima of Cd, Zn, and Cu for the Bonryang soil, the lowest in pH, organic matter content, and CEC, were the lowest of the three soils. Although the Gyorae soil derived from volcanic ash was the highest in organic matter content and CEC, the adsorption maxima of heavy metals for the Gyorae soil were lower than those for the Gangseo soil of which organic content and CEC were intermidiate. The adsorption maxima/CEC ratios for the Bonryang, the Gangseo, the Gyorae soils were found to be in the range of $23{\sim}27%,\;28{\sim}57%$, and $11{\sim}14%$ respectively The bonding energy constants of Cd, Zn, and Cu for the soils were in the order of Gangseo>Bonryang>Gyorae soils. The adsorption maxima of Cd, Zu, and Cu for the Bonryang soil increased with compost treatment by $100{\sim}210%,\;90{\sim}230%$, and $130{\sim}290%$ respectively, while little difference was observed when the soil was treated with humic acid Bonding energy constants of Cd, Zn, and Cu for the Bonryang soil increased significantly with compost treatment, and showed insignificant correlation with humic acid treatment.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.9-15
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• 2008

Mokumegane is one of the sophisticated metal craft techniques enabling wood grain surface effect. To embody the mokumegane, an ingot of well-bonded stacked metal plates has been required. Traditionally prepared mokumegane ingots were bonded using charcoal which enables reduction atmosphere, but sometimes end up with collapse of bonding interface due to the lack of reliable process control. We proposed a systematic vacuum direct bonding process for ingots. First, we confirmed copper//copper homogeneous plate bonding at $900^{\circ}C$ by applying uniaxial press of 2.5kg. We observed 80min required to obtain 90%-bonding ratio and the diffusion coefficient would be enhanced up to 100 times due to surface effect. Second, by considering enhanced diffusion behavior, we also obtained optimum bonding condition in copper/silver heterogeneous plates that ensures 90%-bonding ratio at $700^{\circ}C$ for 10min with apply uniaxial press. A 7-layered copper/silver ingot is prepared successfully, and eventually the prototype mokumegane cases for mobile phone were fabricated with these ingot.

• 한국전기화학회:학술대회논문집
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• 2005.07a
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• pp.383-390
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• 2005

Effect of applying a DC voltage on the interfacial reaction at the metal to zirconia interface was investigated utilizing an oxygen ionic conductivity of partially stabilized zirconia. The joining of copper rod and zirconia tube was carried out in Ar gas atmosphere at $1000^{\circ}C$. There are two type of the joining. The one is the reaction bond consisting of copper and zirconia was dominated by surface reaction with a undetectable very thin layer. It was found that copper elements were diffused to zirconia side, but that Zr ions were not diffused to copper side. These results mean application of a DC voltage to migrate oxygen to the copper-zirconia interface can oxidize metal at the copper-zirconia interface and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result mean application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cu.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.