• 한국재료학회지
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• 제17권3호
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• 마이크로전자및패키징학회지
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• 제31권3호
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• pp.72-79
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• 2024

2.xD 패키지 구조에서 고속, 고대역폭 실현을 위해 인터포저 (Interposer) 혹은 브리지 다이와 이종 칩 간 접합 공정에 높은 기술력을 요하는 공법이 연구되고 있다. 특히 접합면 연삭 (Grinding) 공정은 그 핵심 기술에 속한다. Cu layer를 포함한 인터포저나 브리지 다이를 기판에 접합한 후 Cu처럼 전기적 연결이 가능한 금속 소재를 연삭 공정으로 노출하여 이종 칩을 서로 연결하는 방식은 종래의 패키징 기술을 그대로 활용하는 공법이다. 다만, 2.xD 패키지처럼 미세 범프의 대량 접합 공정에서 양산 가능한 수율과 품질을 충족하려면 높은 정밀도를 기반으로 한 공법 개발이 요구된다. 본 논문에서는 2.xD 패키지 구조의 이종 칩 접합을 위한 다중 가공물 연삭 과정에서 연삭 휠의 입도를 변수로 하여 패키지 연삭을 진행하였고, 노출된 가공물의 표면 양상 및 접합 특성에 관해 연구하였다. 본 연구의 고찰을 통해 고품질 접합을 위한 연삭 공정을 최적화하여 첨단 패키징 기술 발전에 기여할 수 있을 것이라 기대한다.

• 대한기계학회논문집
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• 제12권4호
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• pp.755-759
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• 1988

Laminated Composites, SS41-Cu-SS41 plates are made by brazing bonding and hot bonding process. Fatigue repeated plane bending tests are carried out and the fracture behavior of Laminated composites, SS41-Cu-SS41 plates are compared with that of homogeneous steel, SS41plates. The following results are obtained; (1) The fatigue life of the brazing bonding plates is higher than those of SS41 plates and hot bonding plates under high stress. (2) The relations between the fatigue crack growth rate, da/dN and stress intensity factor are, da/dN=4.7*10$^{-10}$ $K^{3.20}$, for SS41 da/dN=7.8*10$^{-9}$ $K^{2.43}$, for CAH da/dN=3.6*10$^{-9}$ $K^{2.54}$, for CAB da/dN=1.58*10$^{-9}$ $K^{2.94}$ , for PAH da/dN=1.23*10$^{-9}$ $K^{2.69}$, for PAB

• Nuclear Engineering and Technology
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• 제55권6호
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• pp.2139-2146
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• 2023

During reactor operation, the divertor must withstand unprecedented simultaneous high heat fluxes and high-energy neutron irradiation. The extremely severe service environment of the divertor imposes a huge challenge to the bonding quality of divertor joints, i.e., the joints must withstand thermal, mechanical and neutron loads, as well as cyclic mode of operation. In this paper, potassium-doped tungsten (KW) is selected as the plasma facing material (PFM), oxygen-free copper (OFC) as the interlayer, oxide dispersion strengthened copper (ODS-Cu) alloy as the heat sink material, and reduced activation ferritic/martensitic (RAFM) steel as the structural material. In this study, a vacuum brazing technology is proposed and optimized to bond Cu and ODS-Cu alloy with the silver-free brazing material CuSnTi. The most appropriate brazing parameters are a brazing temperature of 940 ℃ and a holding time of 15 min. High-quality bonding interfaces have been successfully obtained by vacuum brazing technology, and the average shear strength of the as-obtained KW/Cu and ODS-Cu alloy joints is ~268 MPa. And a fabrication route for manufacturing the flat-type divertor target based on brazing technology is set. For evaluating the reliability of the fabrication technologies under the reactor relevant condition, the high heat flux test at 20 MW/m² for the as-manufactured flat-type KW/Cu/ODS-Cu/RAFM mockup is carried out by using the Electron-beam Material testing Scenario (EMS-60) with water cooling. This paper reports the improved vacuum brazing technology to connect Cu to ODS-Cu alloy and summarizes the production route, high heat flux (HHF) test, the pre and post non-destructive examination, and the surface results of the flat-type KW/Cu/ODS-Cu/RAFM mockup after the HHF test. The test results demonstrate that the mockup manufactured according to the fabrication route still have structural and interfacial integrity under cyclic high heat loads.

• 한국주조공학회지
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• 제12권4호
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• pp.317-325
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• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• 한국재료학회지
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• 제4권6호
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• pp.620-625
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• 1994

자자들은 최근 비고용 Cu-Ta계의 기계적 합금화(Mechanical Alloying) 방법을 이용하여 이계에 있어서 비정질상의 형성에 대한 구조적 확인을 중성자 회절과 EXAFS(Extended X-ray Absorption Fine Structure)의 실험결과로 부터 얻었다. Cu-Ta계와 같이 혼합 엔탈피(Heat of Mixing: $\Delta$ Hmix)가 정인계에 있어서 비정질상 형성에 대한 연구는 구조적인 측면 뿐만 아니라. 시료의 전자물성에 대해서도 많은 연구가 되어야만 할 것으로 사료된다. 따라서 본 논문에서는 120시간 MA방법으로 제작한 시료에 대하여 초전도 천이온도 및 X선 광전자분광 실험에서 얻은 가전자대 구조의 전자물성을 측정하고, 그 결과로부터 이종원자 Cu와 Ta간의 결합은 화하결합에 의한 생성임을 확인하였는데, 이들 결과로부터 120시간 MA를 행하여 얻어진 시료는 확실하게 비정질 합금임을 알 수 있었다.

• Journal of Welding and Joining
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• 제21권2호
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.171-171
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• 1999

We studied the charge redistribution in the Pt-M (M=Cu, Co) alloys by X-ray Absorption Near Edge Spectroscopy(XANES) and X-ray Photoelectron Spectroscopy(XPS). These analysis tools provide us information about the charge transfer in the valence band of intermetallic bonding. The samples were prepared by arc-melting method. After annealing this samples in vacuum for several hours, we cold get the ordered samples, which were confirmed with XRD analysis. the core and valence level energy shift in these system were investigated by Mg $K\alpha$(1253.6eV) x-ray source for Pt-Co alloys and monochromatized Al $K\alpha$ (1486.6eV) for Pt-Cu alloys. Pt L2, L3-edge, and Cu, Co K-edge XANES spectra were measured with the total electron-yield mode detector at the 3Cl beam line of the PLS (Pohang light source0. from the changes of White line (WL) area and the core level shifts of the each metal sites, we can obtain the information about the electrons participating in the intermetallic bonding of the Pt-Cu and Pt-Co alloys.

• ETRI Journal
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• 제41권6호
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Journal of Welding and Joining
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• 제14권1호
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• pp.47-56
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• 1996

The purpose of this study is to develope an insert metal which can be brazed at lower temperature than the conventionally used insert metal and provide higher strength joint than base metal. In the review of binary phase diagram concerning Ti, Cu and Ni resulted in the discovery of Si having eutectic composition with them. The microstructure and the distribution of elements in reaction zone between CP Ti and insert metal were investigated by Optical Microscopy, SEM/EDX, EPMA, X-RAY. The newly developed insert metal is Ti-15wt%Cu-18wt%Ni-2wt%Si, which can yield the lower brazing temperature(1183K) compared with the conventional Ti-Cu-Ni system insert metal. The joints with this insert metal had tensile strength of 385MPa in the bonding temperature range of 1183K to 1243K.