• 열처리공학회지
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• 제11권2호
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• pp.111-120
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• 1998

The effects of chemical composition and thermal cycling on the martensitic transformation characteristics in Cu-rich, equiatomic and Zr-rich CuZr binary alloys have been studied by calorimetry. Only martensite could be indentified in equiatomic $Cu_{49.9}Zr_{50.1}$ alloy, while $Cu_{10}Zr_7$ and $CuZr_2$ intermetallic compounds as well as martensite were formed by rapid cooling from the melts in Cu-rich $Cu_{52.2}Zr_{47.5}$ alloy and Zr-rich $Cu_{48.4}Zr_{51.6}$ alloy, respectively. The $M_s$ temperature of $Cu_{49.9}Zr_{50.1}$ was $156^{\circ}C$ but those of $Cu_{52.5}Zr_{47.5}$ and $Cu_{48.4}Zr_{51.6}$ alloys, being $109^{\circ}C$ and $138^{\circ}C$, were lower than that of equiatomic $Cu_{49.9}Zr_{50.1}$ alloy. In all the alloys, the $M_s$ temperature has fallen but the $A_s$ temperature has risen, resulting in widening of the transformation hysteresis with thermal cycling. The anomalous characteristics in the transformation temperature are due to the presence of the intermetallic compounds i.e. $Cu_{10}Zr_7$ and $CuZr_2$ formed by an eutectoid reaction during thermal cycling in the temperature range between $-100^{\circ}C$ < $T_c$ < $400^{\circ}C$.

• 비파괴검사학회지
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• 제30권5호
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• pp.444-450
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• 2010

본 연구에서는 전류 4단자 전위차법을 이용한 전기비저항을 측정하여 반복피로손상을 받은 구리와 구리합금의 미시적 열화를 평가하였다. 서로 매우 다른 적층결함 에너지를 갖는 구리(Cu)와 구리합금(Cu-35Zn)에 대해 반복피로손상을 가하고 이들 재료에서 발달한 전위구조와 전기비저항 간의 관계를 연구하고자 하였다. Cu는 전위셀 하부구조를 형성하였지만, Cu-35Zn 합금은 피로사이클에 따라서 전위밀도는 증가하고 평면배열의 전위구조를 형성하였다. 전기비저항은 두 재료 모두에서 피로변형 초기 단계에서 급격하게 증가하였다. 더욱이, 피로시험 후 구리는 약 7 % 그리고 구리 합금은 약 6.5 % 변하였다. 이러한 일관적인 결과들로부터, 반복적인 피로에 의해 발달한 전위 셀구조는 평면배열의 전위구조보다도 전기비저항에 매우 민감한 것으로 판단된다.

• E2M - 전기 전자와 첨단 소재
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• 제8권4호
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• pp.478-486
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• 1995

Cu/NbTi multilayer thin films and superconducting wires were fabricated and heat treated with conventional annealing and analyzed by differential scanning calorimetry (DSC) as a basic study for the enhancement of Jc. Interfacial reactions of Cu/NbTi multilayer thin films and superconducting wires were investigated with optical microscope, SEM, and XRD. According to the effective heat of formation (EHF) model, CU$\_$3/Ti was predicted as a first phase. However, considering the crystalline structure and thermodynamics, CuTi was predicted as a first phase. According to the results of DSC and XRD, CU$\_$2/Ti was found to be the first phase, followed by the formation Of CU$\_$4/Ti. The difference in first crystalline phase between the experimental result and the predicted one was discussed. In case of Cu/NbTi superconducting wires, the compounds formed at the Cu/NbTi interface grew with annealing time and the amount of compounds formed in Nb-47wt%Ti alloy was larger than that in Nb-50wt%Ti alloy. It seemed that the incubation time for the formation of compounds in Nb-50wt%Ti alloy was longer than that formed in Nb-47wt%Ti alloy. Also, the diffusion was the rate controlling step for the growth of compounds in all specimens. These compounds were formed at 500-600.deg. C for I hour annealing and, thus, the drawing time below I hour must be required to minimize the growth of compounds for the enhancement of Jc.

• Applied Microscopy
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• 제36권2호
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• pp.47-55
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• 2006

이 논문에서 Al-2.5Cu-1.5Mg wt.% 합금에서 미세한 Cu 석출물에 대한 투과전자현미경 관찰이 보고 되었다. 이 새로운 관찰은 시료에 오염된 산화물을 제거하기 위해 ion milling을 하고 곧바로 시료 관찰을 했을 때 우연히 이루어 졌다. 특히 이 Cu석출물은 $150^{\circ}C$에서 100시간 aging한 시료에서 분명하게 관찰되었다. 그리고 ion milling 전 시료표면에서 분명히 관측되는 산화물은 $Cu_2O$임이 확실히 밝혀졌다. 이러한 분석과정은 회절 환 패턴의 정밀 분석을 요구함으로 이에 대한 시뮬레이션에 필요한 이론적 공식도 만들었다. 마지막으로 이 합금에 대한 예기치 않은 ion milling효과와 그 중요성이 논의되었다.

• 한국표면공학회지
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• 제39권6호
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• pp.276-281
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• 2006

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

• Applied Microscopy
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• 제44권3호
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• pp.105-109
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• 2014

The microstructure of as-quenched $Al_{70}Cu_{18}Mg_{12}$ alloy has been investigated in detail using transmission electron microscopy. Al nano-crystals about 5 nm with a high density are distributed in the amorphous matrix, indicating amorphous matrix nano-composite can be synthesized in Al-Cu-Mg alloy. The high density of Al nano-crystals indicates very high nucleation rate and sluggish growth rate during crystallization possibly due to limited diffusion rate of solute atoms of Cu and Mg during solute partitioning. The result of hardness measurement shows that the mechanical properties can be improved by designing a nano-composite structure where nanometer scale crystals are embedded in the amorphous matrix.

• 한국표면공학회지
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• 제24권2호
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• pp.103-113
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• 1991

Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

• 대한금속재료학회지
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• 제50권9호
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• pp.669-675
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• 2012

Hot tearing was the most significant casting defect when the castability evaluation of the Al-Zn-Mg-Cu alloy system was conducted. It was related to the solidification range of the alloy. Therefore, the hot tear susceptibility of the AA7075 alloy, whose solidification range is the widest, was evaluated. The hot tear susceptibility was evaluated by using a mold for a hot tearing test designed to create the condition for the occurrence of hot tear in 8 steps. According to the tearing location and shape, a hot tear susceptibility index (HTS) score was measured. The solidification range of each alloy and hot tear susceptibility was compared and thereafter the microstructure of a near tear defect was observed. As a result, the HTS of the AA7075 alloy was found to be 67. Also, the HTS in relation to a change in Zn, Mg, Cu composition showed a difference of about 6-11% compared to the AA7075 alloy.

• 방사성폐기물학회지
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• 제21권1호
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• pp.1-8
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• 2023

The major concern in the deep geological disposal of spent nuclear fuels include sulfide-induced corrosion and stress corrosion cracking of copper canisters. Sulfur diffusion into copper canisters may induce copper embrittlement by causing Cu₂S particle formation along grain boundaries; these sulfide particles can act as crack initiation sites and eventually cause embrittlement. To prevent the formation of Cu₂S along grain boundaries and sulfur-induced copper embrittlement, copper alloys are designed in this study. Alloying elements that can act as chemical anchors to suppress sulfur diffusion and the formation of Cu₂S along grain boundaries are investigated based on the understanding of the microscopic mechanism of sulfur diffusion and Cu₂S precipitation along grain boundaries. Copper alloy ingots are experimentally manufactured to validate the alloying elements. Microstructural analysis using scanning electron microscopy with energy dispersive spectroscopy demonstrates that Cu₂S particles are not formed at grain boundaries but randomly distributed within grains in all the vacuum arc-melted Cu alloys (Cu-Si, Cu-Ag, and Cu-Zr). Further studies will be conducted to evaluate the mechanical and corrosion properties of the developed Cu alloys.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1193-1196
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• 2009

Low resistivity interconnection and high-mobility channel are required to realize ultrahigh-definition LCDs such as 4k ${\times}$ 2k TVs. We evaluated fully Cu-based gate and Source/Drain interconnections, consisting of stacked pure-Cu/Cu-Mn layers for TFT-LCDs, and found the underlying Cu-Mn alloy film has superior adhesion to glass substrates and CVD-SiOx films. It was also confirmed that wet etching of the Cu/Cu-Mn films without residues and low contact resistance with both channel IGZO and pixel ITO films can be obtained. It is thus considered that the stacked Cu/Cu-Mn structure is one of candidates to replacing conventionally pure-Cu/refractory metal.