• Corrosion Science and Technology
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• 제6권6호
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• pp.304-307
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• 2007

As to the reflection electrode of LCD (liquid crystal displays), silver-copper-gold alloy (hereafter, it is called as ACA (Ag98%, Cu1%, Au1%)) is an effective material of which weathering resistance can be improved more compared with pure silver. However, there is a problem that gold remains on the substrate as residues when ACA is etched in cerium ammonium nitrate solution or phosphoric acid. Gold can not be etched in these etchants as readily as the other two alloying elements. Gold residue has actually been removed physically by brushing etc. This procedure causes damage to the display elements. Another etchant of iodine/potassium iodide generally known as one of the gold etchants can not give precise etch pattern because of remarkable difference in etching rates among silver, copper and gold. The purpose of this research is to obtain a practical etchant for ACA alloy. The results are as follows. The cyanogen complex salt of gold generates when cyanide is used as the etchant, in which gold dissolves considerably. Oxygen reduction is important as the cathodic reaction in the dissolution of gold. A new etchant of sodium cyanide / potassium ferricyanide whose cathodic reduction is stronger than oxygen, can give precise etch patterns in ACA alloy swiftly at room temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Restorative Dentistry and Endodontics
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• 제19권1호
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• pp.1-26
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• 1994

The purpose of this study was to investigate the dissolution components during corrosion of amalgams and to identify surface corrosion products in the modified Fusayama artificial saliva. Four type of amalgam alloys were used: low copper lathe cut amalgam alloy (Cavex 68), low copper spherical amalgam alloy (Caulk Spherical Alloy), high copper admixed amalgam alloy (Dispersalloy) and high copper single composition amalgam alloy (Tytin). Each amalgam alloy and Hg were triturated according to the manufacturer's direction by means of mechanical amalgamator (Capmaster, S.S.White), and then the triturated mass was inserted into the cylindrical metal mold which was 10mm in diameter and 2.0mm in height and condensed with compression of 150kg/$cm^2$ using oil pressor. The specimens were removed from the mold and stored at room temperature for 7 days and cleansed with distiled water for 30 minutes in an ultrasonic cleaner. The specimens were immersed in the modified Fusayama artificial saliva for the periods of 1 month, 3 months and 6 months. The amounts of Hg, Cu, Sn and Zn dissolved from each amalgam specimen immersed in the artificial saliva for the periods of 1 month, 3 months and 6 months were measured using Inductivity Coupled Plasma Atomic Emission Spectrometry (ICPQ-1000, Shimadzu, Japan) and amount of Ag dissolved from amalgam specimen was measured using Atomic Absorption Spectrophotometry (Atomic Absorption/Flame emission spectrophotometer M-670, Shimadzu, Japan). A surface corrosion products of specimens were analysed using Electron Spectroscopy Chemical Analyser (ESCA PHI-558, PERKIN ELMER, U.S.A.). The secondary image and back scattered image of corroded surface of specimens was observed under the SEM, and the corroded surface of specimens was analysed with the EDX. The following results were obtained. 1. The dissolution amount of Cu was the most in high copper admixed amalgam(Dispersalloy) and the least in high copper single composition amalgam(Tytin). 2. Sn and Zn were dissolved during all the experiment periods, and dissolution amounts were decreased as the time elapsed. 3. Initial surface corrosion products were ZnO and SnO. 4. Corrosion of ${\gamma}$ and ${\gamma}_2$ phase in low copper amalgams was observed and Ag-Cu eutectic alloy phase was corroded in low copper spherical amalgam(Caulk Sperical Alloy). 5. Corrosion of ${\gamma}$ and $\eta$' phase in high copper amalgams was observed and Ag-Cu eutectic alloy phase was corroded in high copper admixed amalgam(Dispersalloy). 6. Sn-Cl was produced in the subsurface of low copper amalgams and high copper admixed amalgam.

• 한국재료학회지
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• 제10권1호
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• pp.41-48
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• 2000

본 연구에서는 열가공공정을 거쳐 제조된 Cu-Fe-Xi(Xi=Ag, Cr 또는 Co) 미세복합재료의 미세구조와 기계적 특성 및 전기적 특성에 대하여 조사하였다. 냉각가공 중에 수지상정들은 인발 방향에 평행하게 배열되고 필라멘트 형태로 연산되었다. Ag를 첨가한 미세복합재료가 같은 가공율에서 Co나 Cr를 첨가하는 미세복합재료보다 미세조직이 더욱 미세하게 관찰되었다. 제3첨가원소로 Ag를 함유하고 있는 Cu-Fe-Ag 미세복합재료의 강도와 전도도는 Co나 Cr를 첨가하는 미세복합재료보다 높게 나타났다. Cu-Fe-Ag 미세복합재료의 우수한 기계적 성질과 전기적 특성은 Ag가 함유되어 있는 경우 필라멘트의 미세성과 균일성이 높게 관찰되는 것과 관련이 있다. Cu-Fe-Xi 미세복합재료의 강도는 Fe 필라멘트의 간격을 고려한 Hall-Petch 형태의 식과 일치한다. Cu-Fe-Xi 미세복합재료의 파괴는 연성파괴가 관찰되었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Journal of Welding and Joining
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• 제28권3호
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• 한국자기학회지
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• 제5권1호
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• pp.48-53
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• 1995

동시 열진공증착한 Ag-Co 미세입상 합금박막의 구조, 자기적 성질 및 거대자기저항 현상에 관하여 연구하였다. 증착된 상태에서 합금박막은 과포화된 Ag 기지와 석출된 Co 입자들이 공존하는 준안정한 fcc 구조를 이루고 있다. Co의 양이 20에서 55 at.%로 증가함에 따라 Ag 기지의 입자크기는 평균 147에서 $67{\AA}$으로 감소하였고 Ag 기지에 Co의 고용량은 2.5에서 6.7%로 증가하였다. 25 at.% 이하의 조성을 갖는 합금박막은 주로 초상자성 특성을 보였으며 그 이상의 조성에서는 초상자성과 강자성이 혼합된 거동을 보였다. 증착된 상태의 30 at.% 합금 박막에서(상온, 10 kOe) 최대 19%의 자기저항비를 얻었다. 증착된 상태에서 대부분의 코발트가 석출되어 있기 때문에 Cu-Co계와는 달리 열처리에 의해 MR비의 증가는 보이 지 않았다.

• Transactions on Electrical and Electronic Materials
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• 제16권3호
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• pp.112-116
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• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• 방사성폐기물학회지
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• 제21권1호
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• pp.1-8
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• 2023

The major concern in the deep geological disposal of spent nuclear fuels include sulfide-induced corrosion and stress corrosion cracking of copper canisters. Sulfur diffusion into copper canisters may induce copper embrittlement by causing Cu₂S particle formation along grain boundaries; these sulfide particles can act as crack initiation sites and eventually cause embrittlement. To prevent the formation of Cu₂S along grain boundaries and sulfur-induced copper embrittlement, copper alloys are designed in this study. Alloying elements that can act as chemical anchors to suppress sulfur diffusion and the formation of Cu₂S along grain boundaries are investigated based on the understanding of the microscopic mechanism of sulfur diffusion and Cu₂S precipitation along grain boundaries. Copper alloy ingots are experimentally manufactured to validate the alloying elements. Microstructural analysis using scanning electron microscopy with energy dispersive spectroscopy demonstrates that Cu₂S particles are not formed at grain boundaries but randomly distributed within grains in all the vacuum arc-melted Cu alloys (Cu-Si, Cu-Ag, and Cu-Zr). Further studies will be conducted to evaluate the mechanical and corrosion properties of the developed Cu alloys.

• 한국세라믹학회지
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• 제37권4호
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• pp.381-387
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• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.