• 한국표면공학회지
• /
• 제27권1호
• /
• pp.29-35
• /
• 1994

The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

• 대한금속재료학회지
• /
• 제50권10호
• /
• pp.775-783
• /
• 2012

The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.

• 한국재료학회지
• /
• 제24권4호
• /
• pp.186-193
• /
• 2014

A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2007년도 추계종합학술대회
• /
• pp.751-753
• /
• 2007

최근에 유기물 전계효과 트랜지스터의 연구는 전자 소자 분야에서 널리 알려져 있다. 특히 본 연구에서는 CuPc 물질을 활성층으로 사용하여 Organic FET 소자를 제작하였다. Source와 Drain 전극을 Au와 Al을 사용하여 FET 소자의 전기적 특성을 비교하였다. CuPc FET 소자에서 CuPc 활성층의 두께는 40nm로 고정하였고, Au와 Al 전극의 두께는 200nm로 하여 소자를 제작하였다. 또한 C-V 특성을 측정하여 CuPc 유기물 층과 $SiO_2$ 절연층 계면에서의 특성 변화를 관측하였다. Au를 전극으로 사용한 FET 소자에서는 전형적인 FET 특성 곡선을 관측할 수 있었으나, Al을 전극을 사용한 FET 소자에서는 누설 전류가 흐르고 있음을 확인 할 수 있었다.

• 소성∙가공
• /
• 제23권6호
• /
• pp.386-391
• /
• 2014

In the current study, Al-Mn-Zn alloys are strip-cast and used as the base alloy for the core of aluminum clad sheets used in automotive condenser fins. Transition elements such as Cu and Cr are added to the base core alloy in order to improve the properties of the clad sheets. The AA4343/Al-Mn-Zn-X(X: Cu, Cr)/AA4343 clad sheets are fabricated by roll bonding and further cold-rolled to a thickness of 0.08 mm. Clad sheets were intermediately annealed during cold rolling at $450^{\circ}C$ in order to obtain 40% reduction at the final thickness. Tensile strength and sag resistance of the clad sheets are improved by Cu additions to the core alloy, while corrosion resistance is also increased. Cr-additions to the clad sheets enhance sag resistance and provide low enough corrosion, although tensile strength is not improved. The effect of Cu and Cr additions on the properties of the clad sheets is elucidated by microstructural analysis.

• 한국주조공학회지
• /
• 제17권3호
• /
• pp.276-285
• /
• 1997

The effect of wheel surface condition on solidification behavior of Al-Cu ribbon was investigated in order to establish extreme levels of heat extraction. The condition of wheel surface was changed either by heating the wheel surface up to $200^{\circ}C$ or by coating boron nitride(BN) onto the the rim of a wheel. Heating the wheel surface up to $200^{\circ}C$ improved the wetting behavior between the molten metal and the rotating wheel, leading to an increase in the ratio of columnar structure to the entire thickness of Al-4.3wt%Cu and Al-33.2wt%Cu ribbons. For Al-4.3wt%Cu ribbon, assuming one grain as a single heterogeneous nucleation event at the contact point, the nucleation density with the wheel surface heated to $200^{\circ}C$, was $4{\times}10^6/mm^2$, and in the cases of BN coating with thin and thick layers, $10^5/mm^2$ and $5{\times}10^4/mm^2$, respectively. The largest cooling capacity of the wheel corresponded to the heated wheel surface, and as the thickness of BN coating layer increased, the cooling capacity of the wheel gradually decreased.

• 소성∙가공
• /
• 제7권5호
• /
• pp.465-473
• /
• 1998

The effect of alloying elements of Ag-Cu-Zr-X brazing alloy on the microstructure and the bond strength of $Al_2O_3/Ni-Cr$ brazed steel joint was investigated. The reaction layer, $ZrO_2$ (a=5.146 ${\AA}$ , b=5.213 ${\AA}$ , c=5.311 ${\AA}$ )was formed at the interface of $Al_2O_3/Ni-Cr$ steel joint by the redox reaction between alumina and Zr. The addition of An and Al to the Ag-Cu-Zr brazing alloy gave rise to changes in the thickness of the reaction product layer and the morphology of the brazement. Sn caused the segregation of Zr was decreased b Al the $ZrO_2$ layer formed at the Ag-Cu-Zr-Al alloy was thinner than that of $ZrO_2$ formed at the Ag-Cu-Zr-An alloy. The fracture shear strength was strongly dependent on the microstructure of the brazement. Brazing with Ag-Cu-Zr-Sn alloy resulted in a better bond strength than with Ag-Cu-Zr or Ag-Cu-Zr-Al alloy.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2007년도 춘계종합학술대회
• /
• pp.548-551
• /
• 2007

최근에 유기물 전계효과 트랜지스터의 연구는 전자 소자 분야에서 널리 알려져 있다. 특히 본 연구에서는 CuPc 물질을 기본으로 하여 소자를 제작하고, 또한 기판의 온도를 달리 하여 제작하였다. CuPc FET 소자는 top-contact 방식으로 제작하였으며, 기판의 온도는 상온과 $150^{\circ}C$로 달리 하였다. 또한 CuPc의 두께는 40nm로 하였고, 채널의 길이는 $50{\mu}m$, 폭은 3mm로 하였다. 제작된 소자를 이용하여 전압-전류 특성을 측정하였다.

• 한국태양에너지학회:학술대회논문집
• /
• 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
• /
• pp.400-403
• /
• 2012

$Cu_2ZnSnSe_4$(CZTSe) is emerged as a promising material for thin-film solar cells because of non-toxic, inexpensive and earth abundant more than $Cu(In,Ga)Se_2$ materials. For fabricating compound semiconductor thin-film solar cells, CdS is widely used for a buffer layer which fabricated by a chemical bath deposition method (CBD). Through the experiment, we controlled deposition temperature and mol ratio of solution conditions to find the proper grain 크기 and exact composition. The optimum CdS layers were characterized in terms of surface morphology by using a scanning electron microscope (SEM) and atomic force microscope (AFM). The optimized CdS layer process was applied on CZTSe thin-films. The thickness of buffer layer related with device performance of solar cells which controlled by deposition time. Local surface potential of CdS/CZTSe thin-films was investigated by Kelvin probe force microscopy (KPFM). From these results, we can deduce local electric properties with different thickness of buffer layer on CZTSe thin-films. Therefore, we investigated the effect of CdS buffer layer thickness on the CZTSe thin-films for decreasing device losses. From this study, we can suggest buffer layer thickness which contributes to efficiencies and device performance of CZTSe thin-film solar cells.

• 한국자기학회지
• /
• 제10권5호
• /
• pp.203-209
• /
• 2000

Synthetic antiferromagnet CoFe/Ru/CoFe/FeMn을 사용하고 자유층으로 NiFe/CoFe 이중 층을 사용한 top스핀밸브 구조를 dc magnetron 방식으로 제조하여, 자유층과 구속층의 두께변화에 따른 자기적 특성과 interlayer coupling field티 변화를 조사하였다 Si/Ta(50 $\AA$)/NiFe(x $\AA$)/CoFe(y $\AA$)/Cu(26 $\AA$)/CoFe(30 $\AA$)/Ri(7 $\AA$)/CoFe(15 $\AA$)/FeMn(100 $\AA$)/Ta(50 $\AA$) top synthetic 스핀밸브 시료에서 자유층의 두께 감소에 따른 interlayer coupling field를 조사한 결과 interlayer coupling field가 증가하였으며, 이것은 Neel 모델에 의한 정자기 교환결합에 기인하는 것으로 설명하였다. Top synthetic 스핀 밸브에서 Cu에 인접한 자성층(Pl)과 FeMn에 인접한 자성층(P2) 두께 차이에 따른 interlayer coupling field 의 의존성을 조사한 결과 $t_{P1}$> $t^{P2}$ 일 경우 interlayer coupling field(층간 교환 결합력 세기)는 기존 스핀 밸브에서 적용한 Kools이 제시한 modified Nel 모델에 잘 부합되나, $t_{P1}$ $\leq$ $t_{P2}$ 인 경우 모델과 부합되지 않음으로 새로운 모델이 필요함을 확인하였다 Cu 두께에 변화에 따른 층간 교환 결합력 세기 의존성을 조사한 결과 Cu 두께를 32 $\AA$으로 증가시 층간 교환결합력 세기는 10 Oe 이하로 감소하였다.감소하였다.다.