• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.3
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• pp.203-207
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• 1998

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS (X-ray photoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, the $SF_6$ plasma treatment subsequent to the etch has been carried out. A passivation layer is formed by fluorine-related compounds on etched Al-Cu alloy surface after $SF_6$ treatment, and the layer suppresses effectively the corrosion on the surface as the RF power of $SF_6$ treatment increases. The corrosion could be suppressed successfully with $SF_6$ treatment in the RF power of 150watts.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.383-386
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• 1998

After etching Al-Cu alloy films using SiC1$_4$/Cl$_2$/He/CHF$_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS (X-ray photoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, CHF$_3$ plasma treatment subsequent to the etched has been carried out. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after CHF$_3$ and SF$_{6}$ treatment, and the layer supresses effectively the corrosion on the surface as the CHF$_3$ and SF$_{6}$ treatment pressure increases. The corrosion could be suppressed successfully with CHF$_3$ and SF6 treatment in the pressure of 300mTorr.orr.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.10-10
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• 2001

In this paper, initial depositing process of electroless Ni-Cu-P alloy was investigated by means of SEM, TEM and AES. The results show that the initial deposition is inhomogeneous and there exist different transition layers between different coatings and substrates, which are decided by the structures and compositions of the bath. For Ni-P binary alloy, its deposition takes place superiorly at grain boundary and on some grains with beneficial texture, the thickness of transition layer composed of Ni-Fe-P reaches 2000 angstrom. But during initiation of Ni-Cu-P trinary alloy, only at grain boundary is prIor to be deposited electrolessly, transited layer contains Ni-Fe-Cu-P and is decreased to about 500 angstrom. The structures of the films of Ni-P and Ni-Cu-P are crystalline at the initial depositing stage. The mechanisms of the process are put forward in this paper.

• Journal of Technologic Dentistry
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• v.27 no.1
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• pp.57-63
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• 2005

Experimental Ti-13%Zr and Ti-13%Zr-5%Cu alloys were made in an argon-arc melting furnace. The grade 2 CP Ti was used to control. To investigate the surface reaction layers produced by the reaction with mold materials and the influence of the reaction layers on the hardness of castings, A phosphate bonded $SiO_2$ base investment was used as mold material, and microstructure observation and hardness test were performed. The surface reaction layers of Ti-13%Zr and Ti-13%Zr-5%Cu alloys were thinner than that of CP Ti had a clearly multiple structure. A difference of the hardness between surface and inner of the Ti-13%Zr and Ti-13%Zr-5%Cu alloys became less than that of CP Ti. From the results, it was found that the Ti-Zr-(Cu) based alloys were possible to cast with $SiO_2$ base investment without the great changes of mechanical properties of the castings.

• Analytical Science and Technology
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• v.13 no.2
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• pp.131-135
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• 2000

We studied adsorption isotherm, surface properties and antibacterial activity of Cu treated activated carbon fiber (ACF). The BET surface area of Cu treated ACF are distributed to $688.2-887.8m^2/g$. The adsorption results show that BET surface areas move gradually to lower value with increasing treated Cu mole concentration. Using t-method, the specific micropore volumes and average pore size were obtained. From the SEM study, it is also observed that many of micropores in activated carbon fiber are blocked surface after the treatment. And we also observed that the activity of E. coli in kind of colon bacillus increases gradually to larger range with increasing Cu mole ratio. From these results, we suggest the antibacterial mechanism for metal treated ACF.

• Carbon letters
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• v.7 no.4
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• pp.249-258
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• 2006

Treatment of water hyacinth with sulphuric acid produces carbonaceous materials that have been used to remove Cu(II) and Cd (II) ions from aqueous solutions. Untreated water hyacinth was also used for the subject of comparison. The textural properties of the carbonaceous materials were determined from nitrogen adsorption at 77 K. The optimum pH for the sorption of Cu (II) and Cd (II) ions on the investigated sorbents was determined. Dynamic adsorption measurements have been taken at 298 K whereas equilibrium measurements were carried out at 298, 313 and 323 K. The adsorption of nitrogen at 77 K on the untreated sample was too low and the surface areas of the treated samples 2, 3 and 4 were found between $70-208\;m^2/g$. The total pore volumes of these samples which were determined for the carbonaceous materials investigated were found to be 0.076-0.140 ml/g. The kinetic adsorption data of Cu (II) and Cd(II) were applicable to both pseudo - first and pseudo-second order but fit more the latter order. The equilibrium adsorption data were found to fit Freundlich and Langmiur equations. The values of DG, DH and DS are all negative indicating the feasibility and the spontaneous nature of the sorption of Cu (II) and Cd (II) ions by the sorbents investigated.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.740-746
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• 2002

In this study, the polycarbonate surface was treated by $O_2$/ Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the $O_2$/ Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the$ O_2$/ Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by $O_2$/ Ar gases plasma treatment. Therefore,$O_2$/ Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.466-473
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• 2009

Our group previously observed the intrinsic stress evolution of Cu thin films during deposition by changing the deposition rate. Intrinsic stress of Cu thin films, which show Volmer-Weber growth, is reported to display three unique stress stages, initial compressive, broad tensile, and incremental compressive stress. The mechanisms of the initial compressive stress and incremental compressive stages remain subjects of debate, despite intensive research inquiries. The tensile stress stage may be related to volume contraction through grain growth and coalescence to reduce over-accumulate Cu adatoms on the film surface. The in-situ intrinsic stresses behavior in Cu thin films was investigated in the present study using a multi-beam curvature measurement system attached to a thermal evaporation device. The effect of substrate surface roughness was monitored by observed the in-situ intrinsic stress behavior in Cu thin films during deposition, using $100{\mu}m$ thick Si(111) wafer substrates with three different levels of surface roughness.

• Tribology and Lubricants
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• v.37 no.3
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• pp.83-90
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• 2021

In this study, an ultrasonic nanocrystal surface modification (UNSM) was used to improve the mechanical properties, scratch resistance and tribological performance of Cu-based bimetals, which are usually used to manufacture sliding bearings and bushings for internal combustion engines (ICEs). Two different Cu-based bimetals, namely CuPb10Sn10 and CuSn10Bi7, were sintered onto a low carbon steel substrate. The mechanical properties and dry tribological performance using a tensile tester and micro-tribo tester were evaluated, respectively. The scratch resistance was assessed using a micro-scratch tester at an incremental load. The tensile test results showed that the yield strength (YS) and ultimate tensile strength (UTS) of both Cu-based bimetals increased after UNSM. Furthermore, the scratch and tribological tests results revealed that the scratch resistance and tribological performance of both Cu-based bimetals were improved by the application of UNSM. These improvements were mainly attributed to the eliminated pores, increased hardness and reduced roughness after UNSM. CuSn10Bi7 demonstrated better mechanical properties, scratch resistance and tribological performance than CuPb10Sn10. It was found that the presence of Bi in CuSn10Bi7 formed a Cu₁₁Bi₇ intermetallic phase, which is harder than Cu₃Sn. Hence, CuSn10Bi7 demonstrated higher strength and wear resistance than CuPb10Sn10. In addition, a CuSn10Bi7 formed both SnO₂ and Bi₂O₃ that prevented adhesion and improved the tribological performance. It can be expected that under dry tribological conditions, ICEs can utilize UNSM bearings and bushings made of CuSn10Bi7 instead of CuPb10Sn10 under oil-lubricated conditions.

• Journal of the Korean institute of surface engineering
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• v.8 no.1
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• pp.1-9
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• 1975

The crorosion film of gilt bronz, silver and iron objects, which were excaved from Ancient Tomb of Silla Dynasty, was removed by the electrolytic reduction process. These metallic objects were mainly investigated for microstructure, designs and gilting film etc. Most iron objects might be made by hot forging process. The cold extrusion technique might be used for gold and silver objects, in addition to an amalgam method might be applied for the gilting Au film on Cu-alloy surface. For the gilting on glass surface, first, a Cu alloy was cladded on glass , next, Au-film was obtained on the Cu-ally by the amagum method.