• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.171-171
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• 1999

We studied the charge redistribution in the Pt-M (M=Cu, Co) alloys by X-ray Absorption Near Edge Spectroscopy(XANES) and X-ray Photoelectron Spectroscopy(XPS). These analysis tools provide us information about the charge transfer in the valence band of intermetallic bonding. The samples were prepared by arc-melting method. After annealing this samples in vacuum for several hours, we cold get the ordered samples, which were confirmed with XRD analysis. the core and valence level energy shift in these system were investigated by Mg $K\alpha$(1253.6eV) x-ray source for Pt-Co alloys and monochromatized Al $K\alpha$ (1486.6eV) for Pt-Cu alloys. Pt L2, L3-edge, and Cu, Co K-edge XANES spectra were measured with the total electron-yield mode detector at the 3Cl beam line of the PLS (Pohang light source0. from the changes of White line (WL) area and the core level shifts of the each metal sites, we can obtain the information about the electrons participating in the intermetallic bonding of the Pt-Cu and Pt-Co alloys.

• 한국재료학회지
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• 제14권6호
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• pp.379-388
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• 2004

To investigate the effect of D-ferrite on the hot workability and surface defect of STS 304 billets containing 3 wt. % Cu, microstructure observations and high temperature mechanical properties test were carried out for the specimens extracted mainly from raw or oxidized billets. It was found that the total $\delta$-ferrite content has little influence on the hot workability, even though the fracture cracks due to high temperature tension or compression test were initiated and propagated mostly along $\delta$/${\gamma}$ boundary in the specimens. On the other hand, it was supposed that the direct causes of surface defects in the wire rolled from the as-continuously cast billet were the grain boundary embrittlement arose from the deep diffusion of oxygen into the grain boundary, and the oxidation of $\delta$-ferrite connected by a grain boundary to the surface during the billet reheating process as well.

• 방사선산업학회지
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• 제4권4호
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• pp.335-339
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• 2010

In this study, the surface of polyimide (PI) films was modified using ion implantation to enhance its adhesion to a deposited copper (Cu) layer. The surfaces of the PI films were implanted with 150 keV $Xe^+$ ions at fluences varying from $1{\times}10^{14}$ to $1{\time}10^{16}ions\;cm^{-2}$. The Cu layers were then deposited on the implanted PI. The surface properties of the implanted PI film were investigated based on the contact angle measurements, Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). Furthermore, the adhesive strength between the deposited Cu layer and PI film was estimated through a scratch test using a nanoindenter. As a result, the surface environment of the PI film was changed by the ion implantation, which could have a significant effect on the adhesion between the deposited Cu layer and the PI.

• Korean Chemical Engineering Research
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• 제54권1호
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.

• 한국표면공학회지
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• 제22권2호
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• pp.47-54
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• 1989

The effects of intermetallic compound growt on the sheet resistance and soldreability as functions of the aging time, the temperature, and the conditions of substrates have been investi-gated in the electroplallic compound (mainy Cu6Sn5and Ni3Sn4) and the number of phase interface increased, the sheet resistance increased. Spread tests showed that the solderability was dereased with the intermetallic compounds growth and increased with the thickness of electroplated Sn. The surface morphology or agin size of the compound layer singificantly affect the solderability. The solderability of Sn/Ni system was superiot to Sn/Ni system was sperior to that of Sn/Cu system and the intermetallic compounds growth was solwer in the former system.

• 전자공학회논문지D
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• 제35D권1호
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• pp.27-33
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• 1998

In this study, chlorine(Cl)-based gas chemistry is generally used to etching for AlCu films metallization.The corrosion phenomena of AlCu films were examined with XPS (X-ray photoelectron spectroscopy), SEM 9Scanning electron microscopy), and TEM (Transmission electron microscopy). SF$_{6}$ plasma treatment sulbsequent to the etching process preventas the corrosion effectively in the pressure of 300 mTorr. It is found that the cholrine atoms on the etched surface are not substituted for fluorine atoms during SF$_{6}$ treatment, but a passivation layer on the surface by fluorine-related compounds would be formed. The passivation layer prevents the moisture penetration on the SF$_{6}$ treated surface and suppresses the corrsion sucessfully.fully.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2015년도 춘계학술대회
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• pp.179-180
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• 2015

The variety of organic and inorganic pollutants are introduced to coastal sediment and making highly contaminated due to rapid development of industralization and economic development. Numerous contaminants are release into marine sediment and it significantly affect marine aquatic environment. In the present study stated the optimize the biostimulant ball (BSB) in coastal sedimentand stabilse the heavy metals present in the sediment. The effective variables like BSB size, distance and month variables on Cu stabilization was determined by using Response surface methodology(RSM). The analysis of variance (ANOVA) and coefficient determination (R2) of Cu reduction 0.9610 and maximum stabilisation was obtained in 3cm ball size and 5.5cm distance and 4 month interval time. This result revealed that the BSB in effective for Cu reduction in coastal sediment.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.793-797
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• 2005

This study introduces Electro-chemical Mechanical Deposition(ECMD) lot making Cu interconnect. ECMD is a novel technique that has ability to deposit planar conductive films on non-planar substrate surfaces. Technique involves electrochemical deposition(ECD) and mechanical sweeping of the substrate surface Preferential deposition into the cavities on the substrate surface nay be achieved through two difference mechanisms. The first mechanism is more chemical and essential. It involves enhancing deposition into the cavities where mechanical sweeping does not reach. The second mechanism involves reducing deposition onto surface that is swept. In this study, we demonstrate ECMD process and characteristic. We proceeded this experiment by changing of distribution of current density on divided water area zones and use different pad types.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.170-170
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• 1999

We studied Nb growth mode on Cu(100) surface by scanning tunneling microscopy (STM) at room temperature. Nb/Cu is immiscible at room temperature and thus is an ideal system for studying surface alloy formation. Initially deposited Nb atoms are incorporated subsurface on Cu(100). After annealing, they are preferentially found at step edges and appear as bright dots surrounded by dark rings. Ordering emerges from step edges as annealed. Ordered ({{{{ SQRT { 5} }$\times${{{{ SQRT { 5} }}}})R 26.6$^{\circ}$phase Nb structure is formed at $\theta$<0.2ML after annealing to 50$0^{\circ}C$. At higher coverage, $\theta$>0.25, annealing leads to p(2$\times$2) phase. due to large mismatch in lattice parameters, the domain is limited to a few tens of nm2. Growth kinetics of the system will be discussed.

• 한국세라믹학회지
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• 제31권3호
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• pp.312-320
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• 1994

Effect of the laser shot number on the particulates density of the pulsed laser deposited YBa2Cu3O7-x thin films and the laser irradiated surface morphology of the YBa2Cu3O7-x bulk target have been investigated. Until 100 laser shots of cumulative irradiation, the films has the particulates density of ~103 mm-2. However, after 100 laser shots, the density was increased more than 10 times. This results has been explained by the change of particulate ejection path with the development of conical structure at the target surface.