• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.466-473
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• 2009

Our group previously observed the intrinsic stress evolution of Cu thin films during deposition by changing the deposition rate. Intrinsic stress of Cu thin films, which show Volmer-Weber growth, is reported to display three unique stress stages, initial compressive, broad tensile, and incremental compressive stress. The mechanisms of the initial compressive stress and incremental compressive stages remain subjects of debate, despite intensive research inquiries. The tensile stress stage may be related to volume contraction through grain growth and coalescence to reduce over-accumulate Cu adatoms on the film surface. The in-situ intrinsic stresses behavior in Cu thin films was investigated in the present study using a multi-beam curvature measurement system attached to a thermal evaporation device. The effect of substrate surface roughness was monitored by observed the in-situ intrinsic stress behavior in Cu thin films during deposition, using $100{\mu}m$ thick Si(111) wafer substrates with three different levels of surface roughness.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.4
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• pp.349-358
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• 2000

Fabrication and Characterization of Bi$_{2}$/Sr$_{2}$/CaCu$_{2}$/O$_{8}$(Bi2212) superconductor thick films were fabricated successfully on C tapes by liquid reaction between Cu-free precursors of Bi$_{x}$/SrCaO/$_{y}$(x=1.2-2) and Cu tapes. Cu-free Bi-Sr-Ca-O powder mixtures were screen-printed on Cu tapes and heat-treated at 850-87$0^{\circ}C$ for several minutes in air oxygen nitrogen and low oxygen pressure. In order to obtain the optimum heat-treatment condition we studied the effect of the precursor composition the printing thickness and the heat-treatment atmosphere on the superconducting properties of Bi2212 films and the reaction mechanism. Microstructures and phases of thick films were analyzed by films and the reaction mechanism. Microstructures and phases of thick films were analyzed by optical microscope and XRD. The electric properties of superonducting films were examined by the four probe method. At heat-treatment temperature the thick films were in a partially molten state by liquid reaction between CuO of the oxidized copper tape and the precursors which were printed on Cu tapes. During the heat-treatment procedure Bi2212 superconducting particle nucleate and grow in preferred orientations.ons.s.

• Electronic Materials Letters
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• v.14 no.6
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• pp.678-688
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• 2018

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.80-81
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• 1996

No Abstract (See Full-text)

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.05a
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• pp.14.1-14.1
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• 2008

• Proceedings of the Korean Magnestics Society Conference
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• 2008.12a
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• pp.7.1-7.1
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• 2008

• Korean Journal of Materials Research
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• v.26 no.12
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• pp.714-720
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• 2016

We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of as-deposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37 %, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.10
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• pp.1480-1488
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• 2003

Synthesis of carbon nanomaterials on a substrate coated with metal nitrates using an ethylene fueled inverse diffusion flame was illustrated. The effects of radial distance, residence time of the substrate, and hydrocarbon composition on the synthesis of carbon nanomaterials were investigated. The effects of catalyst metal particles were also studied using SUS304 substrates coated with Fe(NO$_3$)$_3$ (ferric nitrate, nonahydrate) and Ni(NO$_3$)$_2$(nickel nitrate, hexahydrate), and Cu substrate. Carbon nanomaterials, with diameters ranging from 30 - 70 nm, were observed on the substrate for both cases of using substrates only and using them with metal nitrates. In case of using the substrate with metal nitrates, the formation and growth of carbon nanomaterials were occurred in the lower temperature region than that of using the substrates only due to the easy activation of the metal particles coated on the surface of the substrates.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.147-151
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• 1999

YBCO step-edge Josephson junction were fabricated on sapphire substrates. The steps were formed on R-plane sapphire substrates by using Ar ion milling with PR masks. The step angle was controlled in the wide range from 25$^{\circ}$ to 50$^{\circ}$ by adjusting both the Ar ion incident angle and the photoresist mask rotation angle relative to the incident Ar ion beam. CeO$_2$ buffer layer and in-situ YBa$_2Cu_3O_{7-{\delta}}$ (YBCO) thin films was deposited on the stepped R-plane sapphire substrates by pulsed laser deposition method. The YBCO film thickness was varied to obtain the ratio of film thickness to step height in the range from 0.5 to 1. The step edge junction exhibited RSJ-like behaviors with I$_cR_n$ product of 100 ${\sim}$ 300 ${\mu}$V, critical current density of 10$^3$ ${\sim}$ 10$^5$ A/ cm$^2$ at 77 K.

• Progress in Superconductivity
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• v.5 no.2
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• pp.94-97
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• 2004

Step-edge Josephson junctions (SEJ) have been fabricated on sapphire substrates with in situ deposited films of CeO$_2$ buffer layer and YBa$_2$Cu$_3$O$_{7}$ films on the low angle steps. Direct coupled SQUID magnetometers with the SEJ were formed on 1 cm X 1 cm R-plane sapphire substrates. Typical 5-${\mu}{\textrm}{m}$-wide Josephson junctions have R$_{N}$ of 3 Ω and I$_{c}$ of 50 $mutextrm{A}$ at 77 K. The direct coupled SQUID magnetometers were designed to have pickup coils of 50-${\mu}{\textrm}{m}$-wide 16 parallel loops on the 1 cm X 1 cm substrates with outer dimension of 8.8 mm X 8.8 mm. The SEJ SQUID magnetometers exhibit relatively low 1/f noise even with dc bias control, and could be stably controlled by flux-locked loops in the magnetically disturbed environment. Field noise of the do SQUID was measured to be 200∼300 fT/Hz$^{1}$2/in the white noise region and about 2 pT/Hz$^{1}$2/ at 1 Hz when measured with dc bias method.hod.d.