• Title/Summary/Keyword: Cu plate

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The Study on Coatings to Improve the Radiative Heat Dissipation of Aluminum Alloy (알루미늄 합금의 복사방열향상을 위한 코팅연구)

  • Seo, Mihui;Kim, Donghyun;Lee, Junghoon;Chung, Wonsub
    • Journal of the Korean institute of surface engineering
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    • v.46 no.5
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    • pp.208-215
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    • 2013
  • The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux($W/m^2$) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.

Oxidation Behavior of Ti Added Alumina Dispersion Strengthening Copper Alloy (티타늄이 첨가된 알루미나 분산강화 동합금의 산화물 형성 거동)

  • Joh, Hongrae;Han, Seung Zeon;Ahn, Jee Hyuk;Lee, Jehyun;Son, Young Guk;Kim, Kwang Ho
    • Korean Journal of Materials Research
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    • v.25 no.4
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    • pp.202-208
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    • 2015
  • Alumina dispersion strengthening copper(ADSC) alloy has great potential for use in many industrial applications such as contact supports, frictional break parts, electrode materials for lead wires, and spot welding with relatively high strength and good conductivity. In this study, we investigated the oxidation behavior of ADSC alloys. These alloys were fabricated in forms of plate and round type samples by surface oxidation reaction using Cu-0.8Al, Cu-0.4Al-0.4Ti, and Cu-0.6Al-0.4Ti(wt%) alloys. The alloys were oxidized at $980^{\circ}C$ for 1 h, 2 h, and 4 h in ambient atmosphere. The microstructure was observed with an optical microscope(OM) and a scanning electron microscope(SEM) equipped with energy-dispersive X-ray spectroscopy(EDS). Characterization of alumina was carried out using a 200 kV field-emission transmission electron microscope(TEM). As a result, various oxides including Ti were formed in the oxidation layer, in addition to ${\gamma}$-alumina. The thickness of the oxidation layer increased with Ti addition to the Cu-Al alloy and with the oxidation time. The corrected diffusion equation for the plate and round type samples showed different oxidation layer thickness under the same conditions. Diffusion length of the round type specimen had a value higher than that of its plate counterpart because the oxygen concentration per unit area of the round type specimen was higher than that of the plate type specimen at the same diffusion depth.

Fabrication of RRR Measuring System for Disseminating IEC International Standard (IEC국제규격을 보급하기 위한 RRR측정장치 제작)

  • Kyu Won Lee;Kyu Tae Kim
    • Progress in Superconductivity
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    • v.4 no.1
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    • pp.80-85
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    • 2002
  • In order to disseminate the IEC international standard of RRR measurement of Cu/Nb/-Ti composite superconductors, a measuring system was developed at KRISS. The system consisted of helium reservoir, base plate, thermometer, voltmeter and current source. The helium reservoir and base plate provided a stable temperature of a range from 4.2 K to 300 K and the voltmeter measured several order of $mutextrm{V}$ on specimen for obtaining RRR of the Cu/Nb-Ti composite superconductor. Three specimens of the Cu/Nb-Ti composite superconductors were measured using this system for characterizing their RRR. The resistance-temperature curves ortho specimens showed 10/sup -6/ to 10/sup -5/ Ohms near transition temperature and 10/sup -4/ to 10/sup -3/ Ohms at 293 K. The RRR values of the specimens were 145, 71 and 140, respectively.

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A Study on the Electroplating using Macroemulsion in High Pressure (고압 매크로에멀젼을 이용한 전해도금에 관한 연구)

  • Park, Ji-Young;Yang, Jun Youl;Suh, Dong Jin;Yoo, Ki-Pung;Lim, Jong Sung
    • Korean Chemical Engineering Research
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    • v.43 no.1
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    • pp.53-59
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    • 2005
  • In this study, the supercritical electroplating was investigated by forming macroemulsion of electroplating solution using surfactant in supercritical $CO_2$. The fluorinated analogous AOT surfactant, sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate which has both '$CO_2$ philic' chains and 'hydrophilic' head group was used as a surfactant, and Ni plate and Cu plate were used as the anode and the cathode, respectively. Electroplating was carried out in the conventional method and the supercritical macroemulsion and both results were compared. The supercritical electroplating was carried out in various concentration of surfactant such as 2, 4, 7 wt%, the volume ratio of Ni-plating solution to $CO_2$ was varied in the range of 10-70 vol%, and propane was used as a supercritical fluid instead of $CO_2$. According to the experimental results, the plated surface of Ni on Cu plate performed in supercritical macroemulsion was better than that, in conventional state. In the image of Ni surface plated on Cu plate in supercritical state, there were fewer pin-holes and pits comparing with that in the conventional process. The current and conductivity was increased as the volume ratio of Ni-plating solution to $CO_2$ was increased and the current and the amount of Ni plated on Cu plate were decreased as the concentration of surfactant become higher. In addition, in case of the continuous phase, using $CO_2$ was more effective than using $CO_2$.

Effect of Tin Addition on the Melting Temperatures and Mechanical Properties of Al-Si-Cu Brazing Filler Metals (저온 브레이징용 Al-Si-Cu 합금의 Sn 첨가에 따른 융점 및 기계적 특성 변화 연구)

  • Kim, Min Sang;Park, Chun Woong;Byun, Jong Min;Kim, Young Do
    • Korean Journal of Materials Research
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    • v.26 no.7
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    • pp.376-381
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    • 2016
  • For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

Large-Scale Synthesis of Cu2O Nanowires by Thermal Oxidation Method (열 산화법을 이용한 Cu2O 나노선의 대면적 합성)

  • Lee, Geun-Hyoung
    • Korean Journal of Materials Research
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    • v.24 no.7
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    • pp.388-392
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    • 2014
  • $Cu_2O$ nanowires were synthesized at large scale on copper plate by thermal oxidation in air. The effect of oxidation time and temperature on the morphology of the nanowires was examined. The oxidation time had no effect on the diameter of the nanowires, while it had a great effect on the density and the length of the nanowires. The density and the length of the nanowires increased, and then decreased, with increasing oxidation time. The oxidation temperature had a tremendous effect on the size-distribution as well as the density of the nanowires. When the oxidation temperature was $700^{\circ}C$, uniform size-distribution and high density of the nanowires was achieved. At lower and higher temperatures, the density of the nanowires was lower, and they displayed a broader size-distribution. It is suggested that the $Cu_2O$ nanowires were grown via a vapor-solid mechanism because no catalyst particles were observed at the tips of the nanowires.

Rate Augmentation of Exothermic Hydration in the CaO Packed Bed (CaO 충전층의 수화발열반응 촉진)

  • Chung, Soo-Yull;Kim, Jong-Shik
    • Solar Energy
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    • v.14 no.2
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    • pp.91-101
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    • 1994
  • Heat release characteristics of a CaO packed bed reactor which is used for a chemical heat storage device has been studied. We employed Cu-plate fins to release the heat of reaction of the CaO packed bed inside the reactor fast and effectively. Two-dimensional analysis of unsteady state heat flow inside the bed was performed as a function of time and under various conditions of the Cu-plates. It is noted that the time required to release the heat of reaction with Cu fins is reduced more than twice fast compared to that without Cu fins. That was largely dependent upon the number of Cu-plate, as well.

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Y-Ba-Cu-O Single Crystals Growth by Skull Method (스컬(Skull)법에 의한 Y-Ba-Cu-O계 단결정 성장)

  • 정대식;오근호
    • Journal of the Korean Ceramic Society
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    • v.27 no.1
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    • pp.43-47
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    • 1990
  • An attempt was made to grow Y-Ba-Cu-O single crystals by skull method(cold crucible process). Grown YBa2Cu3O7-x(YBC) single crystals were obtained from the upper part of the YBC solid mixture. There were plate-like YBC single crystals aligned with solidified flux along the crystal growth direction. Single crystal size was (5$\times$2$\times$0.2㎣) and was grown to a-b plane of YBC crystal structure which can flow super currents. Optical microscope and X-ray diffraction were employed characterize these microstructure and YBC single crystals.

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Microstructure Analysis of Cu/Bi2212 High Temperature Superconducting Tapes with Meat-Treatment Atmosphere (열처리 분위기에 따른 동/Bi2212 고온초전도 테입의 미세구조)

  • Han, Sang-Chul;Sung, Tae-Hyun;Han, Young-Hee;Lee, Jun-Seong;Lee, Won-Tak;Kim, Sang-Jun
    • 한국초전도학회:학술대회논문집
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    • v.9
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    • pp.388-391
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    • 1999
  • Well oriented Bi2212 superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape method in which Cu-free BSCO powder mixture was' printed on copper plate and heat-treated. And we examined the effect of heat-treatment atmosphere for the superconducting properties and microstructure of Bi2212. The composition of Cu-free BSCO powder mixture was Bi$_2O_3$ : SrCO$_3$ : CaCO$_3$ = 1.2~2 : 1 : 1 and the heat-treatment for the superconducting formation reaction was performed in air, oxygen, nitrogen and low oxygen pressure. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Among the nonsuperconducting phases, it is known that the (Sr,Ca)CuO$_3$ phase restrain the formation of the Bi2212 superconducting phase. Because a kind of the nonsuperconducting phases is controled by the oxygen partial pressure, the optimum condition in which the remnants of the second phases don't leave in the fully processed conductor was determined by XRD and the critical tempera to re (Tc) analysis.

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Effect of Pre-annealing on the Formation of Cu2ZnSn(S,Se)4 Thin Films from a Se-containing Cu/SnSe2/ZnSe2 Precursor

  • Ko, Young Min;Kim, Sung Tae;Ko, Jae Hyuck;Ahn, Byung Tae;Chalapathy, R.B.V.
    • Current Photovoltaic Research
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    • v.10 no.2
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    • pp.39-48
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    • 2022
  • A Se-containing Cu/SnSe2/ZnSe precursor was employed to introduce S to the precursor to form Cu2ZnSn(S,Se)4 (CZTSSe) film. The morphology of CZTSSe films strongly varied with two different pre-annealing environments: S and N2. The CZTSSe film with S pre-annealing showed a dense morphology with a smooth surface, while that with N2 pre-annealing showed a porous film with a plate-shaped grains on the surface. CuS and Cu2Sn(S,Se)3 phases formed during the S pre-annealing stage, while SnSe and Cu2SnSe3 phases formed during the N2 pre-annealing stage. The SnSe phase formed during N2 pre-annealing generated SnS2 phase that had plate shape and severely aggravated the morphology of CZTSSe film. The power conversion efficiency of the CZTSSe solar cell with S pre-annealing was low (1.9%) due to existence of Zn(S.Se) layer between CZTSSe and Mo substrate. The results indicated that S pre-annealing of the precursor was a promising method to achieve a good morphology for large area application.