• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• Applied Chemistry for Engineering
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• v.8 no.4
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• pp.568-574
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• 1997

The effect of microencapsulation of maetal hydride (MH) with copper on the electrode performance of a Ni/MH battery has been investigated. The MH electrodes were prepared with a combination of cold press and paste methods. The discharge capacity of the electrode increased with an addition of small amounts if CMC into the electrode, but decreased when heat-treated in an oxygen-free nitrogen flow. The capacity of a Cu-coated $LaNi_5$ electrode was higher than that of LaNi5electrode. The discharge capacity of the electrode prepared with Cu-coated $LaNi_5$ increased with the increase of copper content in the electrode. It is considered that the increase of copper content enhanced the current density on the electrode surface, leading to the increase of the discharge capacity The MH electrode coated by an acidic electroless plating method showed much higher discharge capacity than that using an alkaline electroless plating method. The discharge capacity of the $LaNi_{4.5}Al_{0.5}$ electrode was higher than that of the $LaNi_5$ electrode. Also, the effect of microencapsulation on the deactivation of $LaNi_5$ was studied using an absorption-desorption cycle in CO-containing hydrogen.

• Journal of Institute of Convergence Technology
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• v.8 no.1
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• pp.33-39
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• 2018

The screen printing method for forming the electrode by applying the existing pressure is difficult to apply to thin wafers, and since expensive Ag paste is used, it is difficult to solve the problem of cost reduction. This can solve both of the problems by forming the front electrode using a plating method applicable to a thin wafer. In this paper, the process conditions of electrode formation are optimized by using LIEP (Light-Induced Electrode Plating). Experiments were conducted by varying the Ni plating bath temperature $40{\sim}70^{\circ}C$, the applied current 5 ~ 15 mA, and the plating process time 5 ~ 20 min. As a result of the experiment, it was confirmed that the optimal condition of the structural characteristics was obtained at the plating bath temperature of $60^{\circ}C$, 15 mA, and the process time of 20 min. The Cu LIEP process conditions, experiments were conducted with Cu plating bath temperature $40{\sim}70^{\circ}C$, applied voltage 5 ~ 15 V, plating process time 2 ~ 15 min. As a result of the experiment, it was confirmed that the optimum conditions were obtained as a result of electrical and structural characteristics at the plating bath temperature of $60^{\circ}C$ and applied current of 15 V and process time of 15 min. In order to form Ni silicide, the firing process time was fixed to 2 min and the temperature was changed to $310^{\circ}C$, $330^{\circ}C$, $350^{\circ}C$, and post contact annealing was performed. As a result, the lowest contact resistance value of $2.76{\Omega}$ was obtained at the firing temperature of $310^{\circ}C$. The contact resistivity of $1.07m{\Omega}cm^2$ can be calculated from the conditionally optimized sample. With the plating method using Ni / Cu, the efficiency of the solar cell can be expected to increase due to the increase of the electric conductivity and the decrease of the resistance component in the production of the solar cell, and the application to the thin wafer can be expected.

• Journal of the Korean Ceramic Society
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• v.36 no.3
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• pp.284-292
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• 1999

고체함량을 변화시킨 NiCuZn 페라이트 페이스트를 사용하여 스크린 인쇄법으로 7.7$\times$4.5$\times$1.0 nm 크기의 칩인덕터를 제조한 후, 페라이트 페이스트의 고체함량에 따른 수축률, 소결밀도, 미세구조, 계면반응 등의 물리적 특성 및 자기적 특성 변화를 분석하였다. 조온소결을 위하여 attrition milling 공정을 통하여 미세분말을 준비하였으며, 소결온도는 880~94$0^{\circ}C$로 변화시켰다. 90$0^{\circ}C$에서 2시간 열처리된 페라이트 후막의 소결밀도는 고체함량이 50,55,60%로 증가할수록 5.12,5.14,5.18g/㎤로 증가하였으며, 이에 따라 칩 인덕터 시편들의 주파수 10 MHz에서 L값이 2.1,2.3,2.5 $\mu$H로 커졌다.Q값은 소결밀도 증가에 의한 Q값 증가효과와 아울러 입자가 커짐에 따른 반대효과로 인하여 고체함량에 따라 87,90,94로 큰 변화가 없었다. 페라이트 페이\ulcorner의 고체함량 및 소결온도와 무관하게 Ag 성분의 페라이트 쪽으로의 확산현상은 나타나지 않았다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.35-38
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• 1993

SCLD(supercondocting current 1imiting device) with YBaCuO superconductor was fabricated by the sol-gel and the doctor-blade method. Critical current density ($J_{c}$) and critical current ($I_{c}$) of the SCLD are 100.27 A/$cm^2$and 1A at 77K and the electrodes contact with SCLD by silver paste. The SCL was connected with test circuit in series. When apple iud current exceed critical current value of the SCLD in testing circuit, the SCLD ristricts the over current by generating resistance itself without delay. Resistance of SCLD increase lineary 0 to 1.6$\Omega$ in propotion to applied current above the critical current $I_{c}$.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 1998.11a
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• pp.71-75
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• 1998

The objective of this study is to investigate geochemical characteristics of mine wastes including tailings in various abandoned mines in Korea. Tailings and wastes were sampled in and around 39 metalliferous mines, and analysed heavy metal concentrations including Cd, Cu, Pb and Zn extracted by 0.1N HCl and aqua regia by Atomic Absorption Spectrometry. Measurements of paste pH and lime requirement were carried out to examine a general geochemical characteristics of the materials. Lots of mine wastes were characterized by very low pH values of 2 to 4 and high lime requirement to control neutralization of the wastes. In addition, elevated levels of heavy metals were found in various mine wastes extracted by both 0.lN HCl and aqua regia. Because the mine wastes can be dispersed into the downstream by clastic movement and wind-blow, it is necessary to control the materials with a proper method for their reclamation.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1881-1883
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• 2001

We manufactured a micro CPL by LlGA process, a new conceptual ultra-fine and precise forming method, using X-ray lithography process. We fabricated a BN X-ray mask having properties of good X-ray transmittance and large mechanical strength. Micro CPL was manufactured by dividing into an upper plate and a low plate. Each of plates was bonded by Ag paste screen printing. The upper plate was fabricated on glass wafer to observe flow and phase transformation of cooling solution. The lower plate was manufactured by Cu electroplating for good heat transmission. Precision of inner Parts, micro pin and micro channel, of manufactured micro CPL is under ${\pm}2{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.