• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.104-107
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• 2001

In order to investigate the effect of Ge addition to the Cu matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt % Ge alloys were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$. The values of AC loss of Ge added wires were decreased to 40 % compare with no addition wire. Low AC loss was due to segregation of Ge rich layer in the Cu-Ge matrix. If Ge added wire with thin Nb filaments were fabricated, slow diffusion rate of Sn would be overcome and decreased AC loss that is weak Point of internal tin method.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.2
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• pp.83-87
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• 2003

$(Nd/Y)_{1.8}Ba_{}2.4Cu_{3.4}O_{7-x}$high $T_c$ superconductor was directionally grown by floating Bone melt growth process with a large temperature gradient in air. Cylindrical green rods of (Nd/Y)1.8 oxides were fabricated by cold isostatic pressing (CIP) method using rubber mold. Microstructures were observed by SEM and TEM and superconducting properties were measured by a SQUID magnetometer. Nonsuperconducting $(Nd/Y)_2BaCuO_5$ inclusions were uniformly distributed within the superconducting $(Nd/Y)Ba_2Cu_3O_x$ matrix. The directionally melt-textured (Nd/Y) 1.8 superconductor showed an onset Tc $\geq$ 90 K and a sharp superconducting transition.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.54-54
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• 2003

We have developed a Cu-based bulk amorphous composite reinforced with a micron-sized crystalline phase, the (Cu60Zr30Ti10)95Ta5 amorphous matrix composite. The composite demonstrates the ultimate strength of 2332 MPa with a dramatically enhanced fracture strain of 15.3 %. Macroscopic observation of the fractured (Cu60Zr30Ti10)95Ta5 amorphous matrix composite showed the development of multiple shear bands along with numerous branching and deflection of shear bands. Microscopic observation on the amorphous matrix of the composite showed that cracks propagate through the residual amorphous matrix located between nanocrystallites, which had formed during deformation. Simulations based on finite element method were conducted to understand the formation mechanisms of multiple shear bands, the initiation site of shear bands, and interaction of shear bands with crystalline particles. Other microscopic fracture mechanism responsible for the enhanced plasticity was discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.313-316
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• 2008

This work sought to examine the suitability of twin roll strip casting for Ag-27%Cu-25%Zn-3%Sn brazing alloy (BAg-7A) and to investigate the mechanical properties and microstructure of the strip. The effect of aging heat treatment on the properties was also studied,. This new manufacturing process has applications in the production of the brazing alloy. XRD and microstructural analysis of the Ag-27%Cu-25%Zn-3%Sn strip represented eutectic microstructure of a Cu-rich phase and a Ag-rich matrix regardless of heat treatment. The results of mechanical tests showed tensile strength of 470MPa, a significant enhancement, and an 18% elongation of the twin roll casted strip, due mainly to the solid solution strengthening of Zn atoms (${\sim}20%$) in the Cu-rich phases. Tensile results showed gradually decreasing strengths and increasing elongation with aging heat treatment. Microstructural evolution and fractography were also investigated and related to the mechanical properties.

• Journal of Korea Foundry Society
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• v.12 no.4
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• pp.317-325
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• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.926-931
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• 1999

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

• Applied Microscopy
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• v.42 no.3
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• pp.174-178
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• 2012

In the present study, the oxidation behavior of $Cu_{50}Zr_{50}$ and $Cu_{46}Zr_{46}Al_8$ metallic glasses has been investigated using transmission electron microscopy with a particular attention on the oxidation behavior in the supercooled liquid state. Identification of the oxidation product after continuous heating treatment shows that in $Cu_{50}Zr_{50}$ metallic glass, $ZrO_2$ with the monoclinic structure forms on the supercooled liquid as well as on the crystallized matrix. On the contrary, in $Cu_{46}Zr_{46}Al_8$ metallic glass, $ZrO_2$ with the tetragonal structure forms on the supercooled liquid, but that with the monoclinic structure forms on the crystallized matrix. The result indicates that the $Cu_{50}Zr_{50}$ metallic glass exhibits far better oxidation resistance in the supercooled liquid state than the $Cu_{46}Zr_{46}Al_8$ metallic glass.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.3
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• pp.102-108
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• 2018

The objective of this study is to develop the mechanical properties of an AlSiCu aluminum alloy using the two-step solution heat treatment. The microstructure of the gravity casting specimen represents a typical dendrite structure with a secondary dendrite arm spacing (SDAS) of 40 um. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases is generated. The eutectic Si phases are fragmented and globularized with the solution heat treatment. The $Al_2Cu$ intermetallic phase is also resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ may be an optimal condition to enhance the mechanical properties of the AlSiCu aluminum alloy.

• Journal of Powder Materials
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• v.7 no.1
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• pp.12-18
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• 2000

Effects of the microstrucrure of rapidy solidified Al-Pb-Cu-Mg alloys on the wear investigated. In order to overcome the miscility gap between Al and pb under equilibrium conditions, both in the solid and the liquid states, the alloy were rapidy solidifies to produce them in a segregation-free condition. Although the Pb particles showed relatively fine dispersion in the Al matrix in all the alloys by this process. the Al-16Pb alloy was found to have the most favorable microstructure with discretre with discrete Pb particles of abount 0.5 ${\mu}$m in size. With the addition of Cu and Cu-Mg to Al-16Pb, cellular structures were newly formed; not seen in the binary Al-Pb alloy. Wear properties of the Al-Pb binary alloys measured as a function of the sliding speen, sliding distance, and applied load showed that the Al-16Pb alloy has the best wear resistance, as expected from the fine microstructural features in this alloy. The were resistance of the alloy containing Cu-and Cu-Mg was higher than that of the Al-16Pvb alloy, due to matrix strengthening by precipitation hardeing. The wear mechanism was identified by examining the traces and wear debris.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.464-465
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• 2006

Monodispersed and nano-sized Cu powders were synthesized from copper sulfate pentahydrate $(CuSO_4{\cdot}5H_2O)$ inside a nonionic polymer matrix by using wet chemical reduction process. The sucrose was used as a nonionic polymer network source. The influences of a nonionic polymer matrix on the particle size of the prepared Cu powders were characterized by means of X-ray diffraction), scanning electron microscopy), and particle size analysis). The smallen Cu powders with size of approximately 100 nm was obtained with adding of 0.04M sucrose at reaction temperature of $60\;^{\circ}C$. The particle size of the Cu powders prepared by the reduction inside polymer network was strongly dependent of the sucrose content and reaction temperature.