• Korean Journal of Materials Research
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• v.5 no.8
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• pp.1005-1112
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• 1995

The Effects of 0~9% stretching on the microstructure and mechanical properties have been investigated in Al-Li-Cu-Mg alloys. Stretching made T$_1$(Al$_2$CuLi) precipitates finer and more uniform, however, had no effect on the size of $\delta$'. The number of sheared $\delta$'precipitates distributed in the matrix were reduced. The 6% stretching improved the yield strength of the alloys aged at 15$0^{\circ}C$ for 120 hours from 328~342 MPa to 466~488MPa, however, decreased the elongation from 9.7~10.4% to 5.7%.

• Journal of Powder Materials
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• v.14 no.2 s.61
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• pp.123-126
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• 2007

In this work, the dispersion behavior of $Y_2O_3$ particles in binary aluminum (Al)-copper (Cu) cast alloy was investigated with respect to Cu contents of 20 (hypoeutertic), 33 (eutectic) and 40 (hypereutectic) wt.%. In cases of hypo and hypereutectic compositions, SEM images revealed that the primary Al and ${\theta}$ phases were grown up at the beginning, respectively, and thereafter the eutectic phase was solidified. In addition, it was found that some of $Y_2O_3$ particles can be dispersed into the primary Al phase, but none of them are is observed inside the primary 6 phase. This different dispersion behavior of $Y_2O_3$ particles is probably due to the difference in the val- ues of specific gravity between $Y_2O_3$ particles and primary phases. At eutectic composition, $Y_2O_3$ particles were well dispersed in the matrix since there is few primary phases acting as an impediment site for particle dispersion during solidification. Based on the experimental results, it is concluded that $Y_2O_3$ particles are mostly dispersed into the eutectic phase in binary Al-Cu alloy system.

• Korean Journal of Metals and Materials
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• v.47 no.10
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• pp.605-612
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• 2009

The suitability of twin roll strip casting for Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni brazing alloy (known as HS-49D) was examined in the present work and the mechanical properties and microstructure of the strip were also investigated. The effect of annealing heat treatment on the properties was also studied. The new manufacturing process has applications in the production of the brazing alloy. XRD and microstructural analyses of the Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni strip revealed a eutectic microstructure of an Ag-rich matrix (FCC) and a Cu-rich phase (FCC) regardless of heat treatment. The results of mechanical tests showed tensile strength of 434 MPa and 80% elongation for the twin roll casted strip. Tensile results showed decreasing strengths and increasing elongation with annealing heat treatment. Microstructural evolution and fractography were also investigated and related to the mechanical properties.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.6
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• pp.244-252
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• 2004

A stoichiometric mixture of evaporating materials for $CuInSe_2$ single crystal thin films was prepared from horizontal electric furnace. To obtain the single crystal thin films, $_CuInSe2$ mixed crystal was deposited on thoroughly etched semi-insulating GaAs(100) substrate by the hot wall epitaxy (HWE) system. The source and substrate temperatures were $620^{\circ}C$ and $410^{\circ}C$, respectively. The crystalline structure of the single crystal thin films was investigated by the photoluminescence and double crystal X-ray diffraction (DCXD). The carrier density and mobility of $CuInSe_2$ single crystal thin films measured with Hall effect by van der Pauw method are $9.62\times10^{16}/\textrm{cm}^3$, 296 $\textrm{cm}^2$/Vㆍs at 293 K, respectively. The temperature dependence of the energy band gap of the $CuInSe_2$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g$(T) = 1.1851 eV -($8.99\times10^{-4} eV/K)T^2$(T + 153 K). The crystal field and the spin-orbit splitting energies for the valence band of the CuInSe$_2$ have been estimated to be 0.0087 eV and 0.2329 eV at 10 K, respectively, by means of the photocurrent spectra and the Hopfield quasicubic model. These results indicate that the splitting of the Δso definitely exists in the $\Gamma$6 states of the valence band of the $CuInSe_2$. The three photocurrent peaks observed at 10 K are ascribed to the $A_1-, B_1$-와 $C_1$-exciton peaks for n = 1.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.3
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• pp.566-576
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• 1997

This study was performed to evaluate the tensile strength of solder joint in titanium and the wettability of 14K gold solder on titanium. Two pieces of titanium rod 30 mm in length and 3mm in diameter were butt-soldered with a 14K gold solder using the electric resistance heating under flux-argon atmosphere, the infrared heating under argon atmosphere, and the infrared heating under vacuum-argon atmosphere. A tensile test was performed at a crosshead speed of 0.5 mm/min, and fracture surfaces were examined by SEM. To evaluate the wettability of 14K gold solder on titanium, titanum plates of a $17{\times}17{\times}1mm$ were polished with #80-#2000 emery papers, and the spreading areas of solder 10 mg were measured by heating at 840 * for 60 seconds. The solder-matrix interface regions were etched by the solution of 10% KCN-10% (NH4)2S2O8, and analyzed by EPMA. The results obtained were summarized as follows ; 1. The maximum tensile strength was obtained when the titanium surface was polished with #2000 emery paper and soldered using the electric resistance heating under flux-argon atmosphere. Soldering strengths showed the significant difference between the electric resistance heating and the infrared heating(p<0.05). 3. The fracture surfaces showed the aspect of brittle fracture, and the failure developed along the interfaces of solder-matrix reaction zone. 4. The EPMA data for the solder-matrix interface region revealed that the diffusion of Au and Cu occurred to the titanium matrix, and the reaction zone showed the higher contents of Au, Cu and Ti than others.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.15-19
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• 2015

We demonstrated an inspection system for detecting discoloration of PCB Cu ball pad with an OSP surface finish. Though the OSP surface finish has many advantages such as eco-friendly and low cost, however, it often shows a discoloration phenomenon due to a heating process. In this study, the discoloration was analyzed with device-independent CIELAB color space. First of all, the PCB samples were inspected with standard lamps and CCD camera. The measured data was processed with Labview program for detecting discoloration of Cu ball pad. From the original PCB sample image, the localized Cu ball pad image was selected to reduce the image size by the binarization and edge detection processes and it was also converted to device-independent CIELAB color space using $3{\times}3$ conversion matrix. Both acquisition time and false acceptance rate were significantly reduced with this proposed inspection system. In addition, $L^*$ and $b^*$ values of CIELAB color space were suitable for inspection of discoloration of Cu ball pad.

• 한국해양학회지
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• v.15 no.1
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• pp.66-70
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• 1980

A method for the determination of dissolved species of Cd, Co, Cu, Ni, Pb and Zn in sea water by flame atomic absorption spectrophotometry (AAS) is described. Prior to analysis by AAS, these elements are concentrated by coprecipitation with iron pyrrolidinedithiocarbamate at pH 3 because of matrix effects and their low concentration levels in sea water. The detection limits are 0.01, 0.04, 0.02, 0.05, 0.08, and 0.03$\mu\textrm{g}$/l, and the relative standard deviations are 1.0, 2.4, 1.3, 2.9, 2.0 and 2.9% for Cd, Co, Cu, Ni, Pb and Zn, respectively. The method is shown to be satisfactory in terms of recovery and precision for the determination of these metals in sea water.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1651-1653
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• 1996

As electrode materials like as Cu-Pb, Cu-Bi, WC-Ag, W-Ag for vacuum circuit breaker have high chopping current or bad insulation-recovery characteristics, it can affect induction machinery like as transformer and motor. To produce low surge electrode material, it have been suggested Co-Ag-Se electrode which were infiltrated with Ag-Se intermetallic compound into sintered Co matrix. In this study, we would like to represent that production method and microstructure of Co-Ag-Se electrode material. The microstructure and characteristics of Ag-Se intermetallic compound and Co-(Ag-Se) electrode were investigated by using SEM, XRD, EPMA.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.123-128
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• 1996

As electrode materials like as Cu-Pb, Cu-Bi, WC-Ag, W-Ag for vacuum circuit breaker have high chopping current or bad insulation-recovery characteristics, it can affect induction machinery like as transformer and motor. To produce low surge electrode material, it have been suggested Co-Ag-Te electrode which were infiltrated with Ag-Te intermetallic compound into sintered Co matrix in vacuum. In this paper, we would like to represent that production method and microstructure of Co-Ag-Te electrode material in each condition. The microstructure and characteristics of Ag-Te intermetallic compound and Co-(Ag-Te) electrode were investigated by using optical microscope, SEM, XRD, EPMA.

• Journal of Powder Materials
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• v.14 no.6
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• pp.399-404
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• 2007

The Cu-based bulk metallic glass (BMG) composite was fabricated by spark plasma sintering (SPS) using of gas-atomized metallic glass powders and ductile brass powders. No defect such as pores and cavities was observed at the interface between the brass powder and the metallic glass matrix, suggesting that the SPS process caused a severe viscous flow of the metallic glass and brass phases in the supercooled liquid region, resulting in a full densification. The BMG composites shows some macroscopic plasticity after yielding, although the levels of strength decreased.