• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.301-301
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• 2003

In current study, Nanocomposites are reinforced with carbon nanofiber, carbon nanotube and SiC, etc. Since the nano reinforcements have the excellent mechanical, thermal and electrical properties compared with that of existing composites, it has lately attracted considerable attention in the various areas. Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties. Until now, strengthening of the copper alloy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the alloy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conducting material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the cooer matrix composites of high strength and electric conductivity. In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process and align mechanism as well as optimized drawing process parameter are verified via numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of 10∼20$\mu\textrm{m}$ in length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper. it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber Optimal parameter for drawing process was obtained by analytical and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc. The lower drawing angles and lower reduction areas provides the less rupture of co tube is noticed during the drawing process and the better alignment of carbon nanofiber is obtained.

• Journal of Environmental Health Sciences
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• v.19 no.2
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• pp.46-54
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• 1993

This study was carried out on the stabilized/solidified treatment for the reducing leachability of hazardous heavy metals copper, lead, chromium and cadmium in the hazardous sludge which treated to be unleached heavy metals by sodium diethyl dithiocarbamate. Cement matrix was analyzed for the leachability of 24 hrs and dynamic leaching test, structure and the optimum condition for the stabilization and solidification of the hazardous sludge. In 28 days of curing time the unconfined compressive strength was 21.5 kg/cm$^2$ at the ratio of portland cement (0.5)+fly ash (0.25) and 23.5 kg/cmz at the ratio of portland cement (0.5)+fly ash (0.25) + cake (0.25). High concentration of Pb, Cr and Cd in the sea water and Cu in the distilled water were leached at the dynamic leaching test. The concentration of leaching heavy metals for specimens which were tested 24 hrs were found low leachability with decreasing pH of leachant. According to dynamic leaching test, the low level of copper, lead, cadmium and chromium were leached in the cement matrix with sodium diethyl dithiocarbamate. But the effective diffusion coefficient of unleached cement matrix which was treated sodium diethyl dithiocarbamate was decreased above 2 times than that of cement matrix. The relation of leachant renewal period (Y) and cumulative fraction ion leached (X) was the following regression equations. Solidification with unleached agent. Y$_{Cu}$ = 1413752X + 247, Y$_{Pb}$ = 223501IX + 214, Y$_{Cr}$ = 8310601X - 472, Y$_{Cd}$ = 168787X + 1061 The structure of' solidified matrix with X-ray diffraction analysis was composed more Ca(OH)$_2$, Si, Mg(OH)$_2$ and Al in the unleached cement matrix than those in cement matrix.

• Korean Journal of Materials Research
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• v.28 no.12
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• pp.691-695
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• 2018

In this study, we investigate the recycling of aluminum-based metal matrix composites(AMCs) embedded with SiC particulates. The microstructure of the AMCs is characterized by X-ray diffraction and scanning electron microscopy. The possibility of recycling the composite scrap is attempted from the melted alloy and SiC particulates by re-melting, holding and solidification in crucibles. The recovery percentage of the matrix alloy is calculated after a number of holding times, 0, 5, 10, 15, 20, 25 and 30 minutes and for different particulate sizes and weight fractions in the Al matrix. The results show that the recovery percentage of the matrix alloy, as well as the time required for maximum recovery of the matrix, is dependent on the size and weight fraction of SiC particulates. In addition, the percentage recovery increases with particulate size but drops with the particulate fraction in the matrix. The time to reach maximum recovery falls rapidly with an increase in particulate size and fraction.

• Korean Journal of Materials Research
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• v.11 no.5
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• pp.398-404
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• 2001

Effects of coating treatment of metallic Cu film on SiC for Al/SiC composite were studied. The Copper was deposited on SiC by electroless plating method. Al/sic composite was fabricated at temperature range of $670^{\circ}C$ to 90$0^{\circ}C$ under vacuum atmosphere. The wetting behavior of Al/SiC composite were analysed by SEM and XRD. The coating treatment on SiC improved wettability of Al melt on SiC considerably comparing to the non coated SiC. This improved wettability seems strongly concerned to the increase of chemical reactivity between coated layer and Al matrix. The improvement of wettability of Al melt on the Cu coated SiC was closely related to in the initial stage of reaction. The metallic film played an important role in reducing the interfacial free energy and breaking down the aluminum oxide film through the reaction with Al melt. The wetting behavior of the as-received SiC with Al melt was not uniform, indicated by the contact angles from less than $97^{\circ}$to more than $97^{\circ}$.

• Journal of the Korean Society for Heat Treatment
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• v.37 no.2
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• pp.79-85
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• 2024

The effects of annealing heat treatment and the addition of Cu element on the shape memory effect of the NiTi-based alloy were investigated by analyzing differential scanning calorimeter results and characterizing recovery rate through 3D scanning after Vickers hardness test. Through 3D scanning of impressions after Vickers hardness test, the strain recovery rates for specimens without annealing treatment and annealed specimens at 400, 450, and 500℃ were measured as 45.96%, 46.76%, 52.37%, and 43.57%, respectively. This is because as the annealing temperature increases, both B19' and NiTi₂ phases, which can impede martensitic transformation, are incorporated within the NiTi matrix. Particularly, additional phase transformation from R-phase to B19' observed in specimens annealed at 400 and 450℃ significantly contributes to the improvement in strain recovery rates. Additionally, the results regarding the Cu element content indicate that when the total content of Ni and Cu is below 49.6 at.%, the precipitation of fine B19' and NiTi₂ phases within the matrix can greatly influence the transformation enthalpy and temperature range, resulting in relatively lower strain recovery rates in NiTi alloys with a small amount of Cu element produced in this study.

• Journal of Biomedical Engineering Research
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• v.24 no.3
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• pp.203-208
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• 2003

The effect of indium on the microstructure and hardness of a Au-Pt-Cu ternary alloy was investigated using optical microscopy, differential scanning calorimeter, scanning electron microscopy x-ray diffractometry, electron probe microanalizer and vickers hardness tester. A hardness of the solution floated Au-Pt-Cu-0.5In quarternary alloy with 0.5 wt.% was reached a maximum value (162 Hv) in 30 min at 550$^{\circ}C$ in the range of 150 to 950$^{\circ}C$ but that of the alloy was rapidly increased until 30 min with increasing aging time at 550$^{\circ}C$ and after that was remained almost constant value. Also, the microhardness of the matrix Au-Pt-Cu ternary alloy aged at 550$^{\circ}C$ for 30 min was continuously increased with indium contents and the grain size of Au-Pt-Cu ternary alloy decreased as increased indium contents. Analyses of EPMA and XRD revealed that the matrix Au-Pt-Cu-In quarternary alloy is composed of fcc structure and intermetallic InPt$_3$ precipitate with Ll$_2$ structure. Based on this investigation, it can be concluded that an increase in microhardness of Au-Pt-Cu-In quarternary alloy is due to precipitation hardening InPt$_3$ and grain size refinement.

• Journal of Powder Materials
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• v.17 no.6
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• pp.477-481
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• 2010

Cu-Sn based alloys were manufactured by gas atomization spray casting route in order to achieve a fine scale microstructure and a high tensile strength. The spray cast Cu-10Sn-2Ni-0.2Si alloy had an equiaxed grain microstructure, with no formation of brittle ${\delta}-Cu_{41}Sn_{11}$ phase. Aging treatment promoted the precipitation of finely distributed particles corresponding to ${\delta}-Ni_2Si$ intermetallic phase throughout the $\alpha$-(CuSn) matrix. The cold-rolled Cu-Sn-Ni-Si alloy had a very high tensile strength of 1200 MPa and an elongation of 5%. Subsequent aging treatment at $450^{\circ}C$ for 1h slightly reduced the tensile strength to 700 MPa and remarkably increased the elongation up to 30%. This result has been explained by coarsening the precipitates due to over aging and reducing the dislocation density due to annealing effects.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.569-576
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• 1999

In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

• Analytical Science and Technology
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• v.31 no.6
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• pp.240-246
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• 2018

The present study analyzed standard samples of three types of aluminum matrix certified reference materials (CRM) using GD-MS. Calibration curves were constructed for 13 elements (Mg, Si, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Ga, Sn, and Pb), with the slope representing the relative sensitivity factor (RSF). The x- and y-axes of the calibration curve represented ion beam ratio (IBR) and the authenticated value of the standard sample, respectively. In order to evaluate precision and linearity of the calibration curve, RSD and the coefficient of determination were calculated. Curve RSD for every element reflected high precision (within 10 %). For most elements, the coefficient of determination was ${\geq}0.99$, indicating excellent linearity. However, vanadium, nickel, and gallium curves exhibited relatively low linearity (0.90~0.95), likely due to their narrow concentration ranges. Standard RSF was calculated using the slope of the curve generated for three types of CRM. Despite vanadium, nickel, and gallium exhibiting low coefficients of determination, their standard RSF resembled that of the three types of CRM. Therefore, the RSF method may be used for element quantitation. Standard iron matrix samples were analyzed to verify the applicability of the aluminum matrix standard RSF, as well as to calculate the RSD-estimated error of the measured value relative to the actual standard value. Six elements (Al, Si, V, Cr, Mn, and Ni) exhibited an RSD of approximately 30 %, while the RSD of Cu was 77 %. In general, Cu isotopes are subject to interference: $^{63}Cu$ to $^{54}Fe^{2+}-^{36}Ar$ and $^{65}Cu$ to $^{56}Fe-Al^{3+}$ interference. Thus, the influence of these impurities may have contributed to the high RSD value observed for Cu. To reliably identify copper, the resolution should be set at ${\geq}8000$. However, high resolutions are inappropriate for analyzing trace elements, as it lowers ion permeability. In conclusion, quantitation of even relatively low amounts of six elements (Al, Si, V, Cr, Mn, and Ni) is possible using this method.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.53 no.2
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• pp.204-209
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• 2017

In order to use PUR/CuO Composites as the sealing materials for ships equipment, this research has been performed. PUR/CuO composites are produced by using ultrasonic waves. The increase of CuO leads to increase in the tensile strength and shore hardness. The cumulative wear volume shows a tendency to increase in proportional to sliding distance. As the CuO particles of these composites indicated, the friction coefficient was slightly increased. The major failure mechanisms were lapping layers, deformation of matrix, plowing, debonding of particles and microcracking by scanning electric microscopy photograph of the wear tested surface.