• Title/Summary/Keyword: Cu filling

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Bending Behaviors of Stainless Steel Tube Filled with Al5Si4Cu4Mg Closed Cell Aluminum Alloy Foam (발포 Al5Si4Cu4Mg 알루미늄 합금이 충진된 304 스테인리스강 원통의 굽힘저항 특성)

  • Kim, Am-Kee;Lee, Hyo-Jin;Cho, Seong-Seock
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.10
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    • pp.1686-1694
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    • 2003
  • The foam-filled tube beams can be used for the front rail and firewall structures to absorb impact energy during frontal or side collision of vehicles. In the case of side collision where bending is involved in the crushing mechanism, the foam filler would be effective in maintaining progressive crushing of the thin-walled structures so that much impact energy could be absorbed. In this study, bending behaviors of the closed-cell-aluminum-alloy-foam-filled stainless steel tube were investigated. The various foam-filled specimens including piecewise fillers were prepared and tested. The aluminum-alloy-foam filling offered the significant increase of bending resistance. Their suppression of the inward fold formation at the compression flange as well as the multiple propagating folds led to the increase of load carrying capacity of specimens. Moreover, the piecewise foams would provide the easier way to fill the thin-walled shell structures without the drawback of strength.

Studies on Geology and Mineral Resources of the Okcheon Belts -Mineralization in the Vicinity of the Muamsa Granite Stock- (옥천대(沃川帶)의 지질(地質) 및 광물자원(鑛物資源)에 관(關)한 연구(硏究) -무암사화강암(務岩寺花崗岩) 주위에서의 광화작용(鑛化作用)에 관(關)하여-)

  • Yun, Suckew;Kim, Kyu Han;Woo, Jong Sang
    • Economic and Environmental Geology
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    • v.19 no.spc
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    • pp.3-17
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    • 1986
  • Hundred mineral deposits including W-Mo, Pb-Zn-Cu, fluorite and talc occur in the Cambre-Ordovician limestone contacting with the Cretaceous Muamsa and Wolak granitoids in the Susanri-Hwanggangri mineralized zone. In most mineral deposits characterized by metasomatic replacement, skarn and hydrothermal vein types, two distinct tendencies were found as W-Mo mineralization in or/and near granitoid batholith and ($Pb-Zn-Cu(CaF_2)$) mineralization which is gradually increased toward the batholith. W-Mo veins of extensive vein system occupy northly striking fractures whilst $Pb-Zn-Cu-CaF_2$ veins strike northeast or northwest. In this work, three representative lead-zinc-copper deposits choosing the Dangdu, Useog and Eoksu mines were dealt with in detail. Skarn ore bodies in the Dangdu mine were grouped into early diopside rich clinopyoxene-garnet, barren skarn and ore bearing late hedenbergite rich clinopyroxene-garnet skarn. Temperature and $X_{CO_2}$, obtained from hedenbergite-andradite-calcite-quartz mineral equilibria in the Dangdu ore deposits were $580{\sim}650^{\circ}C$ and 0.15~0.3, respectively. Fluid inclusien evidence in the Useog mine indicates that main stage mineralization temperature ranges from 224 to $389^{\circ}C$ with a salinity of 2~17 equivalent wt. percent NaCl. Sphalerites from the Dangdu and Useog mines have 16~17.7 mole percent in FeS which is relatively consistent to those of some other lend-zinc ore deposits in South Korea. Filling tcmjCerature of fluid inclusion frem the Eoksu mine shows deposition of ore within the temperature ranges from 237 to $347^{\circ}C$ and within the salinity ranges from 2.6 to 10.77 equivalent wt. percent NaCl.

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Surface Morphology and Hole Filling Characteristics of CVD Copper (CVD법에 의해 성막된 구리의 표면 형상 및 충진 특성에 관한 연구)

  • Kim, Duk-Soo;Sunwoo, Changshin;Park, Don-Hee;Kim, Jin-Hyuk;Kim, Do-Heyoung
    • Korean Chemical Engineering Research
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    • v.43 no.1
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    • pp.98-102
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    • 2005
  • This article describes a study of chemical vapor deposition (CVD) of copper thin films on TiN substrates using (HFAC)Cu(DMB) as a precursor. The surface morphology and conformality of the Cu films as functions of substrate temperature and the presence or absence of iodine have been investigated. The surface roughness was increased significantly along with decrement of the step coverage by increasing the deposition temperature. The highest conformal films with the lowest surface roughness were obtained using the process of copper CVD, where iodine vapor were discretely introduced into the reactor during the growth of copper.

Joining Properties of CoSb3/Al/Ti/CuMo by Spark Plasma Sintering Process (방전플라즈마 소결 공정을 이용한 CoSb3/Al/Ti/CuMo 접합 특성)

  • Kim, Min Suk;Ahn, Jong Pil;Kim, Kyoung Hun;Kim, Kyung Ja;Park, Joo Seok;Seo, Won Seon;Kim, Hyung Sun
    • Journal of the Korean Ceramic Society
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    • v.51 no.6
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    • pp.549-553
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    • 2014
  • $CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

Prediction of Core Shift using Injection Molding CAE program (사출성형 CAE 프로그램을 이용한 코어 휨의 예측)

  • Moon, Jeong-Yeon;Kwak, Min-Hyuk;Park, Tae-Won;Jeong, Yeong-Deug
    • Design & Manufacturing
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    • v.8 no.2
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    • pp.7-11
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    • 2014
  • The Core-Shift is often generated on injection mold which have thin and long core. And Core-Shift brings out problems for thickness variation and product ejecting process. In this study, analysis of Core-Shift was performed according to change of materials of core(steel P-20, Be-Cu) and various polymers(PP, PC) by using MoldFolw MPI 6.1 which is commercial injection molding analysis program. As the results of analysis, the magnitude of Core-Shift was increased as being use polymer had lower fluidity and lower rigidity core. In the future, we will study the relationship between amount of Core-Shift and ejecting force.

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RESISTANCE OF COFFEE BEANS AND COFFEE CHERRIES TO AIR FLOW

  • Nordin Irbrahim, M.
    • Proceedings of the Korean Society for Agricultural Machinery Conference
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    • 1993.10a
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    • pp.886-895
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    • 1993
  • Experimental were conducted to obtain information on the effect of airflow rates and bed depths on the resistance of coffee cherries and coffee beans available locally (Coffea Liberica). The airflow used were in the range of 0.06 to 0.6 cu. m/s-sq.m. The moisture content of the coffee cherries ranged from 10 % to 50% (wet basis) and that of coffee beans ranged from 12% to 30% )wet basis). Two methods of filling were used i.e. loose fill and packed fill. Pressure drops across the material bed in a vertical column were measured at several depths using inclined manometer. The pressure drop increased directly with air flow rate as well as bed depths. The effects of air flowrates and moisture contents on the resistance in terms of pressure drip per unit bed depth were analysed. The pressure drop per unit depth across the material bed varied slightly due to different depth. The resistance to airflow decreased with the increase in moisture content for loose fill. However, the effect of moisture content is not apparent for packed fill.

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Filling via hole in Si-wafer for 3 Dimensional Packaging (3차원 실장을 위한 Si-wafer의 via hole 딥핑 충전)

  • Hong Seong-Jun;Lee Yeong-U;Kim Gyu-Seok;Lee Gi-Ju;Kim Jeong-O;Park Ji-Ho;Jeong Jae-Pil
    • Proceedings of the KWS Conference
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    • 2006.05a
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    • pp.227-229
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    • 2006
  • 3차원 실장을 하기 위해서 딥핑 방법으로 전기적 신호를 전달할 수 있는 비아를 가진 실리콘 웨이퍼를 제작하였다. 레이저를 이용하여 실리콘 웨이퍼에 개구부가 원형에 가까운 관통 홀을 형성하였다. 관통 홀의 벽에 도금 방법으로 시드 층을 형성하였다. 관통 홀의 충전 금속은 Sn-3.5Ag-0.7Cu 솔더를 사용하였다. 딥핑 방법으로 시드 층과 솔더 사이의 확산 현상 이용하여 전기적 신호를 전달 할 수 있는 비아를 형성하였다. 비아 내부에 일부 기공과 크랙이 발견되기도 했으나 딥핑 방법을 통해서 빠른 시간 내에 비아를 가진 실리콘 웨이퍼를 제작 할 수 있었다.

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Fbrication of tapered Via hole on Si wafer for non-defect Cu filling (결함없는 구리 충진을 위한 경사벽을 갖는 Via 홀 형성 연구)

  • Kim, In-Rak;Lee, Yeong-Gon;Lee, Wang-Gu;Jeong, Jae-Pil
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2009.05a
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    • pp.239-241
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    • 2009
  • DRIE(Deep Ion Reactive Etching) 공정은 실리콘 웨이퍼를 식각하는 기술로서 Si wafer 비아 홀 제조에 주로 사용되고 있다. 즉, DRIE 공정은 식각 및 보호층 증착을 반복함으로써 직진성 식각을 가능하게 하는 공정이다. 또한, 3차원 적층 실장에서 Si wafer 비아 홀에 결함없이 효과적으로 구리 충진을 하기 위해서는 직각형 via보다 경사벽을 가진 via가 형상적으로 유리하다. 본 연구에서는 3차원 적층을 위한 Si wafer 비아 홀의 결함 없는 효과적인 구리 충진을 위해, DRIE 공정을 이용하여 기존의 경사벽을 가지는 via 흘 형성 공정보다 더욱 효과적인 공정을 개발하였다.

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Occurrence of Electrum from the Namseong Gold Mine (남성(南星) 금광산산(金鑛山産) 에렉트럼의 산상(産狀))

  • Lee, Hyun Koo;Kim, Sang Jung;Choi, Seon Gyu
    • Economic and Environmental Geology
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    • v.20 no.4
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    • pp.223-234
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    • 1987
  • This paper describes the mode of occurrence and mineralogical properties of electrum from the Namseong Gold-Silver deposits, for the purpose of obtaining data on the characteristics of the ore deposits and the behavior of gold and silver during the mineralization. The gangue minerals are quartz, calcite, fluorite. Ore minerals are mainly composed of pyrite, sphalerite, chalcopyrite and galena with minor amount of argentite, electrum, pyrargyrite, native silver and unidenfied mineral(Cu-Fe-Ag-S series). Three stage of mineralization recognized are, from early to later, (I) pyrite-electrum stage (II) sphalerite-chalcopyrite-galena-argentite-electrum stage (III) sulfosalts stage. The filling temperature of fluid inclusions in quartz ranges from $225^{\circ}$ to $335^{\circ}C$. The value of sulfur fugacity estimated by means of electrum-tarnish method ranges from $10^{-11.5}$ to $10^{-14}$ atm. The compositional heterogeneity within a single grain with respect to gold concentration is common in the Namseong electrums Chemical composition of electrum ranges generally between 25~45 atom% Au. Its gold content decreases in late stages of mineralization.

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Seed layer deposition using sputtering for high aspect ratio via (고종횡비 비아상의 스퍼터링을 이용한 씨드층 형성)

  • Song, Yeong-Sik;Im, Tae-Hong;Lee, Jae-Ho;Kim, Jong-Ryeol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.68-69
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    • 2013
  • 금속 씨드 층(seed layer)을 직경 $10{\mu}m$, 깊이 $100{\mu}m$, 고종횡비 10:1 비아에 스퍼터링하였다. 금속 씨드 층의 두께는 스퍼터링 시간, 압력, 및 타겟파워를 변화하여 조절하였다. 금속 씨드층 스퍼터링 후 전기도금에 의해 구리 충전을 시도하였다. 비아의 고종횡비가 증가하면 비아 폭이 좁아져 비아의 하부층과 하단 측면 두께는 비아 상부 측면 두께만큼 충분하지 않아 문제가 될 수 있다. 스퍼터링 조건을 최적화 함으로써 씨드층의 특성을 높이고, 비아 홀 지름의 감소 속도를 줄일 수 있었다. 종래의 스퍼터링 방식을 이용하여 비아 입구의 opening percentage를 약 64%로 하고, 하부 씨드층 두께가 46.7 nm 인 금속 씨드층을 형성할 수 있었다. 이 씨드층 상에 전기도금으로 Cu filling을 성공적으로 할 수 있었다.

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