• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.399-399
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• 2011

본 논문에서는 Indium tin oxide (ITO) 투명전극의 성장온도($T_G$)가 Cu(In,Ga)$Se_2$ (CIGS) 박막태양전지에 미치는 영향을 살펴 보았다. ITO 박막은 radio-frequency magnetron sputtering을 이용하여 상온에서 $350^{\circ}C$까지의 다양한 $T_G$ 조건에서 i-ZnO/ glass와 i-ZnO/CdS/CIGS/Mo/glass 기판에 증착되었다. ITO의 비저항과 CdS/CIGS 계면 특성은 $T_G$에 크게 영향을 받았다. $T_G{\leq}200^{\circ}C$에서는 $T_G$가 증가할수록 ITO 저항이 감소하였고 이에 따른 series 저항 감소가 태양전지 성능 향상에 기여하였다. 하지만 $T_G$ > $200^{\circ}C$에서는 CdS 버퍼층의 Cd이 CIGS 층으로 확산되어 소자의 p-n 계면이 파괴되는 것을 발견하였다. $T_G=200^{\circ}C$에서 ITO를 증착한 CIGS 태양전지의 경우 가장 높은 광전변환효율을 보였다.

• Journal of Powder Materials
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• v.31 no.2
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• pp.146-151
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• 2024

Pure SnO₂ has proven very difficult to densify. This poor densification can be useful for the fabrication of SnO₂ with a porous microstructure, which is used in electronic devices such as gas sensors. Most electronic devices based on SnO₂ have a porous microstructure, with a porosity of > 40%. In pure SnO₂, a high sintering temperature of approximately 1300℃ is required to obtain > 40% porosity. In an attempt to reduce the required sintering temperature, the present study investigated the low-temperature sinterability of a current system. With the addition of TiO₂, the compositions of the samples were Sn_1-xTi_xO₂-CoO(0.3wt%)-CuO(2wt%) in the range of x ≤ 0.04. Compared to the samples without added TiO₂, densification was shown to be improved when the samples were sintered at 950℃. The dominant mass transport mechanism appears to be grain-boundary diffusion during heat treatment at 950℃.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.9-15
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• 2008

Mokumegane is one of the sophisticated metal craft techniques enabling wood grain surface effect. To embody the mokumegane, an ingot of well-bonded stacked metal plates has been required. Traditionally prepared mokumegane ingots were bonded using charcoal which enables reduction atmosphere, but sometimes end up with collapse of bonding interface due to the lack of reliable process control. We proposed a systematic vacuum direct bonding process for ingots. First, we confirmed copper//copper homogeneous plate bonding at $900^{\circ}C$ by applying uniaxial press of 2.5kg. We observed 80min required to obtain 90%-bonding ratio and the diffusion coefficient would be enhanced up to 100 times due to surface effect. Second, by considering enhanced diffusion behavior, we also obtained optimum bonding condition in copper/silver heterogeneous plates that ensures 90%-bonding ratio at $700^{\circ}C$ for 10min with apply uniaxial press. A 7-layered copper/silver ingot is prepared successfully, and eventually the prototype mokumegane cases for mobile phone were fabricated with these ingot.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.81-89
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• 2022

The in-situ electromigration(EM) and annealing test were performed at 110, 130, and 150℃ with a current density of 1.3×10⁵ A/cm² conditions to investigate the effect of non-conductive film (NCF) on growth kinetics of intermetallic compound (IMC) in Cu/Ni/Sn-2.5Ag microbump. As a result, the activation energy of the Ni₃Sn₄ IMC growth in the annealing and EM conditions according to the NCF application was about 0.52 eV, and there was no significant difference. This is because the growth rate of Ni-Sn IMC is much slower than that of Cu-Sn IMC, and the growth behavior of Ni-Sn IMC increases linearly with the square root of time, so it has the same reaction mechanism dominated by diffusion. In addition, there is no difference in the activation energy of the Ni₃Sn₄ IMC growth because the EM resistance effect of the back stress according to the NCF application is not large.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Korean Journal of Soil Science and Fertilizer
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• v.43 no.3
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• pp.275-282
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• 2010

The laboratory column experiments were used to transport of metal elements by infiltration-related dispersion and/or diffusion in mine tailing of the Guryong gold mine. The mine tailing shows the neutral pH (for a pore water) and contains quartz, chlorite, pyrite and calcite. Both a non-reactive solute ($Cl^-$ of 100 mg $L^{-1}$) and a reactive solute (1N HCl), were injected continuously through columns. The breakthrough curve in the non-reactive experiment reached at a maximum under 1.5 pore volumes (PV). The longitudinal dispersion (0.607 cm) and hydrodynamic dispersion coefficient ($1.96{\times}10^{-7}cm^{2}sec^{-1}$) were calculated by the slope. In the reactive experiment, the plateau curve was appeared in the pH values of 5.3, 4.5 and 1.7. The releases of metal elements such as Fe, Mn, Al, Cu, Zn, Pb, and Cd were observed to be related to the pH buffering. High concentrations of Mn, Cd and Zn were observed at the first pH plateau (4 PV and pH 5.3), whereas Fe, Cu, Al and Pb were released as the pH decreased to 4.0 or less. The resulting order of metals mobility, based on the effluent water, is Mn=Cd>Zn>Cu>Fe>Al>Pb.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.9-15
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• 2004

We investigated the electrical properties of copolymer low-k materials that are compromised of the PMSSQ(Poly Methyl Silsesquioxane)-based matrix with the BTMSE (Bis Tri Methoxy Silyl Ethane) additives. We manufactured MIS-type test samples using the copolymer as the insulator and measured their leakage current and failure time by means of the BTS (bias-temperature-stress) test. The failure time was observed to decrease drastically when the porosity of the copolymer was increased over $30\%$. From the measurement of failure time with respect to temperature. the activation energy of Cu drift through the copolymer was calculated to be 1.51 eV.

• Journal of the Korean Society for Heat Treatment
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• v.26 no.3
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• pp.105-112
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• 2013

The microstructural changes of Fe-20Mn-12Cr-1Cu alloy have been studied during high temperature gas nitriding (HTGN) at the range of $1000^{\circ}C{\sim}1150^{\circ}C$ in an atmosphere of nitrogen gas. The mixed microstructure of austenite and ${\varepsilon}$-martensite of as-received alloy was changed to austenite single phase after HTGN treatment at the nitrogen-permeated surface layer, however the interior region that was not affected nitrogen permeation remained the structure of austenite and ${\varepsilon}$-martensite. With raising the HTGN treatment temperature, the concentration and permeation depth of nitrogen, which is known as the austenite stabilizing element, were increased. Accordingly, the depth of austenite single phase region was increased. The outmost surface of HTGN treated alloy at $1000^{\circ}C$ appeared Cr nitride. And this was in good agreement with the thermodynamically calculated phase diagram. The grain growth was delayed after HTGN treatment temperature ranges of $1000^{\circ}C{\sim}1100^{\circ}C$ due to the grain boundary precipitates. For the HTGN treatment temperature of $1150^{\circ}C$, the fine grain region was shown at the near surface due to the grain boundary precipitates, however, owing to the depletion of grain boundary precipitates, coarse grain was appeared at the depth far from the surface. This depletion may come from the strong affinity between nitrogen and substitutional element of Al and Ti leading the diffusion of these elements from interior to surface. Because of the nitrogen dissolution at the nitrogen-permeated surface layer by HTGN treatment, the surface hardness was increased above 150 Hv compared to the interior region that was consisted with the mixed microstructure of austenite and ${\varepsilon}$-martensite.