• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.806-809
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• 2000

A key technology for achieving commercial Nb$_3$Sn superconducting wires may be driven from fabrication Process of big-scale billets. Sub-element billet with diameter of 200 mm was designed and fabricated. This billet was hot-extruded and drawn. Cu stabilizer tube, Nb barrier tube and 19 sub-elements inserted Sn core were composed for strand. There was no breakage in the strand that was constituted with annealed sub-element. It was need that billet had to treat HIP because of remove of voids and goad contact between Cu and Nb filaments. Ta wound sheet was better than Ta tube thor barrier in the strand. Ic of the Nb$_3$Sn wire at 127, 4.2K was over than 120 A.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.24-24
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• 2004

• Progress in Superconductivity
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• 제6권1호
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• pp.37-40
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• 2004

We investigated the effects of impurity doping on the electrical transport and magnetic properties of TEX>$(Ru, Sn)(Sr, La)<_2$$EuCeCu_2$$O_{z}$ samples. We found that Sn substitution fur Ru causes a significant decrease of the volume fraction of ferromagnetic phase, as well as a decrease of the temperature where the ferromagnetic component is observed. La substitution for Sr leads to an increase of the magnetic ordering temperature with a moderate change of ferromagnetic component. The experimental results are discussed in conjunction with the structural data, transport properties and a possible change of oxygen content.

• Journal of the Korean Physical Society
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• 제73권9호
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• pp.1370-1376
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• 2018

The electronic structures, magnetic properties and half-metallicity in $Zr_2RuZ$ (Z = Ga, In, Tl, Ge, Sn, and Pb) alloys with $AlCu_2Mn-$ and $CuHg_2Ti$-type structures were investigated using first-principles density functional theory (DFT) calculations. The calculations showed that $Zr_2RuIn$, $Zr_2RuTl$, $Zr_2RuSn$, and $Zr_2RuPb$ compounds with $CuHg_2Ti$-type structures were half-metallic ferromagnets with half-metallic band gaps of 0.18, 0.24, 0.22, and 0.27 eV, respectively. The half-metallicity originated from d-d and covalent hybridizations between the transition metals Zr and Ru. The total magnetic moments of the $Zr_2RuZ$ (Z = In, Tl, Sn, and Pb) compounds with $CuHg_2Ti$-type structures were integer values of $1{\mu}B$ and $2{\mu}B$, which is in agreement with Slater-Pauling rule ($M_{tot}=Z_{tot}-18$). Among these compounds, $Zr_2RuIn$ and $Zr_2RuTl$ were half-metals over relatively wide regions of the lattice constants, indicating that these two new Heusler alloys are ideal candidates for use in spintronic devices.

• 한국분말재료학회지
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• 제20권3호
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• pp.203-209
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• 2013

In this study, STS 316L powders with 3 wt.% Cu and 1 wt.% Sn known as corrosion-resistance reinforcement elements, are prepared to make different kinds of specimens, in which, 3 wt.% Cu and 1 wt.% Sn are added in different forms by mixing, alloying and fully alloying. After sintering in the same condition, the corrosion resistance, wear resistance and their mechanical properties of specimens are tested respectively. According to the comparison, STS 316L specimen sintered at $1270^{\circ}C$ showed the most excellent mechanical property: HRB 78 (hardness), 1130.7 MPa (RCS), 26.6% (Fraction Wear), It was similar with the specimen made of STS316L and fully alloyed Cu and Sn powders, meanwhile, the latter one appears the best corrosion resistance, 75hrs-salt immersion test results. In addition, the specimens with Cu and Sn powders additive showed relatively worse wear resistance in compared with STS316L specimen.

• Advances in materials Research
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• 제2권4호
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• pp.221-235
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• 2013

To obtain bronze with good mechanical properties and high wear resistance, a new bronze (CADZ) is proposed on the basis of various fundamental information. The CADZ consists of the elements Al10.5, Fe4.2, Sn3.7 and Ni3.1, and its design is based on Cu-Al10.5 alloy. The Cu-10.5%Al is very hard and brittle. To obtain the high material ductility of the Cu-10.5%Al alloy, an attempt was made to add a few percent of Sn. Moreover, to make high strength of the Cu alloy, microstructure with small grains was created by the proper amount of Fe and Ni (Fe/Ni = 0.89). The mechanical properties of the CADZ sample have been examined experimentally, and those were compared with commercial bronzes. The tensile strength and wear resistance of CADZ are higher than those for commercial bronzes. Although the ductility of CADZ is the lower level, the strain to failure of CADZ is about 2.0~5.0% higher than that for the Cu-Al10.5 alloy. Details of the microstructural effects on the mechanical properties in the CADZ sample were further discussed using various experimental results.

• Transactions on Electrical and Electronic Materials
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• 제10권5호
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• pp.169-172
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• 2009

The ZnO/CuSn/ZnO (ZCSZ) multilayer films were deposited on polycarbonate substrates using reactive RF and DC magnetron sputtering. The thickness of each layer was 50 nm/5 nm/45 nm, respectively. The ZCSZ films showed a sheet resistance of $44{\Omega}$/Sq, which was an order of magnitude lower than that indium tin oxide (ITO) films. Although the ZCSZ films had a CuSn interlayer that absorbed visible light, both films had similar optical transmittances of 74% in the visible wavelength region. The figure of merit of the ZCSZ films was $1.0{\times}10^{-3}{\Omega}^{-1}$ and was greater than the value of the ITO films, $1.6{\times}10^{-4}{\Omega}^{-1}$. From the X-ray diffraction (XRD) analysis, the ITO films did not show any diffraction peaks, whereas the ZCSZ films showed diffraction peaks for the ZnO (100) and (002) phases. The hardness of the ITO and ZCSZ films were 5.8 and 7.1 GPa, respectively, which were determined using nano-indentation. From these results, the ZCSZ films exhibited greater optoelectrical performance and hardness compared to the conventional ITO films.

• Journal of Electrochemical Science and Technology
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• 제8권3호
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• pp.215-221
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• 2017

The electroless plating process largely consists of substrate cleaning, seed formation (activator formation), and electroless plating. The most widely used activator in the seed formation step is Pd, and Sn ions are used to facilitate the formation of this Pd seed layer. This is problematic because the Sn ions interfere with the reduction of Cu ions during electroless plating; thus, the Sn ions must be removed by a hydrochloric acid cleaning process. This method is also expensive due to the use of Pd. In this study, Cu electroless plating was performed by forming a seed layer using a silver nanosol instead of Pd and Sn. The effects of the Ag nanosol concentration in the pretreatment solution and the pretreatment time on the thickness and surface morphology of the Cu layer were investigated. The degrees of adhesion to the substrate were similar for the electroless-plated Cu layers formed by conventional Pd activation and those formed by the Ag nanosol.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.78-80
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• 2004

현재 전자 부품 실장에 사용되는 솔더 합금들 중에서 Sn-Pb계 솔더는 취급이 용이하고 낮은 가격 및 솔더재로서의 우수한 특성(기계적 및 전기적 특성, 접합성 등) 때문에 산업계에서 가장 널리 사용되고 있다. (중략)

• 한국재료학회지
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• 제19권2호
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• pp.111-114
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• 2009

For the fabrication of core-shell structure bimetallic lead-free solder balls, both the critical temperature ($T_{cr}$) for the phase separation of two immiscible liquid phases and the temperature coefficient of the interfacial tension between the two separated liquid phases are required. In order to obtain this information, the temperature dependence of the surface tension of 60%Bi-24%Cu-16%Sn(-REM) alloys was measured using the constrained drop method. The slope of the temperature dependence of the surface tension changed clearly at a critical temperature for the separation of two immiscible liquid phases. The critical temperature of the 60%Bi-24%Cu-16%Sn alloy was estimated to be 1097K. An addition of 0.05% Ce decreased the critical temperature to 1085K, whereas that of 0.05% La increased it to 1117K. It was found that the surface tension and its temperature coefficient of the 60%Bi-24%Cu-16%Sn alloy were slightly increased by the addition of 0.05% Ce and 0.05% La. In addition, additions of Ce and La increased the temperature coefficient of the interfacial tension.