• Journal of the Korean Ceramic Society
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• v.33 no.4
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• pp.379-384
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• 1996

The H2S sensing mechanism of CuO-SnO2 was confirmed by analyzing the electrical-resistance variation with temperature under an H2S atmosphere. While the resistance of CuO-SnO2 thick film at N2+H2S atmosphere was almost invariant with change in temperature it increased with increasing temperature for air +H2S atmos-phere. This behavior was analyzed using an equation derived from a basic assumption based on the H2S sensing mechanism proposed before. the experimental results are sufficiently explained with the equation derived which showed that the H2S sensing mechanism was reasonable. The equation also gave a detailed analysis and physical meaning to the behavior of the resistance variation with change in H2S concentration.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.71-76
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• 2012

A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi low-temperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at $130^{\circ}C$. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at $180^{\circ}C$ for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as $9m{\Omega}$.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.351-357
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• 2005

Comparison of shear strength and shear energy of the 48Sn-52In solder bumps reflowed on Cu UBM were made with variations of reflow temperature from $150^{\circ}C$ to $250^{\circ}C$ and reflow time from 1 min to 20 min to establish an evaluation method for the mechanical reliability of solder bumps. Compared to the shear strength, the shear energy of the Sn-52In solder bumps was much more consistent with the solder reaction behavior and the fracture mode at the Sn-52In/Cu interface, indicating that the bump shear energy can be used as an effective tool to evaluate the mechanical integrity of solder/UBM interface.

• Korean Journal of Materials Research
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• v.12 no.6
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• pp.436-441
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• 2002

Effect of Sn addition on the stress corrosion cracking(SCC) resistance of the Al-Cu-Mn cast alley was investigated by C-ring teat and electrical conductivity measurement, The electrical conductivity and SCC resistance increased by Sn addition. The alley containing 0,10%Sn showed maximum electrical conductivity and the best SCC resistance. At the same composition, the electrical conductivity and SCC resistance increased from peak aged condition to ever aged condition. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of the alloy was concluded as the anodic dissolution model, The maximum hardness was increased from 130Hv in the Sn-free alloy to 156Hv in the 0.10%Sn added alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.496-499
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• 2000

In order to investigate the effect of Ge addition to the Cu Matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt％ Ge alloy were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240 h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$Sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.222-223
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.216-226
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• 2005

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

• 한국문화재보존과학회:학술대회논문집
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• 2004.10a
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• pp.137-153
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• 2004

We have analyzed the ingredients of 17 pieces of Bronze Age bronze ware, and an additional 22 pieces of Koryo and Chosun dynasty bronze ware. We have also conducted analysis of the extraction sites where these bronze ware items were found. For analyzing the main ingredient the bronze ware items have been divided into 3 groups - Cu-Sn(70?75:20), Cu-Pb-Sn(70:10:10), Cu-Pb-Sn(60:10:20) type respectively. In tile cases of the Cu-Pb-Sn groups the division comes down to differences in the Cu content as the main component, and elements such as Ni, Fe, Co contribute as a micro ingredient. The geographical and periodic characteristics of ancient bronze ware items show that theircompositional element changes from Cu:Sn to Cu:Pb:Sn and the Cu content decreases with the period,while the Pb content increases with the period. Bronze ware items from Suchon Ri, Gongju (that were used in 3 B.C.) form very different categories from 3rd ${\~}$ 2nd B.C.. They additionally formed very different categories from those bronze ware items analyzed in this research. These bronze ware itemsare shown to be geographically close and periodically overlapped, but made of a new elemental composition. This shows an inflow of a production technical culture present in the new bronze wares. The main component content of Cu is lower, and the Co and Fe contents (as microelements) are much higher than that of other bronze ware items. Such facts showthat those bronze ware items used completely different materials from bronze ware items in other cultural areas, or that there were differences in smelting techniques In the places where ancient bronze ware items have been extracted, it is presumed that the materials originated from the southern parts of Korea andnorthern parts and southern parts of China. .As more bronze ware scientific research is compiled one can conclude that that there will be enough scientific evidence to study the Bronze Age culture of Koreasystematically.