• 대한금속재료학회지
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• 제49권3호
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• pp.211-220
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• 2011

To improve the low ductility and high strain-rate sensitivity in Sn-Bi based solder alloys, the influences of the minor additions of alloying elements (Ag, Mn, In) were investigated. The strain-stress curves of various Sn-40Bi(-X) alloys, including a pre-suggested Sn-40Bi-0.1Cu composition were measured using a tensile testing machine. As a result, the elongation and ultimate tensile strength (UTS) values were compared. The small addition (0.5 wt.%) of Ag significantly enhanced the ductility and high strain-rate sensitivity of the alloys at strain rates of $10^{-4}$ to $10^{-2}\;s^{-1}$ mainly due to the increase and refinement of eutectic lamellar structures. The microstructure change increased the area of grain boundaries, thus ameliorating the grain boundary sliding mode. It was also found that Mn is an effective element in enhancing the ductility, especially at the strain rates of $10^{-3}$ to $10^{-2}\;s^{-1}$ The enhancement is likely attributed to the fine and homogeneous microstructure in the alloys containing Mn.

• 한국분말재료학회지
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• 제5권2호
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• pp.89-97
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• 1998

Sintering behavior of nanostructured(NS) W-Cu powders prepared by mechanical alloying (MA) was investigated as a function of sintering temperature. MA NS W-2owt%Cu and W-3owt%Cu composite powders with the crystal size of 20-30 nm were annealed at 90$0^{\circ}C$, and thermal characteristics of those powders were investigated by DSC. Sintering behavior of MA NS W-Cu composite powders was investigated during the solid-state sintering and the Cu-liquid phase sintering. The new nanosintering phenonenon of MA W-Cu powders at solid-state sintering temperature was suggested to explain the W-grain growth in the inside of MA powders. The sintering densification of MA NS W-Cu powders was enhanced at Cu melting temperature by arrangement of MA powders, i.e., the first rearrangement of MA powders was occurred, and then the rearrangement of W-grains in the sintered parts was also took place during liquid-phase sintering, i.e., the second rearrangement was happened. Due to the double rearrangement process of MA NS W-Cu powders, the high sintered density with more than 96%o was obtained and the fine and high homogeneous state of W and Cu phases was achieved by sintering at 1200 $^{\circ}C$.

• 한국주조공학회지
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• 제14권6호
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• pp.508-513
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• 1994

For Pb-20wt%Cu alloys, severe macrosegregation due to density difference of the resulting phases in normal directional solidification has been minimized and a uniformly aligned dendritic structure has been produced by axially rotating the sample of 5mm diameter in conjunction with horizontal directional solidification. Under the constant growth velocity of $20{\mu}m/sec$, increasing the rotation rate from 0.18 to 12rpm results in a transition from an aligned columnar to an equiaxed Cu-dendritic structure. With a constant rotation rate of 0.18rpm, increasing the growth velocity from 10 to $50{\mu}m/sec$ also has promoted a transition from columnar to equiaxed structure.

• 한국재료학회지
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• 제6권2호
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• pp.235-241
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• 1996

등온자비 AuCu에 2.4, 4.3, 6.1at% Zn이 첨가된 합금의 시효경화거동과 상변태를 조사하였다. AuCu l형이 단독으로 존재하는 경우는 경도가 시효초기에 급격히 상승한 후 저하하였고, Zn 첨가량의 증가에 따라 규칙-불규칙 전이온도(Tc)가 약간 하강하였지만, AuCu l형+AuCu ll형의 공존영역의 온도는 훨씬 낮아졌다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.141-145
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• 2001

Sn-3.5Ag 무연 솔더에 Cu를 첨가한 3원계 합금을 만든 후 압연과 열처리한 후 크리프 특성을 연구하였다. 모든 솔더 합금에서 1차 크리프는 거의 관찰되지 않았으며, 2차와 3차 크리프가 대부분을 차지하였고, 최소 크리프 변형율은 Cu 함량이 0.75 wt %에서 최소이었고, 응력 지수는 약 4이었으며, 파단 시간 또한 0.75 wt% Cu에서 가장 길었다. 크리프 기구는 격자 확산에 의한 전위의 상승과 전위 활주에 의한 고온 크리프임을 앞 수 있었으며, Cu의 첨가는 1 wt% 가지 연성에 큰 영향을 주지 않았으나, 1.5 wt% 첨가했을 경우 연성은 크게 감소하였다.

• 열처리공학회지
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• 제33권5호
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• pp.226-231
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• 2020

The Cu-Co-Si alloy shows high strength by forming precipitates by aging precipitation heat treatment of supersaturated solid solution treated with solution treatment such as Cu-Ni-Si alloy, and the Co₂Si precipitated phase is dispersed in the copper matrix. The effect of aging treatment on the microstructure, mechanical and electrical properties of Cu-Co-Si alloys for electronic devices was investigated. As a results of SEM/EDS analysis, it was found that Co₂Si precipitates of 30~300 nm size were distributed in grains. By performing the double aging treatment, it was possible to improve the strength and electrical conductivity by dispersing the fine precipitate evenly.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1654-1656
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• 1996

Generallly speaking, busbar made with Cu or Cu alloys and producted by plastic manufacturing process. In this study, we reacarch the trend and manufacturing of Cu clad Al busbar for low cost and light weight which used for a electric power suply of distributing board. The objectives of this study is the trend of busbar on electric power supply, the process and application for Cu clad Al busbar and the relation between electric properites and manufacturing operating process on contact parties

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.352.2-352.2
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• 2014

In this present work, we report a Cu-Mn alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between Mn-based interlayer interlayer, thermal stability was measured with various low-k dielectrics. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the Mn based self-formed barriers after annealing were determined by the C concentration in the dielectric layers.

• 소성∙가공
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• 제18권6호
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• pp.476-481
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• 2009

The present work demonstrates the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal channel angular pressing(ECAP). From transmission electron microscope observation, the resulting microstructures of Cu-3%Ag alloy deformed by ECAP for 8-pass or more consist of reasonably fine, equiaxed grains without having a strong preferred orientation, suggesting that microstructure evolution is slower than that of pure-Al and its alloys owing to low stacking fault energy. The results of room temperature tension tests reveal that, as the amount of applied strain increases, the tensile strength of submicrocrystalline Cu-3%Ag alloy increases whereas losing both the ductility and the electrical conductivity. Such phenomenon can be explained based on microstructure featured by the non-equilibrium grain boundaries.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1449-1451
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• 1997

Busbar made with Cu or Cu alloys and producted by Plastic manufacturing process. In this study, we research the manufacturing trend of Cu clad Al busbar for low cost and light weight which used for a electric power supply of distributing board. The objectives of this study is the manufacturing of composite busbar on electric power supply, the process and application for Cu clad Al busbar and the relation between electric properties and manufacturing operating process on contact parties.