• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.20-23
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• 2011

Amorphous Ti-(50-x)Ni-xCu (at%) (x = 20, 25, 27, 30) alloy ribbons were prepared by melt spinning. Subsequently, the crystallization behavior of the alloy ribbons was investigated by X-ray diffraction and differential scanning calorimetry. ${\Delta}T$ (the temperature gap between $T_g$ and $T_x$) increased from 33 K to 47 K and the wavenumber ($Q_p$) decreased from 29.44 $nm^{-1}$ to 29.29 $nm^{-1}$ with increasing Cu content from 20 at% to 30 at%. The activation energy for crystallization decreased from 188.5 kJ/mol to 170.6 kJ/mol with increasing Cu content from 20 at% to 25 at%; afterwards, the activation energy remained near constant. Crystallization occurred in two-stage: amorphous-B2-$TiCu_2$ in Ti-Ni-Cu alloys with Cu content less than 25 at%, while it occurred in three-stage; amorphous-B2-TiCu-$TiCu_2$ in Ti-Ni-Cu alloys with Cu content more than 27 at%.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.134-134
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.129-129
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• 1992

• Proceedings of the Korean Nuclear Society Conference
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• 2002.10a
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• pp.260-260
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.30-30
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• 1996

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.11a
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• pp.103-103
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• 2001

• Proceedings of the Korean Nuclear Society Conference
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• 1999.05a
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• pp.232-232
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.133-133
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.05a
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• pp.36-36
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• 1994

• Journal of Powder Materials
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• v.9 no.1
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• pp.19-24
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• 2002

This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.