• 대한기계학회논문집B
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• 제20권4호
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• pp.1437-1448
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• 1996

This paper presents a simplified model for approximate analysis of the solute redistribution in coarsening dendrite arms during solidification of binary metal alloys. By introducing a quadratic concentration profile with a time-dependent coefficient, the integral equation for diffusion in the solid phase is reduced to a simple differential relation between the coefficient and the solid-liquid interface position. The solid fraction corresponding to the system temperature is readily determined from the relation, phase equilibrium and the overall solute balance in which the liquid phase is assumed to be completely mixed. In order to validate the developed model, calculations are performed for the directional solidification of Al-4.9 mass Cu alloy. The predicted eutectic fractions for a wide range of the cooling rate reasonably agree with data from the well-known experiment as well as sophisticated numerical analyses. Also, the results for the back diffusion limits are consistent with available references. Additional calculations show that the characteristic parameters such as the coarsening, density variation and nonlinarity in the phase diagram significantly affect the microsegregation. Owing to the simplicity, efficiency and compatibility, the present model may be suitable for the micro-macroscopic solidification model as a microscopic component.

• Progress in Superconductivity
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• 제8권1호
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• pp.27-32
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• 2006

[$YBa_2Cu_3O_{7-x}$] thin films were deposited on various buffered-templates by a metal organic chemical vapor deposition(MOCVD). Three different templates of $CeO_2/YSZ/CeO_2/pure-Ni(CYC),\;CeO_2/YSZ/Y_2O_3/Ni-3at.%W(YYC)$ and $CeO_2/IBAD-YSZ$/stainless steel were used. The Ni and Ni-W alloy tapes were biaxially textured by cold rolling and annealing heat treatment. The dense YBCO films were grown on both the IBAD and YYC templates with no microcrack, while the YBCO films on the CYC templates were grown with the formation of microcracks and NiO. The YBCO film on the YYC template showed the higher $I_c$ than that on CYC template. Especially, the IBAD templates with a thin $CeO_2$(type I) and thick $CeO_2$(type II) top layer were used to compare the deposition nature of the YBCO on them. Comparing the current property of the YBCO films on IBAD templates, the YBCO film deposited on thick $CeO_2$ layer was better than the film on thin $CeO_2$ layer.

• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 열처리공학회지
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• 제1권1호
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• pp.13-23
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• 1988

The hardenability of alloyed ductile cast irons was studied for 54 different alloy compositions obtained from eight commercial and laboratory foundries. The alloying elements investigated for their effects on hardenability were Si(2.0 to 3.0%), Mn(0.0 to 0.8%), Mo(0.0 to 0.6%), Cu(0.0 to 1.5%), and Ni(0.0 to 1.5%). Two hardenability criteria, a first-pearlite hardenability criterion and a half-hard hardenability criterion, were used to determine hardenability of ductile irons. Prediction models for each hardenability criterion were developed by multiple regression analysis and were well agreed with previous experimental results. Molybdenum was the most potent hardenability promoting element followed by manganese, copper and nickel ; silicon had little effect on hardenability and reduced the hardenability as silicon content increased. When alloying elements were presented in combination, strong synergistic effects on the hardenability were observed especially between molybdenum, copper and nickel. The hardenability of ductile iron was strongly influenced by austenitizing temperature. Increasing austenitizing temperature up to $955^{\circ}C$, hardenability increased gradually but decreasing rate and then decreased as temperature increased above $955^{\circ}C$. Unless reducing segregation by very long-time annealing treatment, the hardenability of ductile iron was not significantly influenced by segregation of alloying elements.

• 열처리공학회지
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• 제9권3호
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• pp.161-168
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• 1996

The purpose of this study is to investigate the effect of impurity level and fabrication processes on the strength, fracture toughness and fatigue resistance of 7075, 7050 and 7175 high strength aluminum forgings. It has been verified that plane strain fracture toughness and fatigue characteristics of a specially processed 7175S-T74 alloy is superior to a conventionally processed 7075-T6/T73, 7050-T74 and 7175-T74 alloys. These beneficial effects primarily arise from two view points, i.e., the effect of reducing the impurity level of iron and silicon has significantly diminished the size and volume fraction of second phase particles such as $Al_7Cu_2Fe$ and $Mg_2Si$. Futher reduction of the amount of nonequilibrium second phase particles has been observed by applying a special fabrication process.

• 소성∙가공
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• 제18권6호
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• pp.500-507
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• 2009

Tensile deformation behavior with different strain rate was investigated. $Zr_{56.2}Ti_{13.8}Nb_{5.0}Cu_{6.9}Ni_{5.6}Be_{12.5}$(bulk metallic glass alloy possessed crystal phase which was called $\beta$-phase of dendrite shape, mean size of $20{\sim}30{\mu}m$ and occupied 25% of the total volume) was used in this study. Maximum tensile strength was obtained as 1.74GPa at strain rate $10^2s^{-1}$ and minimum strength was found to be 1.6GPa at $10^{-1}s^{-1}$. And then, maximum plastic deformation occurred at the strain rate of $5{\times}10^{-2}s^{-1}$ and represented 1.75%, though minimum plastic deformation showed 0%. In the specific range of strain rate, relatively higher plastic deformation and lower ultimate tensile strength were found with lots of shear bands. The fractographical observation after tensile test indicated that vein like pattern on the fracture surface was well developed especially in the above range of strain rate.

• Journal of Welding and Joining
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• 제22권4호
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• pp.35-42
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• 2004

Contact tips are required to have a higher resistance to wear and thus to have an extended life time under the advanced GMAW welding process. Several requirements have been specified and employed by domestic industries for selecting their tips for such a purpose. However no attempt has been made to justify their requirements based on the experimental data of wear resistance or life time of contact tips. In this study, five different contact tips with three different compositions were employed for actual GMA welding up to 4 hours and were evaluated their wear resistance by measuring in every one hour the area of enlarged hole at the exit side. Experimental results clearly showed that the Cr-containing tips strengthened by precipitation hardening have much better resistance to wear than those made by work hardening. It was further noticed that Cr is an excellent alloying element for improving the wear resistance of contact tips only when it is in an properly aged condition. Initial hardness may play some role in the early stage of wear but not in the later stage of welding because the microstructure of tip changes significantly by the prolonged exposure to welding arc heat. Based on these results, critical review has been made on the current requirements employed by domestic industries. Of importance is that a new guideline has been confirmed to be more reasonable.

• 분석과학
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• 제8권4호
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• pp.443-448
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• 1995

Three anode configurations of six-jet, cone-jet and cylindrical-jet are tested for their analytical performance under power mode operation. The effect of pressure, power and gas flow rate on atomic absorption signals have been studied. The increase of atomic absorption signal of sample element is observed at a fixed pressure in all configurations as the gas flow rate increase up to 300-600 seem, and as the power dissipated in the glow discharge cell increase. The lower the pressure is in the glow discharge cell at a fixed discharge power and argon flow rate, the greater the absorbance of sample element is. The optimum conditions are taken from these data and a calibration curve of Cu in low-alloy steel sample is obtained. In this calibration curve, six-jet configuration shows the best analytical results varies as the sample element.

• 한국분말재료학회지
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• 제14권5호
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• pp.303-308
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• 2007

The oxidation of $Fe_{73}Si_{16}B_7Nb_3Cu_1$ nanocrystalline powder has been conducted to investigate its influence on the electromagnetic wave absorption characteristics of the soft magnetic material. Oxidation occurred primarily on the surface of nanocrystals. Oxidation reduced the real part of complex permeability due to the reduction of the relative volume of the powder, which otherwise contributes to the permeability. Oxidation reduced the absorption efficiency of the sheet at frequencies over 1GHz, indicating that the relative contribution of skin depth increments to the absorption was not significant. The pulverization and milling process lowered the optimum crystallization temperature of the material by $40{\sim}50^{\circ}C$ because of the internal energy accumulated during the fragmentation and powder thinning processes.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.37-42
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• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.