• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1697-1699
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• 2004

In this investigation, we have studied the diffusion of the $Cu^+$ ion in the Cu/Ta/SiOCH/Si and Cu/Ta/$SiO_2$/Si MIS-C structure. The Cu ions diffusion into the Ta barrier and SiOCH was examined by shift in flatband voltage of capacitance-voltage measurement and leakage current of current-voltage measurement. These evalution indicated that $Cu^+$ ion diffusion rate in Ta/SiOCH is considerably lower then the Ta/$SiO_2$ structure. And diffusion barrier Ta(50[nm]) is useful barrier against $Cu^+$ ion diffusion up to 450$^{\circ}C$.

• Nuclear Engineering and Technology
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• v.41 no.5
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• pp.709-714
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• 2009

An ion implanter, which can serve as a metal-ion supply, has been constructed and performance tested. Copper ions are generated and extracted from a Bernas ion source with a heating crucible that provides feed gases to sustain the plasma. Sable arc plasmas can be sustained in the ion source for a crucible temperature in excess of $350^{\circ}C$. Stable extraction of the ions is possible for arc Currents less than 0.3 A. Arc currents increase with the induced power of a block cathode and the transverse field in the ion source. $Cu^+$ ions in the extracted beam are separated using a dipole magnet. A $20{\mu}A$ $Cu^+$ ion current can be extracted with a 0.2 A arc current. The ion current can support a dose of $10^{16}ions/cm^2$ over an area of $15\;cm^2$ within a few hours.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.43-49
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• 2015

By the trends of electronic package to be smaller, thinner and more integrative, organic printed circuit board is required to be finer Cu trace pitch. This paper reports on a study of failure mechanism for PCB with fine Cu trace pitch using biased HAST. In weibull analysis of the biased HAST lifetime, it is found that the acceleration factor (AF) of between $135^{\circ}C/90%RH/3.3V$ and $130^{\circ}C/85%RH/3.3V$ is 2.079. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $Cu_xO/Cu(OH)_2$ colloids and Cu dendrites were formed at anode (+) and at cathode (-), respectively. Thus, this gives the evidence that Cu dendrites formed at cathode by $Cu^{2+}$ ion migration lead to a short failure between a pair of Cu nets.

• Journal of the Korean Magnetic Resonance Society
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• v.5 no.1
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• pp.1-12
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• 2001

ZSM-5 gallosilicate molecular sieves was synthesized and cupric ion was ion-exchanged into the gallosilicate. The locations of Cu(ll) species in the framework and their interactions with various adsorbates were characterized by combined electron spin resonance(ESR) and electron spin echo modulation(ESEM) methods. It was found that in a fresh hydrated material, Cu(II) is octahedrally coordinated to six water molecules. This species is located in the channel intersections of two sinusoidal channels and rotates rapidly at room temperature. Evacuation removes some of these water molecules, leaving the Cu(II) coordinated to less water molecules and anchored to of oxygens in the channel wall. Dehydration produces two Cu(II) species, both of which are located in sites inaccessible to oxygen as evidenced by non-broadening of its ESR lines by oxygen. Adsorption of adsorbate molecules such as water, alcohols, ammonia, acetonitrile and ethylene on dehydrated CuNaH-ZSM-5 gallosilicate materials causes changes in the ESR spectrum of Cu(II), indicating the migration of Cu(II) into main channels to form complexes with these adsorbates there. Cu(II) forms a complex with two molecules of methanol, ethanol and propanol, respectively as evidenced by ESR parameters and ESEM data. Cu(II) also forms a square planar complex with four molecules of ammonia, based on the resolved nitrogen superhyperfine interactions and their ESEM parameters. Cu(II) forms a complex with two molecules of acetonitrile based on the ESR parameters and ESEM data. Interestingly, however, only part of Cu(II) interacts indirectly with one molecule of nonpolar ethylene based on ESR and ESEM analyses.

• Applied Science and Convergence Technology
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• v.23 no.1
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• pp.14-26
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• 2014

Copper is an important component from coin metal to electronic wire, integrated circuit, and to lithium battery. Copper oxides, mainly including $Cu_2O$ and CuO, are important semiconductors for the wide applications in solar cell, catalysis, lithium-ion battery, and sensor. Due to their low cost, low toxicity, and easy synthesis, copper oxides have received much research interest in recent year. Herein, we review the crystallization of copper oxides by designing various chemical reaction routes, for example, the synthesis of $Cu_2O$ by reduction route, the oxidation of copper to $Cu_2O$ or CuO, the chemical transformation of $Cu_2O$ to CuO, the chemical precipitation of CuO. In the designed reaction system, ligands, pH, inorganic ions, temperature were used to control both chemical reactions and the crystallization processes, which finally determined the phases, morphologies and sizes of copper oxides. Furthermore, copper oxides with different structures as electrode materials for lithium-ion batteries were also reviewed. This review presents a simple route to study the reaction-crystallization-performance relationship of Cu-based materials, which can be extended to other inorganic oxides.

• Journal of the Korean Society of Radiology
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• v.9 no.3
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• pp.175-181
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• 2015

In this paper, we studied additional filter and Ion chamber combinations to reduce patient dose without decreasing image quality in digital chest x-ray projection. The experiment set 125 kVp, 320 mA, AEC mode. Ion chamber sensors was divided by 4 cases of combinations, then, we measured patient dose and calculated organ dose using PCXMC. Also, physical image assessment using MTF was performed. As a results, The surface entrance dose and organ dose were the lowest when selecting both left and right Ion chamber sensors under the same conditions of additional filter. In image quality assessment, The spatial frequency scored 2.494 lp/mm which was highest when selecting both right and left Ion-chambers and 0.1 mmCu filter. And to conclude, to select both right and left Ion chamber sensors and 0.1 mmCu filter will help for acquiring good quality image as well as reducing patient dose.

• Journal of the Korean Chemical Society
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• v.53 no.3
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• pp.257-265
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• 2009

The structures and metal affinities of the binding configurations of $Cu^{+}$ and $Cu^{2+}$ to proline have been investigated using the hybrid three-parameter Density Functional Theory(DFT/B3LYP). We found that the metal-proline bonding and the energy ordering of several conformers were very different in $Cu^{+}$-proline and $Cu^{2+}$-proline. For $Cu^{+}$-proline, the ground state structure was found to have a bidentated coordination in which $Cu^{+}$ was coordinated to the carbonyl oxygen and imino group nitrogen of neutral proline. On the contrary, the ground state structure of $Cu^{2+}$-proline involves chelation between the two oxygens of the carboxylate group in a zwitterionic proline. The metal ion affinity of proline of the most stable $Cu^{+}$-proline complex was calculated as 76.0 kcal/mol at 6-311++G(d,p) level, whereas the $Cu^{2+}$ ion affinity of proline was calculated as 258.5 kcal/mol.

• Resources Recycling
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• v.17 no.5
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• pp.60-65
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• 2008

A study on the removal of silver(Ag) in copper electrolyte was carried out to produce high purity copper by using various method such as ion exchange resin, activated carbon adsorption, copper cementation with powder and wire, CuS precipitation. Parameters, such as reaction time, reaction temperature, addition amount etc. were investigated to determine the effective condition of silver removal. CuS precipitation and ion exchange using Lewatit TP214 was found to be effective. Especially, silver content in copper electrolyte was reduced from 10 ppm to less than 0.1 ppm by ion exchange with Lewatit TP214.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• Journal of Surface Science and Engineering
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• v.51 no.1
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• pp.47-53
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• 2018

Sn-based lithium-ion batteries have low cost and high theoretical specific capacity. However, one of major problem is the capacity fading caused by volume expansion during lithiation/delithiation. In this study, 3-dimensional foam structure of Cu-Sn alloy is prepared by co-electrodeposition including large free space to accommodate the volume expansion of Sn. The Cu-Sn foam structure exhibits highly porous and numerous small grains. The result of EDX mapping and XPS spectrum analysis confirm that Cu-Sn foam consists of $SnO_2$ with a small quantity of CuO. The Cu-Sn foam structure electrode shows high reversible redox peaks in cyclic voltammograms. The galvanostatic cell cycling performances show that Cu-Sn foam electrode has high specific capacity of 687 mAh/g at a current rate of 50 mA/g. Through SEM observation after the charge/discharge processes, the morphology of Cu-Sn foam structure is mostly maintained despite large volume expansion during the repeated lithiation/delithiation reactions.