• Korean Journal of Materials Research
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• v.15 no.9
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• pp.598-603
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• 2005

To develope new lead-free solders with the melting temperature close to that of Sn-37Pb$(183^{\circ}C)$, Sn-0.7Cu-5Pb-1Ga, Sn-0.7Cu-5Pb-1Ag, Sn-0.7Cu-5Pb-5Bi-1Ag, and Sn-0.7Cu-SBi-1Ag alloys were composed by adding low-netting elements such as Ga, Bi, Pb, and Ag to Sn-0.7Cu. Then the melting temperatures, microstructures, wettability, and adhesion properties of these alloys were evaluated. DSC analysis showed that the melting temperature of Sn-0.7Cu-SPb-1Ga was $211^{\circ}C$, and those of other alloys was in the range of $192\~200^{\circ}C$. Microstructures of these alloys after heat-treatment at $150^{\circ}C$ for 24 hrs were basically composed of coarsely- grown $\beta-Sn$ grains, and $Cu_6Sn_5$ and $Ag_3Sn$ intermetallic precipitates. Sn-0.7Cu-5Pb-1Ga and Sn-0.7Cu-5Pb-5Bi-1Ag showed excellent wettability, while Sn-0.7Cu-5Bi-1Ag and Sn-0.7Cu-5Pb-5Bi-1Ag revealed good adhesion strength with the Cu substrates. Among 4 alloys, Sn-0.7Cu-5Pb-5Bi-1Ag with the lowest melting temperature $(192^{\circ}C)$ and relatively excellent wettability and adhesion strength was suggested to be the best candidate solder to replace Sn-37Pb.

• Resources Recycling
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• v.14 no.3
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• pp.63-67
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• 2005

As there are recent tendencies to raise horizontal frequencies so as to improve screen definition for high-quality TV and high definition display, ferrite core for deflective yokes requires materials with low coreloss in the areas of high frequencies. The researcher added CuO to low-loss Mg-Zn ferrite. After choosing MgO, ZnO, Fe$_2O_3$ and CuO, the researcher changed a ratio of composition, substituting MgO for CuO. These samples were sintered for three hours up to 980$^{\circ}C$~1350$^{\circ}C$. Measure magnetic permeability, electric loss, core loss and a rate of contraction.

• Journal of the Korean Society for Heat Treatment
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• v.28 no.2
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• pp.75-81
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• 2015

Effects of B and Cu additions on the microstructure and mechanical properties of high-strength bainitic steels were investigated in this study. Six kinds of high-strength bainitic steels with different B and Cu contents were fabricated by thermo-mechanical control process composed of controlled rolling and accelerated cooling. The microstructures of the steels were analyzed using optical and transmission microscopy, and the tensile and impact tests were conducted on them in order to investigate the correlation of microstructure with mechanical properties. Depending on the addition of B and Cu, various low-temperature transformation products such as GB (granular bainite), DUB (degenerated upper bainite), LB (lower bainite), and LM (lath martensite) were formed in the steels. The addition of B and Cu increased the yield and tensile strengths because of improved hardenability and solid solution strengthening, but decreased the ductility and low-temperature toughness. The steels containing both B and Cu had a very high strength above 1.0 GPa, but showed a worse low-temperature toughness of higher DBTT (ductile-to-brittle transition temperature) and lower absorbed energy. On the other hand, the steels having GB and DUB showed a good combination of tensile and impact properties in terms of strength, ductility, yield ratio, absorbed energy, and DBTT.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.4
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• pp.175-178
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• 2018

Copper is a well know material for use as heat sink or heat exchanger. However, copper has a considerable low tensile strength and temperature limit. A material that has a good thermal conductivity, low cost, but also excellent mechanical properties are desired. In order to identify the mechanism for the material properties of cast Cu-Fe alloys, $Cu_{50}-Fe_{50}$ (wt.%) alloy was produced by using a high-frequency induction furnace, a typical metal casting process. The Cu-Fe alloy consists of Cu, ${\alpha}$-Fe, ${\gamma}$-Fe with dendrite structures. The crystal structure and microstructure of the prepared $Cu_{50}-Fe_{50}$ alloy were systematically examined using XRD, FE-SEM, EDS and XRF for electrical devices.

• ETRI Journal
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• v.36 no.3
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• pp.367-373
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• 2014

With high bandwidth, low interference, and low power consumption, optical network-on-chip (ONoC) has emerged as a highly efficient interconnection for the future generation of multicore system on chips. In this paper, we propose a new path-setup method for ONoC to mitigate contentions, such as packets, by recycling the setup packet halfway to the destination. A new, strictly non-blocking $6{\times}6$ optical router is designed to support the new method. The simulation results show the new path-setup method increases the throughput by 52.03%, 41.94%, and 36.47% under uniform, hotspot-I, and hotspot-II traffic patterns, respectively. The end-to-end delay performance is also improved.

• Journal of Powder Materials
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• v.20 no.2
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• pp.138-141
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• 2013

The microstructure evolution during sintering of the W-5 wt.%Cu nanocomposite powders was investigated for the purpose of developing a high density W-Cu alloy. The W-5 wt.%Cu nanopowder compact, fully-densified during sintering at 1623 K, revealed a homogeneous microstructure that consists of high contiguity structures of W-W grains and an interconnected Cu phase located along the edges of the W grains. The Vickers hardness of the sintered W-5 wt.%Cu specimen was $427{\pm}22$ Hv much higher than that ($276{\pm}19$ Hv) of the conventional heavy alloy. This result is mostly due to the higher contiguity microstructure of the W grains compared to the conventional W heavy alloy.

• Macromolecular Research
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• v.12 no.1
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• pp.32-37
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• 2004

The atom transfer radical polymerization (ATRP) of hexadecyl acrylate (HDA) was carried out in Ν,Ν-dimethylformamide (DMF) in the presence of CuSCN/Ν,Ν,Ν′,Ν"Ν"-pentamethyldiethylenetriamine (PMDETA). The results indicate that the polymerization is well-controlled: a linear increase of molecular weights occurs with respect to conversion and the polydispersities are relatively low. In particular, the use of CuSCN as the catalyst resulted in faster polymerization rates for hexadecyl acrylate than did those using either CuBr or CuCl; the polydis-persity, however, was larger than those obtained in the cases when CuBr and CuCl were used. In addition, we report the thermodynamic data and activation parameters for the solution ATRP of hexadecyl acrylate.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.1
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• pp.32-39
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• 2011

The object of this study is to evaluate and discriminate nondestructively the dislocation substructures of Cu and Cu-Zn alloy subjected to the low-cycle-fatigue. The ultrasonic wave velocity, electrical resistivity and positron annhilation lifetime(PAL) were measured to the nondestructive testing. Cyclic fatigue test of Cu and Cu-Zn alloy with much different stacking fault energies was conducted and the correlations between dislocation behavior and nondestructive parameters were studied. Dislocation cell substructure was developed in Cu, while planar array of dislocation structure was developed in Cu-35Zn alloy only increasing dislocation density with fatigue cycles. Decrease in ultrasonic wave velocity, increase in electrical resistivity and PAL were shown because of the development of lattice defects, dislocations and vacancies, by cyclic fatigue at room temperature. In contrast to Cu-Zn alloy of the planar-array dislocation substructure showing continuous changes in the nondestructive parameters, it does not make any noticeable changes in the nondestructive parameters after the evolution of dislocation cell substructure in Cu.

• Korean Journal of Materials Research
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• v.1 no.2
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• pp.71-76
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• 1991

The superconducting powders in $YBa_2Cu_3O_{7-x}$ and Bi-Pb-Sr-Ca-Cu-O system were easily prepared from water in oil type emulsion by loading each cation into the aqueous phase. In $YBa_2Cu_3O_{7-x}$ system, the superconducting orthorhombic phase was formed by calcining at $750^{\circ}C$ for 10h in $O_2$. The size of the superconducting phase powders was submicron. The density of the sintered specimen using this powders was about 95% of the theoretical density and the resistance sharply decreases at about 90K, In Bi-Pb-Sr-Ca-Cu-O system the low Tc phase($(Bi, Pb)_2Sr_2Ca_1Cu_2O_y$) was formed by calcining at $800^{\circ}C$ for 10h in a low oxygen partial pressure of 1/20 atm The shape of clacined powder is thin plate of which size is about $2\mu\textrm{m}$ and thickness is smaller than $\mu\textrm{m}$. It was observed that the high Tc phase ($(Bi, Pb)_2Sr_2Ca_2Cu_3O_y$) was formed by sintering at $850^{\circ}C$ for 30h in oxygen pressure of 1/20 atm without intermediary grinding. The above sintered sample exhibited superconductivity with a Tc(zero)=105K.

• Bulletin of the Korean Chemical Society
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• v.34 no.3
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• pp.768-772
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• 2013

Layered mixed metal hydroxy double salts (HDS) with the formulas $(Cu_{0.75}Ni_{0.25})_2(OH)_3NO_3$ ((Cu, Ni)-HDS) and $Cu_2(OH)_3NO_3$ ((Cu, Cu)-HDS) were prepared via slow hydrolysis reactions of CuO with $Ni(NO_3)_2$ and $Cu(NO_3)_2$, respectively. The crystal structures, morphologies, bonding natures, and magnetic properties of (Cu, Ni)-HDS and (Cu, Cu)-HDS were characterized with X-ray diffraction (XRD), scanning electron microscopy (SEM), Fourier transformation infrared spectroscopy (FT-IR), thermogravimetric analysis (TGA), and a superconducting quantum interference device (SQUID). Even though (Cu, Ni)-HDS has a similar layered structure to that of (Cu, Cu)-HDS, the bonding nature of (Cu, Ni)-HDS is slightly different from that of (Cu, Cu)-HDS. Therefore, the magnetic properties of (Cu, Ni)-HDS are significantly different from those of (Cu, Cu)-HDS. The origin of the abnormal magnetic properties of (Cu, Ni)-HDS can be explained in terms of the bonding natures of the interlayer and intralayer structures.