• Korean Journal of Materials Research
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• v.10 no.9
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• pp.593-600
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• 2000

This paper investigated the conduction path and conduction mechanism in undoped polycrystalline diamond thin films deposited by microwave chemical vapor deposition. The resistances measured by ac impedance spectroscopy with different directions can not be explained by the previously-known surface conduction model. The electrodeposition of Cu and electroetching of Ag experiments showed that the conduction path is the grain boundaries within the diamond films. The electodeposition of Cu with an insulating surface layer further proved that the main conduction path in polycrystalline films in the grain boundaries. The film with high electrical conductivity has low activation energy of 45meV and higher dangling bond density. By considering the results and surface C chemical bonds, the H-C-C-H bonds at surface and in grain boundaries might be the origin of high conductivity in undoped diamond films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.324-324
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• 2010

최근에는 압전체의 환경오염 문제의 해결 및 가격경쟁력을 갖추기 위해서 비납계 압전체에 대한 연구가 활발히 진행되고 있다. (Na,K)$NbO_3$ 계는 페로브스카이트 구조를 가지는 비납계 세라믹스로 현재 가장 많이 연구되고 있는 물질 중의 하나이다. 본 연구에서는 압전성이 우수한 $(Na_{0.44}K_{0.52}Li_{0.04})(Nb_{0.9}Ta_{0.04}Sb_{0.06})O_3$ 조성에 CuO, $Cu_2O$ 등의 Cu 산화물을 첨가하였을 때의 전기기계결합계수, 기계적품질계수, 비유전율, 압전전하상수, 문극-전계 이력곡선 (P-E hysteresis curve) 등을 변화를 평가하고자 하였다.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.905-909
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surfaces. One of the available front metal contacts is Ni/Cu plating, which can be mass produced via asimple and inexpensive process. A selective emitter, meanwhile, involves two different doping levels, with higher doping (${\leq}30{\Omega}/sq$) underneath the grid to achieve good ohmic contact and low doping between the grid in order to minimize the heavy doping effect in the emitter. This study describes the formation of a selective emitter and a nickel silicide seed layer for the front metallization of silicon cells. The contacts were thickened by a plated Ni/Cu two-step metallization process on front contacts. The experimental results showed that the Ni layer via SEM (Scanning Electron Microscopy) and EDX (Energy dispersive X-ray spectroscopy) analyses. Finally, a plated Ni/Cu contact solar cell displayed efficiency of 18.10% on a $2{\times}2cm^2$, Cz wafer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.12
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• pp.1010-1017
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• 2011

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.48.2-48.2
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• 2010

고효율 실리콘 태양전지 개발은 단파장의 광 응답 특성 개선을 위한 선택적 에미터 형성과 반사 손실 개선을 위한 미세 패턴 전극을 형성하는데 집중적인 연구가 진행되고 있다. 본 실험에서는 레이저 도핑된 선택적 에미터 위에 미세 패턴 Ni/Cu 도금 전극을 형성하였다. 니켈과 동 도금은 무전해 Light induced plating(LIP)으로 진행하였다. 니켈 도금 전극의 접착력 개선과 접촉저항 개선을 위해서 니켈 전극을 질소 분위기에서 열처리하여 니켈실리사이드(NiSi)를 형성하였다. 니켈 도금 두께와 니켈실리사이드 열처리 조건을 최적화하여 충실도 77.4%, 변환효율 18.5%를 달성하였다.

• Journal of Powder Materials
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• v.22 no.4
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• pp.254-259
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• 2015

$Bi_2Te_3$ related compounds show the best thermoelectric properties at room temperature. However, n-type $Bi_2Te_{2.7}Se_{0.3}$ showed no improvement on ZT values. To improve the thermolectric propterties of n-type $Bi_2Te_{2.7}Se_{0.3}$, this research has Cu-doped n-type powder. This study focused on effects of Cu-doping method on the thermoelectric properties of n-type materials, and evaluated the comparison between the Cu chemical and mechanical doping. The synthesized powder was manufactured by the spark plasma sintering(SPS). The thermoelectric properties of the sintered body were evaluated by measuring their Seebeck coefficient, electrical resistivity, thermal conductivity, and hall coefficient. An introduction of a small amount of Cu reduced the thermal conductivity and improved the electrical properties with Seebeck coefficient. The authors provided the optimal concentration of $Cu_{0.1}Bi_{1.99}Se_{0.3}Te_{2.7}$. A figure of merit (ZT) value of 1.22 was obtained for $Cu_{0.1}Bi_{1.9}Se_{0.3}Te_{2.7}$ at 373K by Cu chemical doping, which was obviously higher than those of $Cu_{0.1}Bi_{1.9}Se_{0.3}Te_{2.7}$ at 373K by Cu mechanical doping (ZT=0.56) and Cu-free $Bi_2Se_{0.3}Te_{2.7}$ (ZT=0.51).

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.566-566
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• 2012

그래핀(Graphene)은 모든 탄소 동소체의 기본구성 요소로 2 차원 결정구조를 가지며, 양자홀 효과(quantum Hall effect), 뛰어난 열 전도도, 고 탄성, 광학적 투과성 등과 같은 탁월한 물리적 성질을 보이는 물질이다. 이러한 그래핀의 우수한 특성은 전계 효과 트랜지스터(field effect transistor), 화학/바이오 센서, 투명 전극(transparent electrode) 등의 다양한 전자소자를 개발하는 응용 가능하다. 그 중, 그래핀 투명전극의 제조는 가장 응용가능성이 높은 분야이다. 현재 투명전극 물질로는 인듐-주석 산화물(indium tin oxide; ITO)가 널리 이용되고 있으나, 인듐의 고갈로 인한 공급부족 문제 및 고 생산비용, 휘어지지 않는 취성 등의 단점을 지니고 있다. 따라서, 우수한 광학적 투과성과 전기전도성을 지닌 그래핀이 ITO의 대체 물질로서 각광받고 있다.[1-5] 본 연구에서는 그래핀의 투명전도필름의 응용을 위해 면저항을 낮추기 위한 방법으로 화학적 도핑(doping)을 이용하였다. 그래핀은 구리(copper; Cu) 호일을 촉매로 사용하여 열 화학증착법(Thermal Chemical Vapor Deposition)을 이용하여 합성하였다. 합성된 그래핀은 PMMA(Poly(methyl methacrylate)) 전사법을 이용하여 산화실리콘(SiO2) 기판에 전사 후, 염화은(AgCl)과 클로로벤젠(C6H5Cl)으로 만든 콜로이드(colloid) 용액에 디핑(dipping)하여 그래핀에 은 입자를 도핑 하였다. 그 결과, 은 입자 도핑 농도에 따라 면저항이 감소하는 양상을 보였다. 제작된 그래핀 투명전도성 필름의 투과도는 자외선-가시광선-근적외선 분광법(UV-Vis-NIR spectroscopy)를 이용하여 측정하였고, 라만 분광법(Raman spectroscopy)을 통해 그래핀 필름의 질적 우수성과 성장 균일도를 조사하였다.

• Korean Journal of Materials Research
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• v.28 no.10
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• pp.564-569
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• 2018

$Cu_2ZnSn(S,Se)_4$ (CZTSSe) films were prepared on Mo coated soda lime glass substrates by sulfo-selenization of sputtered stacked Zn-Sn-Cu(CZT) precursor films. The precursor was dried in a capped state with aqueous NaOH solution. The CZT precursor films were sulfo-selenized in the S + Se vapor atmosphere. Sodium was doped during the sulfo-selenization treatment. The effect of sodium doping on the structural and electrical properties of the CZTSSe thin films were studied using FE-SEM(field-emission scanning electron microscopy), XRD(X-ray diffraction), XRF(X-ray fluorescence spectroscopy), dark current, SIMS(secondary ion mass spectrometry), conversion efficiency. The XRD, XRF, FE-SEM, Dark current, SIMS and cell efficiency results indicated that the properties of sulfo-selenized CZTSSe thin films were strongly related to the sodium doping. Further detailed analysis and discussion for effect of sodium doping on the properties CZTSSe thin films will be discussed.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.256-259
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• 1999

The effects of Pr doping on structural and superconducting properties of (Pb$_{0.5}$V$_{0.5}$)Sr$_2$(Ca$_{1-x}$Pr$_x$)Cu$_2$O$_z$ have been studied. We have observed systematic variation of lattice parameters with increasing Pr content. A maximum Tc of about40 K has been observed in this system. The correlation between the crystal structure and superconductivity has been addressed.

• Korean Journal of Optics and Photonics
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• v.9 no.2
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• pp.104-110
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• 1998

The energy transfer between two incident beams in a photorefractive Cu-doped(0.04 wt. %) ${(K_{0.5}Na_{0.5})}_{0.2}{(Sr_{0.61}Ba_{0.39})}_{0.9}Nb_2O_6$ crystal is investigated at 632.8 nm laser wavelength. In addition, the coherent two-wave coupling properties of a photoinduced refractive-index grating in the presence of amplitude modulation on the signal beam or reference beam are also experimentally investigated. Some preliminary exprimental results are presented for use as a dynamic photorefracitive combiners and pulse shaping elements in coherent optical communication systems and in optical signal processing.