• Journal of Electrochemical Science and Technology
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• 제10권1호
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• pp.82-88
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• 2019

Here, we report on nanocrystalline Si-Al-M (M = Fe, Cu, Ni, Zr) alloys for use as an anode for lithium-ion batteries, which were fabricated via a melt-spinning method. Based on the XRD and TEM analyses, it was found that the Si-Al-M alloys consist of nanocrystalline Si grains surrounded by an amorphous matrix phase. Among the Si-Al-M alloys with different metal composition, Ni-incorporated Si-Al-M alloy electrode retained the high discharge capacity of 2492 mAh/g and exhibited improved cyclability. The superior $Li^+$ storage performance of Si-Al-M alloy with Ni component is mainly responsible for the incorporated Ni, which induces the formation of ductile and conductive inactive matrix with crystalline Al phase, in addition to the grain size reduction of active Si phase.

• 대한치과기공학회지
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• 제28권2호
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• pp.321-329
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• 2006

The popularity of Ni-Cr-Mo based metal alloys for metal-ceramic crown have increased recently because of low price, superior yield strength and rigidity. the use of these alloys give them the potential advantage of thinner copping with the required rigidity for long span bridges. The purpose of this study was to assess the microstructures and mechanical properties of Ni-Cr-Mo-(Si,Al,Nb,Zr,Ti.Cu,Mm) based Alloys not containing beryllium(Be) related toxic effects. The abtained results indicated that as-cast these specimen alloys showed compositional and microstructural differences, and mechanical properties values of Ni69Cr20Mo5Si2Al4 alloy among these specimen alloys was found to be superior to those of commercial Ni-Cr based alloy using in market place today.

• 한국분말재료학회지
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• 제11권3호
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• pp.193-201
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• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1994년도 제6회 학술발표회 논문개요집
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• pp.35-35
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• 1994

The surface segragation of NiZr, CuZr alloy has been studied wi th X-ray Imotoelectron spectroscopy(XPS), Auger electron spectroscopy(AES) and low energy ion scattering(LEIS). The composition of outmost atomic layer has been determinded by the use of LEIS at several incident energies using Ar+ ion. In the LEIS analysis, the effect of charge exchange has been estimated by a novel measurment of the charge exchange parameters while simul taneous determining the relative concentrations of Ni and Zr and the complementary information obtained will be described. The composition of the clean annealed surface, measured with AES only, will be contrasted wi th the surface concentration of the preferentially sputtered surface. The experimental results has been clearly demonstrated that when the NiZr ruld CuZr alloys are exposed to continuous Ar+ ion bombardment the outermost atomic layer is Zr rich due to preferential sputtering of Ni atoms. where Ni is preferentially sputtered, but the difference in sputtering yields is not sufficient to explain the observed composition. Therefore, it is necessary to consider other processes such as Radiation Induced Segregation(RIS). The surface composition of the heated sample surface predicts that Zr should surface segregate which futher supports the view that part of the Zr enrichment is due to RIS.to RIS.

• 대한화학회지
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• 제53권3호
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• pp.233-243
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• 2009

실리카지지 니켈(Ni-Si$O_2$), 실리카지지 구리(Cu-Si$O_2$), 몇가지 조성의 실리카지지 니켈과 구리의 합금(Ni/Cu-Si$O_2$)을 실온에서 일산화탄소(CO)의 압력을 넓은 범위에서 변화시키면서(0.2 $torr{\sim}$50 torr) 흡착된 CO의 적외선 스펙트럼을 1500 $cm^{-1}{\sim}2500\;cm^{-1}$ 범위에서 관찰했고 실온에서 진공탈착시키면서 흡착된 CO의 적외선 스펙트럼을 관찰했다. Ni-Si$O_2$에 CO를 흡착시켰을 때 2059.6 $cm^{-1},\;{\sim}$2036.5 $cm^{-1},\;{\sim}$1868.7 $cm^{-1},\;{\sim}$1697.1 $cm^{-1}$의 네 흡수띠가 관찰되었고, Cu-Si$O_2$에 일산화탄소를 흡착시켰을 때 $\sim$2115.5 $cm^{-1},\;{\sim}$1743.0 $cm^{-1}$ 두 흡수띠가 관찰되었으며, Ni/Cu-Si$O_2$에서는 ${\sim}2123.2\;cm^{-1}$, 2059.6 $cm^{-1},\;{\sim}$2036.4 $cm^{-1},\;{\sim}$1899.5 $cm^{-1},\;{\sim}$1697.1 $cm^{-1}$에 다섯 흡수띠가 관찰되었다. Ni/Cu-Si$O_2$, Cu-Si$O_2$, Ni/Cu-Si$O_2$에서 CO를 흡착시켰을 때 관찰된 흡수스펙트럼은 이전의 보고와 근사적으로 일치한다. 1800 $cm^{-1}$ 이하의 흡수띠는 Ni이나 Ni/Cu 합금의 스텦이 있는 결정표면에서 관찰된 바 있는데 Ni-Si$O_2$, Ni/Cu-Si$O_2$를 실온에서 CO를 흡착시켰을 때 나타나는 ${\sim}1697.1\;cm^{-1}$ 흡수띠는 Ni이나 Ni/Cu 합금 표면에서 스텦에 인접한 흡착자리에 흡착한 CO에 기인한 흡수띠로 제시할 수 있다. Cu-Si$O_2$ 시료를 실온에서 CO를 흡착시켰을 때 Cu 결정표면에서 2000 $cm^{-1}$ 이하의 흡수띠가 관찰되는 경우는 드문데 1743.0 $cm^{-1}$ 흡수띠는 Cu 표면의 스텦에 인접한 흡착자리에 흡착한 CO에 기인한 흡수띠로 제시할 수 있다. Ni/Cu-Si$O_2$에서 Cu의 함량이 몰분율 0.5까지 변함에 따라 같은 CO 압력 또는 같은 진공탈착시간에서 흡수띠의 위치가 21 $cm^{-1}$ 이하로 다른 ⅠB 금속을 첨가했을 때보다 작게 변하는데 Cu d 전자의 리간드 효과가 작은 현상에 기인한 것으로 볼 수 있다.

• 한국분말재료학회지
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• 제22권5호
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• pp.362-366
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• 2015

The effect of sublimable vehicle composition in the camphor-naphthalene system on the pore structure of porous Cu-Ni alloy is investigated. The CuO-NiO mixed slurries with hypoeutectic, eutectic and hypereutectic compositions are frozen into a mold at $-25^{\circ}C$. Pores are generated by sublimation of the vehicles at room temperature. After hydrogen reduction at $300^{\circ}C$ and sintering at $850^{\circ}C$ for 1 h, the green body of CuO-NiO is completely converted to porous Cu-Ni alloy with various pore structures. The sintered samples show large pores which are aligned parallel to the sublimable vehicle growth direction. The pore size and porosity decrease with increase in powder content due to the degree of powder rearrangement in slurry. In the hypoeutectic composition slurry, small pores with dendritic morphology are observed in the sintered Cu-Ni, whereas the specimen of hypereutectic composition shows pore structure of plate shape. The change of pore structure is explained by growth behavior of primary camphor and naphthalene crystals during solidification of camphor-naphthalene alloys.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.28-29
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• 2006

The magnetic properties of a series of both annealed and as-rolled Ni-$W_y$ alloy tapes with compositions y = 0, 1, 3, and 5 at.%, were studied. To compare with Ni-W alloys, the magnetic properties of a series of both annealed and as-rolled $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5 and 7 at.%, were studied, as well. Both the isothermal mass magnetization M(H) of a series of samples, such as both Ni-W and [Ni-W]-Cu alloy tapes, at different fixed temperatures and M(T) in fixed field, were measured using a PPMS-9 (Quantum Design). The degree of ferromagnetism of Ni-$W_y$ alloys have reduced as W-content y increases. Both the saturation magnetization $M_{sat}$ and Curie temperature $T_c$ decrease linearly with W-content y, and both $M_{sat}$ and $T_c$ go to zero at critical concentration of $y_c$ ~ 9.50 at.% W. The effect of Cu addition on both the saturation magnetization $M_sat$ and Curie temperature $T_c$ decrease linearly with Cu-content x in $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5, and 7 at.%. The results confirm that [Ni-W]-Cu alloy tapes can have much reduced ferromagnetism as Cu-content x increases.

• 한국표면공학회지
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• 제37권4호
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• pp.234-241
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• 2004

Cavitation erosion properties of the Cu-9Al-4.5Ni-4.5Fe alloys (Al-bronze) surface-modified by flame quenching process have been investigated. After flame quenching at above $T_{\beta}$, the surfaces of Al-bronze with $\alpha$ + $\textsc{k}$ structure have been changed into the $\alpha$ + $\beta$' martensite phases by the eutectoid reaction of $\alpha$ + $\textsc{k}$\longrightarrow$\beta$ followed by the martensite transformation of $\beta$\longrightarrow$\beta$'. As a result of cavitation test, the measured incubation time and erosion rate of the $\alpha$ + $\beta$' alloy was 1.2 times higher and 1.5 times lower, respectively, compared to those of the conventional $\alpha$ + $\textsc{k}$ alloys, showing a remarkable increase of cavitation resistance with the formation of $\beta$' martensite. This is attributed to a preferential erosion of the $\textsc{k}$ precipitates that show the lowest resistance among the $\alpha$, $\textsc{k}$, $\beta$' phases under cavitation loading.ases under cavitation loading.

• Journal of Welding and Joining
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• 제14권1호
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• pp.47-56
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• 1996

The purpose of this study is to develope an insert metal which can be brazed at lower temperature than the conventionally used insert metal and provide higher strength joint than base metal. In the review of binary phase diagram concerning Ti, Cu and Ni resulted in the discovery of Si having eutectic composition with them. The microstructure and the distribution of elements in reaction zone between CP Ti and insert metal were investigated by Optical Microscopy, SEM/EDX, EPMA, X-RAY. The newly developed insert metal is Ti-15wt%Cu-18wt%Ni-2wt%Si, which can yield the lower brazing temperature(1183K) compared with the conventional Ti-Cu-Ni system insert metal. The joints with this insert metal had tensile strength of 385MPa in the bonding temperature range of 1183K to 1243K.