• 제목/요약/키워드: Cu(copper)

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Electrochemical and surface investigations of copper corrosion in dilute oxychloride solution

  • Gha-Young Kim ;Junhyuk Jang;Jeong-Hyun Woo;Seok Yoon;Jin-Seop Kim
    • Nuclear Engineering and Technology
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    • 제55권8호
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    • pp.2742-2746
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    • 2023
  • The corrosion behavior of copper immersed in dilute oxychloride solution (100 mM) was studied through surface investigation and in-situ monitoring of open-circuit potential. The copper corrosion was initiated with copper dissolution into a form of CuCl-2, resulting in mass decrease within the first 40 h of immersion. This was followed by a hydrolysis reaction initiated by the CuCl-2 at the copper surface, after which oxide products were formed and deposited on the surface, resulting in a mass increase. The formation of nucleation sites for copper oxide and its lateral extension during the corrosion process were examined using focused ion beam (FIB)-scanning electron microscopy (SEM). The presence of metastable compounds such as atacamite (CuCl2·3Cu(OH)2) on the corroded copper surface was revealed by X-ray photoelectron spectra (XPS) and transmission electron microscopy (TEM)-energy dispersive spectrometry (EDS) analysis.

산화주석 첨가에 따른 동화유약의 발색 변화 (Color variation of copper glaze with the addition of tin oxide)

  • 노형구;김수민;김응수;조우석
    • 한국결정성장학회지
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    • 제27권5호
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    • pp.243-248
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    • 2017
  • 본 연구에서는 산화주석(IV) 첨가량을 달리하여 동화유약 시편을 제조하고 발색기구를 분석하기 위하여 분광 분석, 결정상 분석, 미세구조 분석을 실시하여 색상과의 상관성을 분석하였다. 산화주석(VI) 첨가량이 증가함에 따라 동화유약의 붉은색은 사라지고 CIEab 값이 감소하여 무채색으로 발색하였다. 산화주석은 유약층에 고르게 분포하여 Cu nuclei가 성장하여 붉은색으로 발색하는 것을 방해하고 기포 주변의 metal Cu와 반응하여 합금을 형성하였다. 이로 인해 산화주석 첨가량이 증가함에 따라 금속 Cu 피크는 사라지고 미세한 $Cu_2O$ 피크만 남게 된다. 산화주석을 3.79 % 첨가하였을 때는 유약에 붉은색을 내는 $Cu_2O$보다 검정색을 나타내는 CuO와 Cassiterite $SnO_2$가 색상에 더 영향을 미치는 것으로 보여진다.

동-텅스텐 소결합금(Cu-W)과 동(Cu)의 마찰용접 특성에 미치는 업셋압력의 영향에 관한 연구 (Effects of Upset Pressure on Weldability in the Friction Welding of Cu to Cu-W Sintered Alloy)

  • 강성보;민택기
    • Journal of Welding and Joining
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    • 제17권5호
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    • pp.69-76
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    • 1999
  • A copper-tungsten sintered alloy(Cu-W) has been friction welded to a tough pitch copper in order to investigate the effect of upset pressure on friction weldability. Under the condition of friction time 0.8sec, upset pressure 150MPa, the tensile strength and Charpy impact value of the friction welded joint were 336MPa, $400KJ/m^2$ respectively. And highest temperature of the weld measured was below $800^{circ}K$ which is very lower than melting point of Cu($1356^{circ}K$). Under the same conditions, W grains picked up in Cu matrix from Cu-W profitably affected on these mechanical fracture, and were dispersed in Cu by plastic flow during brake time.

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Use of Hydrazine for Pitting Corrosion Inhibition of Copper Sprinkler Tubes: Reaction of Hydrazine with Corrosion By-Products

  • Suh, Sang Hee;Kim, Sohee;Suh, Youngjoon
    • Corrosion Science and Technology
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    • 제16권5호
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    • pp.247-256
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    • 2017
  • The feasibility of using hydrazine for inhibiting pitting corrosion in copper sprinkler tubes was investigated by examining microscopical and structural evolution of corrosion by-products with SEM, EDS, and XRD. Hydrazine removed dissolved oxygen and reduced CuO and $Cu_2O$ as well. The stable phase was changed from CuO to $Cu_2O$ or Cu depending on hydrazine concentration. Hydrazine concentration of 500 ppm could convert all CuO corrosion by-products to $Cu_2O$. In a tightly sealed acryl tube filled with aqueous solution of 500 ppm hydrazine, octahedral $Cu_2O$ particles were formed while plate-like structures with high concentration of Cu, O, N and C were formed near a corrosion pit. The inside structure of a corrosion pit was not altered by hydrazine aqueous solution. Uniform corrosion of copper was almost completely stopped in aqueous solution of 500 ppm hydrazine. Corrosion potential of a copper plate was linearly dependent on log (hydrazine concentration). The concept of stopping pitting corrosion reaction by suppressing oxygen reduction reaction could be verified by applying this method to a reasonable number of real sprinkler systems before full-scale application.

Wire-like Bundle Arrays of Copper Hydroxide Prepared by the Electrochemical Anodization of Cu Foil

  • La, Duc-Duong;Park, Sung-Yeol;Choi, Young-Wook;Kim, Yong-Shin
    • Bulletin of the Korean Chemical Society
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    • 제31권8호
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    • pp.2283-2288
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    • 2010
  • Nanostructured copper compounds were grown by electrochemical anodization of copper foil in aqueous NaOH under varying conditions including electrolyte concentration, reaction temperature, current density, and reaction time. Their morphology and atomic composition were investigated by using SEM, TEM, XRD, EDS and XPS. At the conditions ([NaOH] = 1 M, $20^{\circ}C$, $2\;mA\;cm^{-2}$), wire-like orthorhombic $Cu(OH)_2$ nanobundles with an average width of 100 - 300 nm and length of $10\;{\mu}m$ were synthesized with the preferential [100] growth direction. Furthermore, when the concentration decreased to 0.5 M NaOH, the 1D nanobundle structure became narrower and longer without any change in compositions or crystalline structure. Side reaction pathways appeared to compete with the 1D nanostructure formation channels: the formation of CuO nanoleaves at $50^{\circ}C$ via the sequential dehydration of $Cu(OH)_2$, CuO/$Cu_2O$ aggregates in 4 M NaOH, and $Cu_2O$ nanoparticles and CuO nanosheets at lower current density.

Synthesis and Crystal Structures of Copper(II) Complexes with Schiff Base Ligands: [Cu2(acpy-mdtc)2(HBA)(ClO4)]·H2O and [Cu2(acpy-phtsc)2(HBA)]·ClO4

  • Koo, Bon Kweon
    • Bulletin of the Korean Chemical Society
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    • 제34권11호
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    • pp.3233-3238
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    • 2013
  • Two new Cu(II) complexes, $[Cu_2(acpy-mdtc)_2(HBA)(ClO_4)]{\cdot}H_2O$ (1) (acpy-mdtc- = 2-acetylpyridine S-methyldithiocarbamate and $HBA^-$ = benzilic acid anion) and $[Cu_2(acpy-phtsc)_2(HBA)]{\cdot}ClO_4$ (2) (acpy-$phtsc^-$ = 2-acetylpyridine 4-phenyl-3-thiosemicarbazate) have been synthesized and characterized by elemental analysis, infrared spectroscopy, thermogravimetric analysis, and single crystal X-ray diffraction. The X-ray analysis reveals that the structures of 1 and 2 are dinuclear copper(II) complexes bridged by two thiolate sulfur atoms of Schiff base ligand and bidentate bridging $HBA^-$ anion. For 1, each of the two copper atoms has different coordination environments. Cu1 adopts a five-coordinate square-pyramidal with a $N_2OS_2$ donor, while Cu2 exhibits a distorted octahedral geometry in a $N_2O_2S_2$ manner. For 2, two Cu(II) ions all have a five-coordinate square-pyramidal with a $N_2OS_2$ donor. In each complex, the Schiff base ligand is coordinated to copper ions as a tridentate thiol mode.

Effects of Dietary Supplementation of Copper Chelates in the Form of Methionine, Chitosan and Yeast in Laying Hens

  • Lim, H.S.;Paik, I.K.
    • Asian-Australasian Journal of Animal Sciences
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    • 제19권8호
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    • pp.1174-1178
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    • 2006
  • An experiment was conducted to investigate the effects of dietary supplementation of copper chelates in the form of methionine, chitosan and yeast on the performance of laying hens. Four hundred ISA Brown layers, 84 wks old, were assigned to 4 treatments: control, 100 ppm Cu in methionine chelate (Met-Cu), 100 ppm Cu as chitosan chelate (Chitosan-Cu) and 100 ppm Cu as yeast chelate (Yeast-Cu). Each treatment had five replicates of 20 hens. Hen-day and hen-housed egg production and egg weight were significantly (p<0.05) increased by Met-Cu supplementation. The increase by Chitosan-Cu and Yeast-Cu supplementation was not significant. Contrast of the control vs. Cu chelates showed egg weight was significantly (p<0.05) increased by Cu chelate supplementation. Soft-shell egg production was significantly (p<0.05) reduced by supplementation of Cu chelates. Met-Cu treatment showed the lowest incidence of soft egg production. Gizzard erosion index was increased by Cu chelate supplementation. Crude fat in liver, total cholesterol in yolk and Cu content in liver and yolk were not significantly influenced by Cu chelate supplementation. It was concluded that dietary supplementation of 100 ppm Cu as Met-Cu significantly increased egg production and egg weight. Cu-Met chelate was also effective in reducing soft-shell egg production but increased gizzard erosion index.

Different Sources and Levels of Copper Supplementation on Performance and Nutrient Utilization of Castrated Black Bengal (Capra hircus) Kids Diet

  • Mondal, M.K.;Biswas, P.
    • Asian-Australasian Journal of Animal Sciences
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    • 제20권7호
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    • pp.1067-1075
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    • 2007
  • Twenty eight 3-4 month old castrated Black Bengal kids (Capra hircus) were used to determine the effects of source and level of dietary copper (Cu) concentration on their performance and nutrient utilization. Cu was supplemented (0, 10, 20 and 30 mg/kg diet DM) as copper sulfate ($CuSO_4$, $5H_2O$) or copper proteinate (Cu-P). Kids were fed a basal diet containing maize (19.5%), soybean (17.0%), deoiled rice bran (56.5%), molasses (4.0%), di-calcium phosphate and salt (1.0% each) and mineral and vitamin mixture (0.5% each) supplements at 3.5% of body weight to meet NRC (1981) requirements for protein, energy, macro minerals and micro minerals, excluding Cu. The basal diet contained 5.7 mg Cu/kg, 122.5 mg Fe/kg, 110 mg Zn/kg, 0.26 mg Mo/kg and 0.32% S. $CuSO_4$ or Cu-P was added to the basal diet at the rate of 10, 20 and 30 mg/kg. Kids were housed in a well ventilated shed with facilities for individual feeding in aluminum plated metabolic cages. Blood samples were collected from the jugular vein on d 0, 30, 60 and 90 to determine hemoglobin (Hb), packed cell volume (PCV), total erythrocyte count (TEC), total leukocyte count (TLC) and serum enzymes (alkaline phosphatase, alanine transferase and aspertate transferase). A metabolism trial of 6 days duration was conducted after 90 days of experimental feeding. Statistical analysis revealed that source and level of Cu supplementation improved live weight gain (p<0.04) and average daily gain (p<0.01). No significant contribution of source and level of Cu to alter serum serum enzymes was evident. Goats fed Cu-P tended to have higher Hb, PCV and TEC than with $CuSO_4$ supplementation. Cu-P increased digestibility of ether extract (EE, p<0.02) and crude fiber (p<0.05) and showed an increasing trend (p<0.09) for digested crude protein (CP) and crude fiber (CF). Supplemental dose of Cu linearly improved (p<0.02) digestibilities of dry matter (DM), organic matter (OM), EE and nitrogen free extract (NFE). Though the absorption of nitrogen (N) was not affected (p>0.10) by both source and dose of Cu, N retention was affected (p<0.04) and there was a significant $Source{\times}Dose$ interaction (p<0.05). Final body weight (BW) was not influenced (p>0.10) by the source of Cu but increasing dose of Cu increased (p<0.04) the BW of kids. TDN intake (g/kg $W^{0.75}$) was higher (p<0.05) with the increased dose of Cu and there was a significant $Source{\times}Dose$ interaction. It was concluded that supplementation of Cu from different sources and varying dose level in a concentrate based diet may improve performance, nutrient utilization and plane of nutrition in castrated Black Bengal kids. The effects on performance and nutrient utilization are more pronounced with Cu-P than $CuSO_4$ supplementation. Higher dose of Cu showed better result than lower dose.

A novel low resistivity copper diffusion joint for REBa2Cu3O7-δ tapes by thermocompression bonding in air

  • Wei, Ren;Zhen, Huang;Fangliang, Dong;Yue, Wu;Zhijian, Jin
    • 한국초전도ㆍ저온공학회논문지
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    • 제24권4호
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    • pp.16-24
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    • 2022
  • Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

Investigations of Graphene Grown on Copper Substrates

  • Cho, Sangmo;Kang, Yura;Nam, Jungtae;Kim, Keun Soo;Hong, Suklyun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.188.2-188.2
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    • 2014
  • Chemical vapor deposition (CVD) method is usually used to grow high-quality large area graphene. In the CVD process, copper is an especially important catalytic-substrate due to the fact that graphene films grown on Cu foils are predominantly one monolayer thick. In this study, we has grown graphene on several types of copper substrates: Cu foils and copper single crystal surfaces such as Cu(100) and Cu(111) are chosen. To investigate the differences between graphene grown on foils and single crystals, we use Raman spectroscopy, X-ray diffraction and atomic force microscopy. Details of the experimental results will be presented.

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