• 방사성폐기물학회지
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• 제21권1호
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• pp.1-8
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• 2023

The major concern in the deep geological disposal of spent nuclear fuels include sulfide-induced corrosion and stress corrosion cracking of copper canisters. Sulfur diffusion into copper canisters may induce copper embrittlement by causing Cu₂S particle formation along grain boundaries; these sulfide particles can act as crack initiation sites and eventually cause embrittlement. To prevent the formation of Cu₂S along grain boundaries and sulfur-induced copper embrittlement, copper alloys are designed in this study. Alloying elements that can act as chemical anchors to suppress sulfur diffusion and the formation of Cu₂S along grain boundaries are investigated based on the understanding of the microscopic mechanism of sulfur diffusion and Cu₂S precipitation along grain boundaries. Copper alloy ingots are experimentally manufactured to validate the alloying elements. Microstructural analysis using scanning electron microscopy with energy dispersive spectroscopy demonstrates that Cu₂S particles are not formed at grain boundaries but randomly distributed within grains in all the vacuum arc-melted Cu alloys (Cu-Si, Cu-Ag, and Cu-Zr). Further studies will be conducted to evaluate the mechanical and corrosion properties of the developed Cu alloys.

• Applied Science and Convergence Technology
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• 제23권1호
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• pp.14-26
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• 2014

Copper is an important component from coin metal to electronic wire, integrated circuit, and to lithium battery. Copper oxides, mainly including $Cu_2O$ and CuO, are important semiconductors for the wide applications in solar cell, catalysis, lithium-ion battery, and sensor. Due to their low cost, low toxicity, and easy synthesis, copper oxides have received much research interest in recent year. Herein, we review the crystallization of copper oxides by designing various chemical reaction routes, for example, the synthesis of $Cu_2O$ by reduction route, the oxidation of copper to $Cu_2O$ or CuO, the chemical transformation of $Cu_2O$ to CuO, the chemical precipitation of CuO. In the designed reaction system, ligands, pH, inorganic ions, temperature were used to control both chemical reactions and the crystallization processes, which finally determined the phases, morphologies and sizes of copper oxides. Furthermore, copper oxides with different structures as electrode materials for lithium-ion batteries were also reviewed. This review presents a simple route to study the reaction-crystallization-performance relationship of Cu-based materials, which can be extended to other inorganic oxides.

• 한국세라믹학회지
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• 제33권11호
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• pp.1245-1252
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• 1996

The charcteristics for the copper-contained spinel ferrites such as NiCu-and ZnCu ferrites with various copper content are investigated in this study which can provide a explanation for the behavior of copper in sintering at a low temperatuer. The bulk density and the grain size for these sintered ferrites were increased with the larger amount of copper in compositions. In microstructure of copper-contained spinel ferrites copper exists in the grain boundary which is sintering process. Electrical resistivity and frequency range with maximum Q-facor of NiCu-or ZnCu ferrites were decreased as increasing of copper content in ferrite composition.

• Journal of Nutrition and Health
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• 제29권5호
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• pp.528-532
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• 1996

The purpose of this study was to analyse copper intake and effect ofZn(30mg ZnSO4/d) supplementation on plasma copper level of Korean adults. Daily Cu intakes were studied in ninety subjects aging 20-20 years. Among them twenty four subjects participated in 6 weeks Zn supplementation study. The men consumed 1.47($\pm$0.64)mg of Cu and the women consumed 0.98($\pm$0.43)mg of Cu daily. the most abundant sources of Cu was meat, fish, egg and soybean group, the second was cereal and grain group and the third was vegetable group. These three groups supplied about 90% of copper in the subjects. The plasma copper level of the subjects was not changed much until two weeks of Zn supplementation. However, after two weeks of Zn supplementation plasma copper level was reduced continuously during the experiment. There was no significant difference in plasma Cu level between control and supplement group of the men, while the supplemented women showed significantly lower plasma Cu level than control group at week 4(p<0.01) and week 6(p<0.05). Although plasma Cu level of the subjects was slightly changed, its concentration in plasma was still in normal range in all groups and no one showed clinical Cu deficiency. Therefore the Zn supplementation of RDA level doesn't seem to cause any adverse effect on Cu status.

• 한국재료학회지
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• 제13권8호
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• pp.524-530
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• 2003

In order to prepare the uniform copper particles from copper sulfate solution by using hydrazine as a reduction agents, the reduction behavior of copper particles from copper sulfate was investigated in detail at room temperature by the observation of reaction products. The effects of $NH_4$OH and $Na_4$$P_2$$O_{7}$ on the formation of uniform copper particles were discussed. ($NHCu_3$)$_4$$SO_4$was completely formed at over pH 11 by adding $NH_4$OH in copper sulfate solution. The fine $Cu_2$O with the particle size of 50 nm was produced in the initial reduction process of (NH$Cu_3$)$_4$$SO_4$solution with $Na_4$$P_2$$O_{ 7}$ and then the Cu$_2$O was converted into copper particles by inserting additional hydrazine. When Cu(NH$_3$)$_4$SO$_4$solution with $Na_4$$P_2$$O_{ 7}$ was reduced at $80^{\circ}C$ by hydrazine, the highly dispersed copper particles with the particle size of about 0.8 $\mu\textrm{m}$ was obtained.

• 약학회지
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• 제15권2호
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• pp.41-52
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• 1971

Cu(II) chelates of several sulfanilamide derivatives (Sulfa-Cu) were prepared and their effects on solubility, absorptivity in intestinal lumen, biding tendency with serum protein and erythrocytes, concentration in rabbit blood, and acetylation rate were studied in comparison with their free ligand forms. For solubility concerned, the partition coefficients of Sulfa-Cu are decreased as following order: Sulfadimethoxine Copper chelate (SDM-Cu), Sulfamethoxypyridazine Copper chelate (SD-Cu), Sulfamerazine Copper chelate (SM-Cu), Sulfaisoxazole Copper chelate (SIX-Cu). The partition coefficients of SDM-Cu and ST-Cu were much greater than those of ligands. this phenomenone acounts for the rapid absorption of SDM-Cu and ST-Cu in the rat small intestine (in situ). The Sulfa-Cu were absorbed at the intestinal lumen of a rat in the rate of first order and there was no difference between long acting sulfa drugs and their Cu0chelates in biological half lives. In binding experiments, sulfa-Cu binded with serum protein in lower ratio than their ligands except SIX-Cu. On other hand, acetylation rates of sulfa-Cu were higher than those of free sulfa drugs and the acetylation rate were higher than those of free sulfa drugs and powder. In a experiment on Sulfa-Cu concentration in rabbit blood, the half lives of SD-Cu, SIX-cu, ST-Cu, and SM-Cu were longer than those of their ligands. Above all, the half life of SD-Cu appeared to be approximately 3.5 times logner than that of corresponding ligand, SD. When absorption of sulfa drugs or sulfa-Cu at the small intestinal lumen of a rat and the concentration in rabbit blood after absorption were compared, it was found that there was not always conrrelated.

• 공업화학
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• 제35권2호
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• pp.96-99
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• 2024

구리 마이크로입자의 표면을 나노섬유형태의 포름산구리로 합성하고 포름산과 혼합하여 구리판을 접합할 수 있는 소결 페이스트를 합성하였다. 평균 10 ㎛의 구리 마이크로입자는 400 ℃ 이상에서 표면이 산화구리 나노섬유로 합성되고 포름산과 혼합하여 표면이 포름산화된 구리 마이크로입자가 합성된다. 포름산구리는 구리 벌크입자나 나노입자의 녹는점에 비해 낮은 온도인 210 ℃에서 구리로 분해되어 저온 소결로 구리판의 접합이 가능하다. 표면을 나노섬유 형태로 제어하여 표면적을 높여 포름산구리로의 반응속도, 응집에 필요한 접촉면적, 포름산구리의 분해속도 등이 증가하여 짧은 시간에 소결할 수 있도록 하였다.

• The Korean Journal of Ceramics
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• 제4권3호
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• pp.222-226
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• 1998

$Cu_3N$ film deposited on silicon oxide substrate by r.f. reactive sputtering technique. Synthesis and properties of copper nitride film were investigated for its possible application to Cu metallization as adhesive interlayer between copper and $SiO_2. Cu_3N$ film was synthesized at the substrate temperature ranging from $100^{\circ}C$ to $200^{\circ}C$ and at nitrogen gas ratio above $X_{N2}=0.4. Cu_3N, CuN_x$, and FGM-structured $Cu/CuN_x$ films prepared in this work passed Scotch-tape test and showed improved adhesion property to silicon oxide substrate compared with Cu film. Electrical resistivity of copper nitride film had a dependency on its lattice constant and was ranged from 10-7 to 10-1 $\Omega$cm. Copper nitride film was, however, unstable when it was annealed at the temperature above $400^{\circ}C$.

• 농업과학연구
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• 제48권3호
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• pp.447-454
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• 2021

This study was conducted to evaluate the effects of different copper sources (inorganic and organic) on the growth performance, fecal copper excretion, intestinal morphology, and health in growing pigs. A total of 40 growing pigs (30.22 ± 1.92 kg) were randomly assigned to 5 dietary treatments: a basal control diet (CON), 4 experimental diets supplemented with either copper sulfate (CuSO₄), Cu-glycine complex (CuGly), Cu-amino acid complex (CuAA), or Cu-hydroxy-4-methylthio butanoate chelate complex (CuHMB) at 100 ppm, respectively. At the end of the study (28 days), fecal and blood samples were collected, and the pigs were slaughtered to determine the intestinal morphology. During the 28 days of the experimental period, pigs fed the inorganic and organic copper showed a higher average daily gain (p < 0.01) and gain feed ratio (p < 0.01). There were no differences in mineral concentrations of the serum; however, the copper concentration of the feces was lower (p < 0.01) in the CuAA and CuHMB groups. The intestinal morphology and blood profiles did not significantly differ between the groups. In conclusion, the organic copper sources (CuAA and CuHMB) can be used as a growth promoter to replace the CuSO₄ without any negative effects on health in growing pigs and to reduce fecal copper excretion.

• Journal of Welding and Joining
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• 제13권3호
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.