• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.3
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• pp.638-642
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• 2014

In this study, we investigate on the crystal microstructure and magneto-resistance (MR) change of Bismuth(Bi) thin films for annealing process, in order to apply Bi thin films to the spin electronic devices. As-prepared Bi thin films show the randomly oriented find grains whose size was measured to about 100 nm and the very low MR (4.7 % at room temperature) while careful annealing results in not only grain growth up to ${\sim}2{\mu}m$ but also drastic MR improvement (404 % at room temperature). The drastic change in the MR after applying the annealing process is attributed to the grain growth decreasing grain boundary scattering of electron. Therefore, in this study, we confirm the annealing effect for the grain boundary formation and MR improvement of Bi thin films, and demonstrate the feasibility of spin electronic devices.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.6
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• pp.246-252
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• 2011

The semiconducting $MnSi_{1.73}$ compound has been recognized as a thermoelectric material with excellent oxidation resistance and stable characteristics at elevated temperature. In the present work, we applied mechanical alloying (MA) technique to produce $MnSi_{1.73}$ compound using a mixture of elemental manganese and silicon powders. The mechanical alloying was carried out using a Fritsch P-5 planetary mill under Ar gas atmosphere. The MA powders were characterized by the X-ray diffraction with Cu-$K{\alpha}$ radiation, thermal analysis and scanning electron microscopy. Due to the observed larger loss of Si relative to Mn during mechanical alloying of $MnSi_{1.73}$, the starting composition of a mixture Mn-Si was modified to $MnSi_{1.83}$ and then $MnSi_{1.88}$. The single $MnSi_{1.73}$ phase has been obtained by mechanical alloying of $MnSi_{1.88}$ mixture powders for 200 hours. It is also found that the grain size of $MnSi_{1.73}$ compound powders analyzed by Hall plot method is reduced to 40 nm after 200 hours of milling.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.2
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• pp.269-277
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• 1998

The crystallization method determines the material quality and consequent device performance. This paper investigates the crystallization of a-Si:H films on various substrate materials and analyzes the crystallization effect with and without using eutectic forming metals. From the examinations of the various substrate materials, a metal Mo was selected for the a-Si:H films growth and subsequent crystallization of it. For a sample without any eutectic metal layer, we observed grain size of $0.8{\mu}m$ after $1100^{\circ}C$ anneal treatment. To reduce crystallization temperature, we used some of the eutectic forming metals such as Au, Al and Ag. Poly-Si films with grain size over $10{\mu}m$ and (111) preferential plains were achieved using a premetal layer of Au at an anneal temperature of $700^{\circ}C$. The various crystallization effects of eutectic metal thickness and type were investigated for photovoltaic (PV) device applications.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.3 no.2
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• pp.107-116
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• 1993

Tungsten thin film was deposited on Si( 100) substrate by either Si substrate reduction of W$F_6$( case 1) or Si$H_4$ reduction of W$F_6$( case 2) in LPCVD system The morphology and properties of deposited films for both cases were examined. The crystal structure for both cases was determined to be bec (body centered cubic). The amount of tungsten and the grain size in thin films were increased as the film grows. From the experimental results and theoretical considerations, it can be understood that the tungsten thin film grows by the volmer-weber growth mode, that is, island growth. The detailed tungsten thin film growth mode is presented. It was also found that the initial polycrystal structure of tungsten thin film developed into single crystal structure as the film grew in thickness.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.3 no.1
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• pp.37-44
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• 1993

Calcia stabilized zirconia polycrystal (Ca-TZP) powders synthesized by hydrothermal treatment was sintered at a temperature range of $1200^{\circ}C~1400^{\circ}C$ and investigated the properties of sintered body and the behaviors of isothermal phase transformation. The sintered bodies of Ca-TZP were shown the density of about 97% and the average mean tetragonal grain size of about $0.1~0.25{\mu}m$. Also, Ca-TZP specimen was more stable during aging at $250^{\circ}C$ than that of Y-TZP ceramics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.6
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• pp.550-554
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• 2007

Large and single-grain Y-Ba-Cu-O(YBCO) bulk superconductors have been fabricated by using a seeded infiltration and growth method. $Y_2BaCuO_5$(Y211) precursor pellets and $YBa_2Cu_3O_x$(Y123) liquid source pellets were prepared using commercial powder and were processed by infiltration and growth method to achieve low pore and high trapped field property. The superconductor properties of the single crystal are measured and analyzed in relation with the density and size of the Y211 particle in the Y123 matrix. An optimum processing condition is suggested based on the analyzed results.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.3
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• pp.386-391
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• 1996

SiC particles (average size is 270 nm) of 0, 10, 20, 30, 40 vol% were dispersed in $Si_{3}N_{4}$, and $Si_{3}N_{4}/SiC$ nanocomposites were fabricated by hot press. After sintering, matrix phase, ${\alpha}-Si_{3}N_{4}$ was transformed to ${\beta}-Si_{3}N_{4}$, and second phase, ${\beta}-SiC$ was not changed. No grain boundary crystalline phase by adding of sintering additives was detected. Grain growth of $Si_{3}N_{4}$ was supressed with increasing of SiC contents, and then fine grain was occurred. The highest fracture strength was obtained at 10 vol% SiC, and fracture toughness was decreased, but hardness was linearly increased with SiC content.

• Journal of the Korean Ceramic Society
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• v.48 no.1
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• pp.106-109
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• 2011

In order to fabricate 8YSZ thick film by silk screen printing, YSZ(yttria-stabilized zirconia) commercial powder was used as starting materials. Paste for screen printing was made by mixing 8YSZ powder and organic vehicles. 8YSZ thick film was formed on $Al_2O_3$ substrate. The crystal structure, and microstructure were investigated. Grain size of 8YSZ was increased with increasing calcination temperature and rapid grain growth was shown after calcination at $1300^{\circ}C$. Microstructure showed the mixture of large and small grain size after $1400^{\circ}C$ sintering. Shrinkage rate of 8YSZ thick film sintered at $1400^{\circ}C$ was more than 40%.

• Korean Journal of Materials Research
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• v.31 no.7
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• pp.397-402
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• 2021

In this study, binderless-WC, WC-6 wt%Co, WC-6wt% 1 and 2.5 B₄C materials are fabricated by spark plasma sintering process (SPS process). Each fabricated WC material is almost completely dense, with a relative density up to 99.5 % after the simultaneous application of pressure of 60 MPa. The WC added Co and Co-B₄C materials resulted in crystalline growth. The WC with HCP crystal structure has respective interfacial energy (basal facet direction: 1.07 ~ 1.34 J·m^-2, prismatic direction: 1.43 ~ 3.02 J·m^-2) that depends on the grain growth direction. It is confirmed that the continuous grain growth, biased by the basal facet, which has relatively low energy, is promoted at the WC/Co interface. As abnormal grain growth takes place, the grain size increases more than twice from 0.37 to 0.8 um. It is found through analysis that the hardness property also greatly decreases from about 2661.4 to 1721.4 kg/mm², along with the grain growth.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.5
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• pp.445-451
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• 2022

Ultrasonic sensor is suitable as a next-generation autonomous driving assist device because its lower price compared to that of other sensors and its sensing stability in the external environment. Although Pb(Zr, Ti)O₃ (PZT)-relaxor ferroelectric system has excellent piezoelectric properties, the change in capacitance is large in the daily operating temperature range due to the low phase transition temperature. Recently, many studies have been conducted to improve the temperature stability of ferroelectric ceramics by controlling the grain size and crystal structure, so it is necessary to study the effect of the grain size on the piezoelectric properties and the temperature stability of PZT-relaxor ferroelectric system. In this study, the piezoelectric properties, phase transition temperature, and temperature coefficient of capacitance (TCC) of 0.9 Pb(Zr_1-xTi_x)O₃-0.1 Pb(Zn_1/3Nb_2/3)O₃ (PZT_x-PZN) ceramics with various grain sizes were investigated. PZT_x-PZN ceramics with larger grain size showed higher piezoelectric properties and temperature stability, and are expected to be suitable for ultrasonic devices in the future.