• Title/Summary/Keyword: Critical materials

Search Result 2,519, Processing Time 0.026 seconds

Transition Mechanism from Brittle Fracture to Ductile Shear when Machining Brittle Materials with an Abrasive Waterjet

  • Huang, Chuanzhen;Zhu, Hongtao;Lu, Xinyu;Li, Quanlai;Che, Cuilian
    • International Journal of Precision Engineering and Manufacturing
    • /
    • v.9 no.2
    • /
    • pp.11-17
    • /
    • 2008
  • Critical erosion kinetic energy models for radial/median cracks and lateral cracks in a workpiece are established in this study. We used experimental results to demonstrate that the fracture erosion resistance and erosion machining number could be used to evaluate the brittle fracture resistance and machinability of a workpiece. Erosion kinetic energy models were developed to predict brittle fracture and ductile shear, and a critical erosion kinetic energy model was developed to predict the transition from brittle fracture to ductile shear. These models were verified experimentally.

Prediction of High Temperature Plastic Deformation Variables on Al 6061 Alloy (Al 6061 합금의 고온 소성변형 조건의 예측)

  • 김성일;정태성;유연철;오수익
    • Transactions of Materials Processing
    • /
    • v.8 no.6
    • /
    • pp.576-582
    • /
    • 1999
  • The high temperature behavior of Al 6061 alloy was characterized by the hot torsion test in the temperature ranges of 400∼550℃ and the strain rate ranges of 0.05∼5/sec. To decide optimum deformation condition, three types of deformation maps were individually made from the critical strain (εc). deformation resistance(σp) and deformation efficiency (η). The critical strain(εc) for dynamic recrystallization (DRX) which was decided from the inflection point of strain hardening rate(θ) - effective stress (σ) curve was about 0.65 times of peak strain (εp). The relationship among deformation resistance (peak stress, σp), strain rate (ε), and temperature (T) could be expressed by ε=2.9×1013[sinh(0.0256σp]7.3exp (-216,000/RT). The deformation efficiency (η)which was calculated on the basis of the dynamic materials model (DMM) showed high values at the condition of 500∼550℃, 5/sec for 100% strain. The results from three deformation maps were compared with microstructures. The best condition of plastic deformation could be determined as 500℃ and 5/sec.

  • PDF

Evaluation of Shear-Induced Phase Transformation of $\beta$-Cristobalite by Fiber Push-Out Technique

  • Sang Jin Lee;Dong Zhu;Jae Suk Sung
    • The Korean Journal of Ceramics
    • /
    • v.3 no.3
    • /
    • pp.208-212
    • /
    • 1997
  • Shear-induced phase transformation behavior of chemically stabilized $\beta$-cristobalite was studied by the fiber push-out technique. To obtain the critical grain size for phase transformation, the hot-pressed polycrystalline $\beta$-cristobalite, which was used as the interphase between fiber and matrix, was annealed at $1300^{\circ}C$ for 10h. Two types of fibers, mullite and sapphire fiber, were used in this study. Debonding between mullite fiber and cristobalite interphase occurred at a critical load of 230 MPa. Static friction and fiber sliding were continuously followed by debonding. Shear-induced transformation induced cracks in the cristobalite interphase at the debonding stage. In the case of the sapphire fiber, the debonding occurred at a lower load of 180 MPa due to the residual stress in the interface caused by the difference in thermal expansion coefficients between the fiber and the cristobalite interphase. The load was insufficient for shear-induced phase transformation.

  • PDF

Microstructural Characterization of Gas Atomized Copper-Iron Alloys with Composition and Powder Size

  • Abbas, Sardar Farhat;Kim, Taek-Soo
    • Journal of Powder Materials
    • /
    • v.25 no.1
    • /
    • pp.19-24
    • /
    • 2018
  • Cu-Fe alloys (CFAs) are much anticipated for use in electrical contacts, magnetic recorders, and sensors. The low cost of Fe has inspired the investigation of these alloys as possible replacements for high-cost Cu-Nb and Cu-Ag alloys. Here, alloys of Cu and Fe having compositions of $Cu_{100-x}Fe_x$ (x = 10, 30, and 50 wt.%) are prepared by gas atomization and characterized microstructurally and structurally based on composition and powder size with scanning electron microscopy (SEM) and X-ray diffraction (XRD). Grain sizes and Fe-rich particle sizes are measured and relationships among composition, powder size, and grain size are established. Same-sized powders of different compositions yield different microstructures, as do differently sized powders of equal composition. No atomic-level alloying is observed in the CFAs under the experimental conditions.

Phenyl modified silica sol-gel films for photonics (Photonic 재로로서 페닐실리카 코팅막의 특성)

  • Ahn, Bok-Yeop;Seok, Sang-Il;Kim, Joo-Hyeun;Lim, Mi-Ae
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2003.11a
    • /
    • pp.131-131
    • /
    • 2003
  • The advent of photonic technologies in the field of communications and data transmission has been heavily increasing the demand in integrated optical (IO) circuits capable of accomplishing not only simple tasks like signal, but also more sophisticated functions like all-optical signal routing or active multiplexing/demultiplexing. In the last decade, sol-gel technology has been widely used to prepare optical materials. Sol-gel processes show many promises for the development of low-loss, high-performance glass integrated optical circuits. However, crack formation is likely to occur during heat treatment in thick gel films. In order to overcome the critical thickness limitation, the organic-modified silicate has been widely used. In this case coating matrices have been prepared from the organo-silanes of T structures, acidic catalyst and the as-prepared gel films have been heat-treated below 200$^{\circ}C$ to avoid the crack formation and the degradation of organic components. However, the films prepared in the acidic condition and the low heat temperature make the films contain high OH groups which is the major optical loss function. In this work, C$\sub$6/H$\sub$5/SiO$\sub$1.5/ films were prepared on silicon substrate by sol-gel method using base catalyst in a PTMS/NH$_4$OH/H$_2$O/C$_2$H$\sub$5/OH system. The sol showed spinable viscosity at 50 wt% of solid content, and neglectable viscosity change with time. The films were crack-free and transparent after curing at 450 $^{\circ}C$, and highly condensed to minimize OH content in C$\sub$6/H$\sub$5/SiO$\sub$1.5/ networks. The effects of heat treatment of the films are characterized on the critical thickness, the chemical composition and the refractive indices by means of SEM, FT-IR, TGA, prism coupler, respectively.

  • PDF

Mechanochemical Treatment of Quartz for Preparation of EMC Materials

  • Shin, Hee-Young;Chae, Young-Bae;Park, Jai-Koo
    • Proceedings of the IEEK Conference
    • /
    • 2001.10a
    • /
    • pp.315-324
    • /
    • 2001
  • Mechanochemical effects that occurred in the fine grinding process of quartz particles using planetary ball mill was investigated. Quartz particles have been frequently utilized for optical materials, semiconductor molding materials. We determined that grinding for a long time can be create amorphous structures from the crystalline quartz by Mechanochemical effects. But, to be produced nano-composite particles that the critical grinding time reached for composite materials in a short time. Henceforth, a qualitative estimation must be conducted on the filler for EMC(Epoxy molding compound) materials. It can be produced mechanochemically treated composite materials and also an integrated grinding efficiency considering of the nano-composite amorphous structured particles. The mechanochemical characteristics were evaluated based on particle morphology, size distribution, specific surface area, density and the amount of amorphous phase materials into the particle surface. The grinding operation in the planetary ball mill can be classified into three stages. During the first stage, initial particle size was reduced for the increase of specific surface area. In the second stage, the specific surface areas increased in spite of the increase in particle size. The final stage as a critical grinding stage, the ground quartz was considered mechanochemically treated particles as a nano- composite amorphous structured particles. The development of amorphous phase on the particle surface was evaluated by X-ray diffractometry, thermal gravity analysis and IR spectrometer. The amount of amorphous phase of particles ground for 2048 minutes was 85.3% and 88.2% by X-ray analysis and thermal gravity analysis, respectively.

  • PDF

Properties of Sputter Deposited Cr Thin Film on Polymer Substrate by Glancing Angle Deposition (폴리머 기판에 스퍼터법으로 경사 증착한 Cr박막의 특성)

  • Bae, Kwang-Jin;Choi, In-Kyun;Jeong, Eun-Wook;Kim, Dong-Yong;Lee, Tae-Yong;Cho, Young-Rae
    • Korean Journal of Materials Research
    • /
    • v.25 no.1
    • /
    • pp.54-59
    • /
    • 2015
  • Glancing angle deposition (GLAD) is a powerful technique to control the morphology and microstructure of thin film prepared by physical vapor deposition. Chromium (Cr) thin films were deposited on a polymer substrate by a sputtering technique using GLAD. The change in thickness and Vickers microhardness for the samples was observed with a change in the glancing angle. The adhesion properties of the critical load (Lc) by a scratch tester for the samples were also measured with varying the glancing angle. The critical load, thickness and Vickers microhardness for the samples decreased with an increase in the glancing angle. However, the thickness of the Cr thin film prepared at a $90^{\circ}$ glancing angle showed a relatively large value of 50 % compared to that of the sample prepared at $0^{\circ}$. The results of X-ray diffraction and scanning electron microscopy demonstrated that the effect of GLAD on the microstructure of samples prepared by sputter technique was not as remarkable as the samples prepared by evaporation technique. The relatively small change in thickness and microstructure of the Cr thin film is due to the superior step-coverage properties of the sputter technique.

Determination of a critical damage by experiment and analysis of tensile test (인장시험의 실험과 해석 결과를 이용한 임계손상도의 결정)

  • Jang, S.M.;Eom, J.G.;Lee, M.C.;Joun, M.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2008.10a
    • /
    • pp.292-296
    • /
    • 2008
  • A new method of evaluating critical damage values of commercial materials is presented in this paper. The method is based on the previous study of the methodology [1] of acquisition of true stress-strain curves or flow stress curves over large strain from the tensile test in which the flow stress is described by the Hollomon law-like form, that is, by the strain dependent strength coefficient and the strain hardening exponent. The strain hardening exponent is calculated from the true strain at the necking point to meet the Considere condition. The strength coefficient is assumed to be constant before necking and represented by a piecewise linear function of strain after necking. With the predicted flow stress, a tensile test is simulated by a rigid-plastic finite element method with higher accuracy of less than 0.5% error between experiments and predictions. The instant when the fracture begins and thus the critical damage is obtained is determined by observing the stress variation at the necked region. It is assumed that the fracture due to damage begins when the pattern of stress around the necked region changes radically. The method is applied to evaluate the critical damage of a low carbon steel.

  • PDF

The Morphology and Adhesion of TiCN Film formed by PECVD (PECVD 에 의해 형성된 TiCN 박막의 형상 및 밀착성)

  • Huh, J.;Nam, T.W.
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.15 no.3
    • /
    • pp.118-126
    • /
    • 2002
  • TiCN thin films were deposited on tool steels at $510^{\circ}C$ by PECVD from a $TiCl_4+N_2+CH_4+H_2+Ar$ gaseous mixture. The microstructures and preferred orientation were investigated. The micro-scratch tests were performed using a system equipped with an acoustic emission sensor. Critical loads were determined to evaluate the adhesion of TiCN to substrate. The influences of the microstructures of substrates, double layered coatings, and coatings after nitriding(duplex coating) were investigated. The experimental results showed that the microstructures of substrates and double layered coating did not affect the critical loads considerably. By the duplex coating, critical loads were not always increased. In some cases, duplex coatings decreased critical loads significantly despite of absence of black layer. In this study, we tried to relate the results of scratch test to the residual stress analysis. Nitriding before the coating reduces the tensile residual stress in the film, which gives rise to low critical load in scratch test.

A Study on Critical Depth of Cuts in Micro Grooving

  • Son, Seong-Min;Lim, Han-Seok;Paik, In-Hwan;Ahn, Jung-Hwan
    • Journal of Mechanical Science and Technology
    • /
    • v.17 no.2
    • /
    • pp.239-245
    • /
    • 2003
  • Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor which affects the qualities of machined parts. That is why diamond, especially monocrystal diamond which has the sharpest edge among all other materials, is widely used in micro-cutting. The majar issue is regarding the minimum (critical) depth of cut needed to obtain continuous chips during the cutting process. In this paper, the micro machinability near the critical depth of cut is investigated in micro grooving with a diamond tool. The experimental results show the characteristics of micro-cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardening nea. the critical depth of cut.