• Proceedings of the KSME Conference
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• 2005.11a
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• pp.144.1-144.1
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• 2005

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.44-44
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• 2005

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.677-684
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• 2004

Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.349-356
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• 2002

For two kinds of 25Cr-20Ni stainless steels, STS310J1TB and STS310S with and without a small amount of Nb and N, creep behavior has been studied in a stress and temperature range from 147 to 392 MPa and from 923 to 773 K with a special reference to tertiary creep. The average creep life of STS310J1TB was about 100 times longer than that of the STS310S. The apparent activation energy for the initial creep rate was 330 kJ/mol in STS310J1TB, while that of the STS310S was 274kJ/mol in a power law creep region and 478 kJ/mol in a region of power law breakdown (PLB). The activation energy for STS310S below PLB is close to the for self-diffusion. When compensating for the temperature dependence of the Young's modulus and the omega value, it was found that the apparent activation energy for STS310J1TB was reduced to the activation energy for diffusion of chromium atom in gamma steel. The stress exponent of STS310S was about 12.3 above PLB and 5.1 in a power law creep region. Notwithstanding that the creep condition for STS310J1TB was in a power law creep region, its stress exponent was 7.9 larger than that of STS310S corresponding to the same creep conditions. This was ascribed to the presence of fine precipitates in STS310J1TB.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.117-122
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• 2001

For two kinds of 25Cr-20Ni stainless steels, SUS310J1TB TB and SUS310S with and without a small amount of Nb and N, creep behavior has been studied in a stress and temperature range from 147 to 392MPa and from 923 to 973K with a special reference to tertiary creep. The average creep life of SUS310J1TB was about 100 times longer than that of the SUS310S. The apparent activation energy for the initial creep rate was 330 kJ/mol in SUS310J1TB, while that of the SUS310S was 274 kJ/mol in a power law creep region and 478 kJ/mol in a region of power law breakdown (PLB). The activation energy for SUS310S below PLB is close to the that for self-diffusion. When compensating for the temperature dependence of the Young's modulus and the omega value, it was found that the apparent activation energy for SUS310J1TB was reduced to the activation energy for diffusion of chromium atom in a gamma steel. The stress exponent of SUS310S was about 12 above PLB and 5.1 in a power law creep region. Notwithstanding that the creep condition for SUS310J1TB was in a power law creep region, its stress exponent was 8.3 larger than that of SUS310S corresponding to the same creep conditions. This was ascribed to the presence of fine precipitates in SUS310J1TB.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2326-2333
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• 2000

Creep tests for type 316L(N) stainless steel were carried out using constant-load creep machines at 55$0^{\circ}C$, 575$^{\circ}C$ and $600^{\circ}C$. Material constants necessary to predict creep rupture time were obtained from the experimental creep data. And the applicability of Monkman-Grant(M-G) and modified M-G relationships was discussed. The log-log plot of M-G relationship between the rupture time($t_r$,) and the minimum creep rate ($ $\varepsilon$ _m$) was dependent on test temperatures. The slope of m was 1,05 at 55$0^{\circ}C$ and m was 1.30 at $600^{\circ}C$. On the other hand, the log-log plot of modified M-G relationship between $t_r/$\varepsilon$_r$, and $ $\varepsilon$ _m$ was independent on stresses and temperatures. That is, the slope of m＇ was approximately 1.35 in all the data. Thus, modified M-G relationship for creep life prediction could be utilized more reasonably than that of M-G relationship for type 316L(N) stainless steel. It was analyzed that the constant slopes regardless of temperatures or applied stresses in the modified relationship were due to an intergranular fracture grown by wedge-type cavities.

• Journal of Power System Engineering
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• v.9 no.4
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• pp.96-101
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• 2005

Magnesium alloys have been widely used for many structural components of automobiles and aircraft because of high specific strength and good cast ability in spite of hexagonal closed-packed crystal structure of pure magnesium. In this study, uniaxial tension tests at high temperature and creep tests are done in order to investigate the characteristics of high temperature and mechanisms for creep deformation of AZ31 Mg alloy. Yield stress and ultimate tensile stress decreased with increasing temperature, but elongation increased from results of uniaxial tension test at high temperature. The apparent activation energy Qc, the applied stress exponent n and rupture life have been determined during creep of AZ31 Mg alloy over the temperature range of 473K to 573K and stress range of 23.42 MPa to 93.59 MPa, respectively, in order to investigate the creep behavior. Constant load creep tests were carried out in the equipment including automatic temperature controller, whose data are sent to computer. At around the temperature of $473K{\sim}493K$ and under the stress level of $62.43{\sim}93.59%MPa$, and again at around the temperature of $553K{\sim}573K$ and under the stress level of $23.42{\sim}39.00MPa$, the creep behavior obeyed a simple power-law relating steady state creep rate to applied stress and the activation energy for the creep deformation was nearly equal, respectively, and a little low to that of the self diffusion of Mg alloy including aluminum. Also rupture surfaces at high temperature have had bigger dimples than those at lower temperature by SEM.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.43-48
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• 2010

The heat sink system for a main board in a network server computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. The solder creeping is caused by a constant high temperature condition in the computer and it eventually makes fatal failures. The FE model is used to calculate the stress and predict the life of soldered anchor in the computer. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. The creep test is conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model's constants. Precise life prediction of soldered anchor in creep condition can be performed by this model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.12
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• pp.3088-3095
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• 2000

Creep-fatigue crack growth behavior was experimentally measured particularly when a crack was located in the heat affected region of lCr-5Mo steel. Load hold times of the tests for trapezoidal fatigue waveshapes were varied among 0, 30, 300 and 3,600 seconds. Time-dependent crack growth rates were characterized by the $C_r$parameter. It was found that the crack growth rates were the highest when the crack path was located along the fine-grained heat affected zone(FGHAZ). Cracks located in other heat affected regions had a tendency to change the crack path eventually to FGHAZ. Creep-fatigue crack growth law of the studied case is suggested in terms of (da/dt)$_{avg}$ vs. ($C_t$)$_{avg}$ for residual life assessment.

• Journal of the Earthquake Engineering Society of Korea
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• v.17 no.3
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• pp.117-125
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• 2013

Seismic isolation has been considered and utilized in various industries as a way to prevent huge damage on to structures by large earthquakes in various industries. The laminated Laminated rubber bearings is are most frequently used in seismic isolation systems. The structural Structural safety could not be assured unless the performance of the rubber bearing is not guaranteed for the life time of the structure under the consideration that the bearing is a critical structural member to sustain vertical loads in the seismically isolated structure. However, there are few studies on the deterioration problems of rubber bearings during their service life. The long term performance of the rubber bearings was not considered in past designs of seismically isolated structures. This study evaluates the long term performance and creep characteristics of laminated natural rubber bearings that are used in seismically isolated buildings. For the this study, a set of accelerated thermal aging tests and creep tests are were performed on real specimens. The experimental results show that the natural rubber bearings would have a stable change rate of change for durability under severe environmental conditions for a long time.