• Transactions of the Korean Society of Mechanical Engineers
• /
• v.10 no.4
• /
• pp.519-528
• /
• 1986

본 연구에서는 우선 1차적으로 한국중공업에서 제조한 실제의 터어빈 회전자 축에서 시편을 채취하여 화력발전소 터어빈의 작동 온도에서의 크리이프 거동을 실험 하고, Larson-Miller 법 및 Orr-sherby-Dorn 법에 의하여 수명을 예상하엿으며 열처리 조건의 변화에 따른 크리이프 특성 변화를 고찰하였다.

• Proceedings of the KSME Conference
• /
• 2001.11a
• /
• pp.123-128
• /
• 2001

The creep constants which are used to the reference stress equations of creep damage were obtained to type 316LN stainless steel, and their determining methods were described in detail. Typical Kachanov and Rabotnov(K-R) creep damage model was modified into the damage equations with reference stress concepts, and the modified equations were applied practically to type 316LN stainless steel. In order to determine the reference stress value, a series of high-temperature tensile tests and creep tests were accomplished at $550^{\circ}C$ and $600^{\circ}C$. By using the experimental creep data, the creep constants used in reference stress equations could be obtained to type 316LN stainless steel, and a creep curve on rupture strain was predicted. The reference stress concept on creep damage can be utilized easily as a design tool to predict creep life because the process, which is quantified by the measurement of voids or micro cracks during creep, is omitted.

• Proceedings of the KSME Conference
• /
• 2001.11a
• /
• pp.111-116
• /
• 2001

Small punch-creep(SP-Creep) test technique has been applied for evaluating the creep characteristics for high temperature materials. However, in order to evaluate the damage and predict the remaining life, it is necessary to establish a quantitative correlation between SP-Creep and uniaxial-creep test results. This paper presents analytical and experimental results of useful correlation between SP-Creep and uniaxial-creep properties for 9Cr1MoVNb steel at $600{\sim}650^{\circ}C$ in terms of stress(load) and activation energy during creep deformation. Especially, the activation energy obtained from SP-Creep test is linearly related to that from uniaxial-creep test at $650^{\circ}C$ as follows: $Q_{sp-p}{\fallingdotseq}1.37\;Q_{TEN},\;Q_{sp-{\sigma}}{\fallingdotseq}1.53\;Q_{TEN}$.

• Journal of the Korean Society for Precision Engineering
• /
• v.30 no.8
• /
• pp.809-814
• /
• 2013

The relationship between the small-punch creep test and the conventional creep test was investigated experimentally using a method similar to that of the Monkman-Grant relationship. Uniaxial and small-punch creep rupture tests were carried out on 9Cr-2W ferritic steel (Commercial Grade 92 steel: X10CrWMoVNb 9-2) at elevated temperatures. From the relation derived in the same manner as the Monkman-Grant relation, a correlation between the displacement rate in response to the small-punch creep test and the strain rate in the uniaxial creep test was found, and the creep life was calculated using this relation. Furthermore, the failure modes of the small punch creep test specimens were investigated to show that the fracture was caused by creep.

• Journal of Ocean Engineering and Technology
• /
• v.22 no.6
• /
• pp.58-63
• /
• 2008

The short-term high temperature creep rupture behavior of Ni-based Alloy718 steels jointed by friction welding wasinvestigated at the elevated temperatures of 550 to $700^{\circ}C$ under constant stress conditions. The creep rupture characteristics such as creep stress, rupture time, steady state creep rate, and initial strain were evaluated. Creep stress has a quantitative correlation between creep rupture time and steady state creep rate. The stress exponents (n, m) of the experimental data at 550, 600, 650 and $700^{\circ}C$ were derived as 26.1, -22.4, 22.5, -18.5, 17.4, -14.3 and 6.9, -8.1, respectively. The stress exponents decreased with increasing creep temperature. The creep life prediction was derived by the Larson-Miller parameter (LMP) method and the result equation obtained is as follows: T(logtr+20)=-0.00148${\sigma}^2$-3.089${\sigma}$+23232. Finally, the results were compared with those of the base metal for Alloy718.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.4
• /
• pp.44-50
• /
• 1998

The creep life fraction can be evaluated by the degree of grain deformation since the grain of Cr-Mo base metal deforms in the direction of stress. The grain deformation method using image processing technique is developed for life assessment of in-service high-temperature components. The new assessment model of grain deformation method is presented to apply to in-service components and is verified by interrupted creep test for ex-serviced material of 1Cr-0.5Mo steel. The proposed model, which is irrespective of stress direction, is to evaluate mean of the absolute deviation for the measured ratios which are diametrical maximum to minimum dimensions for grains.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.11a
• /
• pp.27-32
• /
• 2002

In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• Journal of Welding and Joining
• /
• v.1 no.2
• /
• pp.61-68
• /
• 1983

Austenitic stainless steel has been investigated widely for creep strength of heat resistant material and effects of grain sizes due to various solution treatment time under constant temperature. It was studied that effects of grain sizes subject to solution treatment temperature 1100.deg. C, 1125.deg. C, 1175.deg. C, 1250.deg C, and 1300.deg. C respectively on the creep strength, fracture behaviour and fractography of SUS 316 stainless steel. The experimental results obtained were as follows. 1. The optimum grain size for the maximum creep strength did not vary with creep testing temperatures and stress levels. 2. Among various grain sizes due to different solution treatment temperature, the optimum grain size for the creep strength was found 0.044mm. Also the size showed the minimum initial strain regardless creep temperature. 3. Garofalo's equation of creep rupture life was applied well to SUS 316 stainless steel. 4. The fractography of optimum size was ductile intergranular fracture of dimple type and showed along with the increase of grain size intergranular fracture of w type.

• Journal of the Korean Society of Mechanical Technology
• /
• v.13 no.4
• /
• pp.125-130
• /
• 2011

Technological mode progress demands the use of materials at high temperature and pressure. Constant load creep tests have been carried out over the range of stresses at high temperatures. One of the most critical factors in considering such applications as the most critical one is the creep behavior. In order to investigate the creep behavior in this study, the stress exponents during creep were determined over the temperature range of $275^{\circ}C$ to $325^{\circ}C$ and the stress range of 36MPa to 72MPa. The applicability of modified Monkman-Grant relationship was also discussed.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.1
• /
• pp.45-50
• /
• 2003

Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.