• Korean Journal of Materials Research
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• v.3 no.2
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• pp.166-174
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• 1993

Abstract The crack resistance of PSG(Phosphosilicate Glass) and PE-SiN(Plasma Enhanced CVD S${i_2}{N_4}$)films deposited on aluminium thin films on Si substrate was analyzed in this study. PSG was deposited by AP-CVD and PE- SiN by PE-CVD. All the films underwent repeated heat cycles at 45$0^{\circ}C$for 30 min. Crack formation and development were examined between each heat cycle. The crack behavior was found to be closely related to the stresses in the films. The stress induced by the difference in thermal expansion behavior between the passivation layers and underlying aluminum film may cause the crack. Crack resistance decreases as the thickness of PSG films increases due to the high tensile stress of the films. Phosphorus in the PSG films releases tensile stress and consequently the stress of the films tends to show compressive stress. As a result, crack resistance increased as the concentratin of P in the PSG films increased. Crack resistance in the PE-SiN films also increased with compressive stress. An experimental model to predict crack generation in the PSG and PE-SiN films during heat cycle was suggested.

• Journal of Ocean Engineering and Technology
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• v.9 no.1
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• pp.132-141
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• 1995

The purpose of the present study is to investigate the statistical characteristics of m and C in the fatigue crack propagation law, da/dN=C(.DELTA.K)/sup m/ and to studies on the randomness of fatigue crack propagation and retardation behavior. Fatigue tests were perfomed on 32 CT specimens of SPV50 steel under the same one condition. First, the value of m and C were determined for each specimen, and all the data were analyzed statistically. second, the material's resistance to fatigue crack propagation is modeled as a stchastic process, which varies randomly along the crack path. The statistical analysis of the material resistance is performed with the data obtained by constant load controlled tests. Finally, retardation behavior was examined experimentally by using a CT specimen, and a retardation parameters were analyzed statistically.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.5
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• pp.640-647
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• 2004

In order to perform elastic-plastic fracture mechanical analyses, fracture resistance curves for concerned materials are required. The unloading compliance method and the DCPD(Direct Current Potential Drop) method have been widely used for measuring the crack length and the extension for a standard specimen fracture resistance curve test. However it is difficult to apply the unloading compliance method to a real pipe fracture resistance curve test. The objective of this paper is to propose the calibration equation between the normalized crack length and the normalized electric potential, and to apply to pipe fracture experiments. For these, finite element analyses were performed with various current input locations and crack front configurations. Also the 4-point bending jig was manufactured for a pipe test and the DCPD method was used to measure crack extensions and crack lengths for a pipe test. The calculated crack length by the DCPD method agreed with the measured crack length within 5% error.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.41 no.1
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• pp.44-51
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• 2009

Proper test methods and instruments for evaluating score or creasing crack have not been provided, although score crack trouble occurs frequently in manufacturing corrugated containers. Because existing creasability tester has the limitation of the available thickness of test piece and folding rate, it cannot be used for corrugated fiberboards with high thickness. In this study, we developed the laboratory test instrument and the method to determine the score or creasing crack of corrugated fiberboard. This instrument can evaluate folding resistance of corrugated board without restriction on the folding rate and thickness of specimen. Corrugated fiberboard had the different folding behavior from linerboard when it was creased. By using this test machine, score crack can be objectively determined by folding test piece to the certain folding angle with constant folding rate.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.28 no.2
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• pp.208-215
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• 1992

Concept of primary solidification mode control was adopted to obtain optimal solidification crack resistance, hot ductility, corrosion resistance and toughness for austenitic stainless steel. By controlling primary solidification phase as primary $\delta$ and containing no ferrite at room temperature, optimal solidification crack resistance, hot ductility, corrosion resistance and cryogenic toughness could be obtained. The optimum chemical composition of austenitic stainless steel ranges 1.46~1.55(Creq/Nieq ratio) calculated by Schaeffler's equation.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.10a
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• pp.232-237
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• 2001

The evaluation of specimen thickness effect of fatigue crack growth life by the simulation of probabilistic fatigue crack growth is presented. In this paper, the material resistance to fatigue crack growth is treated as a spatial stochastic process, which varies randomly on the crack surface. Using the previous experimental data, the non-Gaussian(eventually Weibull, in this report) random fields simulation method is applied. This method is useful to estimate the probability distribution of fatigue crack growth life and the variability due to specimen thickness by simulating material resistance to fatigue crack growth along a crack path.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1581-1583
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• 1999

Epoxy Compound has been used as insulation material in cable accessories. During the applying voltage to cable, heat shock is induced to accessory by the temperature difference between atmosphere and conductor. In this study, crack resistance, thermal and mechanical properties were evaluated about conventional epoxy compound and rubber toughened epoxy compound. Because rubber absorbs the stress caused by heat shock, crack resistance of rubber toughened epoxy compound is high. In the case of low thermal expansion coefficient, the compound shows high crack resistance because of low volumetric change.

• Elastomers and Composites
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• v.41 no.2
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• pp.79-87
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• 2006

This study are conducted for the purpose of developing rubber material with noise and crack resistance. Cure characteristics, physical properties, thermal resistance, fuel resistance, abrasion resistance, crack resistance and noise resistance of NBR compounds with the various amounts of oleamide and aramid chip were investigated. From the measurements of cure characteristics and Mooney viscosities, cure characteristics of uncured rubber showed that a torque was decreased as the amount of oleamide increased. Hardness, modulus and elongation of rubber specimens tended to be reduced gradually, however, tensile strength remained unchanged as the amount of the oleamide increased. As a testing results of heat resistance for 70 hours at $120^{\circ}C$ and oil resistance far 70 hours at $40^{\circ}C$, tensile strength and elongation were all reduced. From the TGA/DSC analysis, there was no such a change observed in thermal characteristics of rubber materials. As a result of testing basic physical properties, abrasion resistance, noise resistance and crack resistance, the optimum ratio of oleamide to NBR was found to be 3 phr, while that of aramid to NBR 227001 was 1 phr.

• Transactions of the Korean Society of Mechanical Engineers
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• v.7 no.4
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• pp.441-450
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• 1983

A reasonable J-resistance curve determination procedure is suggested by correcting the amount of overestimation in J-value whose effect becomes significant when crack grows. Experiments using compact tension specimens of an alloy steel (SCM4, K.S. Designation) are performed. The value of J estimated according to this procedure is compared with that as obtained from the method by Merkle and Corten. The conditions for J controlled crack growth proposed by Hutchinson and Paris are examined for the material used here. It appears that J resistance curve, which is independent of crack ratio can be obtained for those specimens satisfying the conditions of J controlled crack growth.

• New & Renewable Energy
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• v.6 no.1
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• pp.38-45
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• 2010

Abstract Under the physical stress on photovoltaic (PV) module, it will be warped according to elongation of the front glass and then micro-crack will be occurred in the thermally sealed solar cell. This micro-crack leads to drop of short circuit current of the PV module. This is because of increase of resistance component by micro-crack. Micro-crack at specific solar cell in the module lessens the durability of PV module with reduced output, hot-spot caused by solar cell output mismatch and increased resistance component. This study shows the relation between electrical characteristics and micro- cracks due to mechanical stress on PV module.