• Journal of Conservation Science
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• v.31 no.3
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• pp.243-254
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• 2015

In this study, the stability of the adhesive was determined through the Oddy Test that is Verification Test for potential damage by various materials. And to find the factor causing the corrosion of the metal samples, the adhesives and coatings those are usually used in the metal preservation process were selected and treated on the samples. Six kinds of adhesives and four kinds of metal specimens Fe, Pb, Cu, Ag were used. As results, the weight change showed high increasement in the rate of weight change 29.87% of Fe sample. The chromaticity measurement showed the high change value of the Cellulose-based adhesive. In case of the VOCs test from adhesive by using GC-MS, Acetic acid was detected from all six kinds of the adhesives. Compared to cellulose-based adhesives and the other adhesives, the amount of VOCs per 1mg concentration is higher than 900 times and was detected small amount of Formic acid. This is assumed to be facilitated by acid impurities and the light. This reaction was considered as the result of reducing a large amount of molecular and of generating a large amount of Nox. And thus the reacted sulfur changes was considered as the factor for causing corrosion.

• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.4
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• pp.374-382
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• 2009

Steam generator(SG) tube, as a barrier isolating primary to the secondary coolant system of nuclear power plants(NPP), must maintain the structural integrity far the public safety and its efficient power generation capacity. And SG tubes bearing defects must be timely detected and taken repair measures if needed. For the accomplishment of these objectives, SG tubes have been periodically examined by eddy current testing(ECT) on the basis of administrative notices and intensified SG management program(SGMP). Stress corrosion cracking(SCC) on the SG tubes is not easily detected and even missed since it has lower signal amplitude and other disturbing factors against its detection. However once SCC is developed, that can cause detrimental affects to the SG tubes due to its rapid propagation rate. Accordingly SCC is categorized as prime damage mechanism challenging the soundness of the SG tubes. In this study, reproduced EDM notch specimens are examined for the detectability and quantitative characterization of the axial ODSCC by +PT MRPC probe, containing pancake, +PT and shielded pancake coils apart in a single plane around the circumference. The results of this study are assumed to be applicable fur providing key information of engineering evaluation of SCC and improvement of confidence level of ECT on SG tubes.

• Journal of the Korea Concrete Institute
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• v.20 no.6
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• pp.713-719
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• 2008

Various types of coatings have been developed for use as reinforcement in concrete and to resist chloride environment. The most commonly used coatings are inhibited and sealed cement slurry coating, cement polymer compositing coating and epoxy coating. Cement slurry offers passive protection, epoxy coating offers barrier protection whereas polymer coating offers both passive protection and barrier protection. Moreover, damage during handling of the steel may result in disbondment of the epoxy coating, which would increase the risk of localized corrosion. In the present study, inhibiting technique was used to increase the calcium hydroxide content at the interface up to 20%. Calcium hydroxide provides a high buffering capacity that resists a local fall in pH and thus maintains the alkaline environment necessary to prevent chloride corrosion. This study examines the use of a calcium hydroxide coating on the steel surface to enhance the pH buffering capacity of steel-concrete interface. Finally, the chloride threshold level (CTL) of polymer inhibitive coating calcium hydroxide is evaluated.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.6
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• pp.510-515
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• 2016

Recently, corrosion occurred on the piles of a marine bridge located on the NamHae expressway in Korea. A sacrificial anode cathodic protection system was installed to prevent corrosion damage in the marine bridge. In the case of the marine bridge in this study, the sacrificial anode cathodic protection system was applied at the tidal and splash zones of the piles because the upper part of the structure was not corroded, and because corrosion occurs at the tidal and splash zones due to sea tides. To verify the performance of the sacrificial anode cathodic protection system 8 years later, cathodic protection (CP) current, CP potential, and degree of depolarization were measured. The experimental results on the performance of the sacrificial anode cathodic protection system from a total of 60 piles were classified into 4 categories: good CP effect results (13 piles), partial CP effect results (27 piles), temporarily erroneous results (5 piles), and need for maintenance because of delamination (15 piles). It was determined that additional repairs are required, such as the application of bulk anodes and jacket casings, for piles where the CP effect is poor.

• Journal of the Korean Institute of Gas
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• v.20 no.4
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• pp.33-43
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• 2016

Grinding, weld deposition, type A sleeve, type B sleeve, composite sleeve, hot tapping and clamp are used as the method to repair the buried pipelines in the United States, UK and Europe. In the event of defect to the pipeline, they have repaired the pipeline through the fitness-for-service assessments. In addition, they have guidelines for the possible repair methods to apply to each type of damage, which is occurred due to the 3rd party construction or corrosion. According to the KGS FS551, Safety Validation in Detail including ECDA(External Corrosion Direct Assessment) as one method of integrity management should be carried out for the old pipeline which supply natural gas as the middle pressure in Korea. Where a defect on the pipelines is found, on the result of Safety Validation in Detail, the pipelines should be repaired or replaced by new piping. However, there are no guidelines or regulations regarding the repair and reinforcement of pipeline, so that, cutting the damaged pipeline and replacing it as a segment of new pipe is the only way in Korea until now. We have suggested pipeline repair methods including type A, B sleeve, composite sleeve, after the survey of foreign repair method and standards including the method of United States and the United Kingdom, and after analysis of the results on pipeline repair test including type A, type B sleeve and composite sleeve.

• Journal of the Korean Recycled Construction Resources Institute
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• v.7 no.3
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• pp.271-278
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• 2019

The corrosion of reinforcements embedded in concrete causes severe deterioration in reinforced concrete structures. As a countermeasure, epoxy coated reinforcements are used to prevent corrosion of reinforcements. When epoxy coated bars are used, the resistance of corrosion is excellent, but epoxy coating on the bars have a disadvantage of reduction in bond capacity comparing to that of normal bars. Therefore, it is necessary to confirm the bond performance of epoxy coated reinforcements through experimental and analytical methods. Bond behaviors of epoxy coated bars for various diameters of 13 and 19mm and thicknesses of cover concrete of 3 types(ratio of cover to bar diameter) are examined. As the diameters of the epoxy coated bars increase, the difference of bond strength between epoxy coated and uncoated bars also increases and damage patterns showed pull out failure. In addition, finite element analysis was performed based on the bond-slip relationship obtained by direct pullout test and compared with the flexural test results. It is considered that flexural member test is more useful than pullout test for simulating the behavior of actual structure.

• Journal of the Korea institute for structural maintenance and inspection
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• v.26 no.6
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• pp.23-32
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• 2022

Although PSCB girder bridges account for 4% of the bridges in use on highways, they do not account for much, but 98% of PSCB girder bridges are 1^st type and 2^nd type of bridge. Also, the total length of the PSCB girder bridge is 16% (192km) of the total length of the highway bridge. Thus, the PSCB girder bridge can be one of the bridge types where maintenance is important. In order to analyze the damage types of PSCB girder bridges, a detailed analysis was conducted by selecting 62 places (477 spans) precision safety diagnosis reports considering ratio of the construction method and snow removal environment exposure class. Analysis of report and a field investigation was conducted, and as a result, most of the causes of deterioration damage were caused by rainwater (salt water) flowing into the bridge pavement soaking in between the top flange and the interface. After concrete slab deteriorate occurred then bridge pavement cracking and breaking increased and exfoliation of concrete occurred by corrosion and expansion of the reinforcing bars occurred. In addition, the cause of cracks in the longitudinal direction on the bottom of the top flange is considered to be cracks caused by restrained drying shrinkage. In conclusion, for reasonable maintenance considering the characteristics of PSCB girder bridges, it should be suggested in the design aspect that restrained drying shrinkage crack on top flange. Also, it is believed that differentiated maintenance method should be proposed according to snow removal environment exposure class.

• Journal of the Korea institute for structural maintenance and inspection
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• v.13 no.1 s.53
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• pp.69-77
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• 2009

An underwater structure is made to put with serious damage state by special environmental factors. If this damage phenomena persist, as for the structure, it is generated a structural serious problem because of the corrosion of a reinforcing bar and the loss of the concrete cut end. Repair work of an underwater structure is very harder than repair work in land, and it is actual that certification about a maintenance effect is uncertain. And the existing repair method is applied to a structure damaged with you without verification of a repair effect by a foreign reward and experience. In this study, a repair method about an underwater structure was proposed and observed a behavior characteristic and interface failure of an specimens. and comparison analyzed an effect of a proposed maintenance method.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.