• Journal of Environmental Science International
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• v.21 no.5
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• pp.555-562
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• 2012

The experimental determination of equilibrium constants is required to estimate concentrations of reagents and/or products in environmental chemical reactions. For an example, the choice of copper (Cu) complexation reactions was motivated by their fast kinetics and the ease of measurement of Cu by an ion-sensitive electrode. Each individual titrant of sulfate ($SO{_4}^{2-}$) and oxalate ($C_2O{_4}^{2-}$) was expected to have its own unique characteristics, depending on the bonding in Culigands connected to the aqueous species. The complexation reaction of Cu with $SO{_4}^{2-}$ somewhat fast reached equilibrium status compared with $C_2O{_4}^{2-}$. The experimental equilibrium constants ($K_{eq}$) of copper sulfate ($CuSO_4$) and copper oxalate ($CuC_2O_4$) were determined $10^{2.2}$ and $10^{3{\sim}4.3}$, respectively.

• Membrane and Water Treatment
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• v.11 no.3
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• pp.201-206
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• 2020

Electrodialysis (ED) is used in wastewater treatment, during the processing and recovery of beneficial materials, to produce usable water. In this study, sulfate and chlorine ions, which are the anions majorly used for electroplating, were studied as factors affecting the recovery of copper, nickel and water from wastewater by electrodialysis. Although the removal rates of copper and nickel ions were slightly higher with the use of chlorine ions than of sulfate ions, the removal efficiencies were above 99.9% under all experimental conditions. The metal ions of the plating wastewater flowed through the ion exchange membrane of the diluate tank and the concentrate tank while all the water moved together due to electro-osmosis. The migration of water from the diluate tank to the concentrate tank was higher in the presence of a monovalent chloride ion compared to that of a divalent sulfate ion. When sulfate was the anion used, the recoveries of copper and nickel increased by about 25% and 30%, respectively, as compared to the chloride ion. Therefore, when divalent ions such as sulfate are present in the electrodialysis, it is possible to reduce the movement amount of water and highly concentrate the copper and nickel in the plating wastewater.

• Journal of Environmental Health Sciences
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• v.19 no.3
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• pp.22-28
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• 1993

In order to investigate the hygienic chemical conditions of farm waters used as the potable and cleaning water for cow, we examined the pH, turbidity, KMnO$_4$ consumption, total hardness, chlorine, sulfate, NH$_3$-N, NO$_3$-N, lead, maganese, copper, zinc, fluoride and chrome for 78 farm waters around Kyunggi Province. Of 78 farm waters tested, average pH was 6.70+_0.06, turbidity 0.724 $\pm$ 0.081, KMnO$_4$ consumption 4.200 $\pm$ 0.256 mg/l, total hardness 107.46 $\pm$ 6.90 mg/l, NH$_3$-N 0.043 $\pm$ 0.037 mg/l, NO$_3$-N 8.096 $\pm$ 0.652 mg/l, chlorine 21.414 $\pm$ 2.187 mg/l, sulfate 12.737 $\pm$ 1.511 mg/l, lead 0.076 $\pm$ 0.001 mg/l, manganese 0.029 $\pm$ 0.004 mg/l, copper 0.018 $\pm$ 0.002 mg/l, zinc 0.055 $\pm$ 0.005 mg/l, chrome 0.048 $\pm$ 0.002 mg/l and fluorine 0.011 $\pm$ 0.001 mg/l. According to the geological characteristics, the concentrations of total hardness, NO$_3$-N, pH and chlorine in farm waters of Hwasung gun were higher than those in Yangpyung and Kwangju gun. In hygienic chemical items tested, there were high significanc among NO$_3$-N, total hardness, sulfate and chlorine. KMnO$_4$ consumption was significant with NH$_3$-N, sulfate and pH. But in heavy metals, there were significance between lead and copper, copper and chrome, and copper and fluorine.

• Corrosion Science and Technology
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• v.10 no.4
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• pp.143-150
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• 2011

Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.

• Journal of the Korean institute of surface engineering
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• v.5 no.3
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• pp.77-85
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• 1972

A method of preparation of synthetic ignorgaic coating on copper (patina) has been presented . An Eh--pH diagram was constructed for the present Cu-H2O-SO$_4$ system using the most recently available thermodynamic data. In the path of the patination at room temperature the general behaviour of copper in acidic copper sulfate solutions with potassium chlorate as an oxidizing agent appeared to follow those predictable in this Eh-pH diagram. In the presence 0.05 molar cupric sulfate at a temperature of about 28$^{\circ}C$ a green brochantite (CuSO$_4$$.$3Cu(OH)$_2$) layer was formed on copper sheet in 20 days. In a solution having an initial pH of 3.5 the development of a brochantite coating has been observed to take place in two stages. In the first, a layer of cuprous oxide formed on the copper at a relatively rapid rate. In the ensuing step the outer layer of cuptrite was oxidized at much slower rate to form brochantite. The syntetic coatings appeared to consist of crystal-lites of brochanitite growing perpendicular to the cuprose oxide surface. The outer tips of the -crystallites were reasily broken off and gave to the layer a rather chalky character. Underneath, at the brochantite Cu$_2$O interface, however, the green layers were firmely attached. The effect of reagent concentration , solution agitation , and moderate temperature increase were investigated to improve the quality of coating. So also in a qualitative way were the effect of light.

• Journal of the Korean Wood Science and Technology
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• v.25 no.4
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• pp.92-98
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• 1997

To make good use of chitosan forming complex with heavy metals in wood preservative treatment, woods impregnated with chitosan and copper sulfate were prepared. Amounts of leached copper, decay resistance, anti-mold efficacy, iron corrosion rates, moisture regain rates and degradation pattern in chitosan pre-treated and untreated wood were compared. After leaching test, amounts of leached copper from chitosan pre-treated wood had a much smaller than chitosan untreated wood, and good decay resistance was retained even after leaching test. From these results, it was proved that chitosan-copper complex formed in wood played and important role for decay durability. In chitosan pre-treated wood, damage values by test molds became remarkably smaller, but the growth of test molds was not perfectly inhibited. Distinct differences in iron corrosion rates between chitosan pre-treated and untreated woods was not recognized but chitosan pre-treated wood showed the lower moisture regain rates than chitosan untreated wood because of water insoluble chitosan membrane formed in wood. After leaching test, the tracheid walls in the wood treated with 2.0% copper sulfate only were eroded by the fungal attacks, but those in the wood pre-treated with chitosan remained almost intact.

• Journal of the Korean institute of surface engineering
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• v.5 no.1
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• pp.1-7
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• 1972

Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

• Archives of Pharmacal Research
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• v.11 no.2
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• pp.81-86
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• 1988

The transfer of cupric sulfate across the rat small intestine in vitro was studied by perfusion method using the segments of everted rat small intestine. Copper transport was approximately propotional to the metal concentration in the mucosal solution and no difference was observed in the metal transport among rat duodenum, jejunum and ileum. It was suggested from these results that copper transport across the rat small intestine would occur by passive diffusion. The effect of various chelating agents on copper transport across the rat small intestine n vitro and its uptake by the intestine were also studied. Copper transport was greatly enhanced in the presence of EDTA and NTA. Copper uptake decreased to a greater extent in the presence of EPTA and NTA.

• Proceedings of the KSEEG Conference
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• 2000.04b
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• pp.258-259
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• 2000

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.40 no.5
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• pp.42-46
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• 2008

The papers in preserved books and archives experience aging which was affected by a variety of factors. Thus, the studies concerning impacts of those factors on paper aging are required. In this research, a simulation of a short-time accelerated paper aging was conducted in order to examine the effects of acid and metals (alum, copper (II) sulfate, copper (II) chloride, and iron (III) chloride) on the natural paper aging for a long time. As a result of experiments, it is found that both acid and metals have impacts on paper aging. Alum resulted in the significant decrease of pH, brightness, folding endurance, and viscosity of paper. Both copper (II) chloride and iron (III) chloride also resulted in the decrease of brightness, folding endurance, and viscosity of paper. In more detail, paper aging by iron (III) chloride showed much more significant than that by copper (II) chloride. The paper aging in case of copper (II) sulfate coexisting sulfate ion, where metal absorbed moisture was higher than in case of paper treated only by alum. This result indicated that metal catalyzes paper aging by acid. Based on these results, it was revealed that both alum and metal are the major factors in paper aging. In particular, paper aging was far more accelerated in case when acid and metals existed in paper at the same time.