• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Transactions of Materials Processing
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• v.7 no.1
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• Solar Energy
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• v.19 no.1
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• pp.77-86
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• 1999

The optimal thermal design of a single heat source on one wall of a vertical open top cavity was studied experimentally. The temperature and flow fields in the cavity were visualized. The objectives of this study is to obtain the best location of the single heat source and to examine the effects of heat source protrusion, substrate thermal conductivity and cavity aspect ratio on the natural convection cooling due to a single heat source. As the results, the cooling effect for the copper substrate is superior to that of the epoxy-resin substrate and is improved with increasing cavity width. For the epoxy-resin substrate of lower conductivity, the protrusion of the heaters plays a role in decreasing the cooling effect. The best location was the mid-height of the substrate.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.1
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• pp.1-14
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• 1997

Natural convection cooling of discrete heaters located in a two-dimensional vertical open top cavity is investigated experimentally. The five discrete heaters with same heat generation are located on the wall of the cavity. The heaters are arranged in two configurations; flush-mounted on a vertical wall and protruding from the wall about 4.5 mm. The materials used for the vertical walls are copper and epoxy-resin, and air is used as the cooling fluid. The temperature and flow fields in the cavity were visualized by means of Mach-Zehnder interferometer and smoke-method. Also, local temperature measurements are made along the vertical wall. Results are obtained for cavity aspect ratios of 4.6, 7.5 and 9.5 and modified Rayleigh numbers ranging from 10$^{3}$ to 10$^{6}$ . Results indicate that the cooling efficiency for the copper wall is superior to that of the epoxy-resin. For the epoxy-resin wall, the protrusion of the heaters plays a role in decreasing the heat transfer performance. The location of maximum temperature is significantly influenced by the wall materials and heater configurations. Correlations relating the Nusselt number to the modified Rayleigh number are proposed.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.1-6
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• 2013

A simple thermal oxidation of Cu thin films deposited on planar substrates established a growth of vertically aligned copper oxide (CuO) nanorods. DC sputter-deposited Cu thin films with various thicknesses were oxidized in environments of various oxygen partial pressures to control the kinetics of oxidation. This is a method to synthesize vertically aligned CuO nanorods in a relatively shorter time and at a lower cost than those of other methods such as the popular hydrothermal synthesis. Also, this is a method that does not require a catalyst to synthesize CuO nanorods. The grown CuO nanorods had diameters of ~100 nm and lengths of $1{\sim}25{\mu}m$. We examined the morphology of the synthesized CuO nanorods as a function of the thickness of the Cu films, the gas environment, the oxidation time, the oxidation temperature, the oxygen gas flow rate, etc. The parameters all influence the kinetics of the oxidation, and consequently, the volume expansion in the films. Patterned growth was also carried out to confirm the hypothesis of the CuO nanorod protrusion and growth mechanism. It was found that the compressive stress built up in the Cu film while oxygen molecules incorporated into the film drove CuO nanorods out of the film.