• Korean Journal of Materials Research
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• v.21 no.5
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• Journal of the Korean Society of Safety
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• v.34 no.3
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• pp.15-20
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• 2019

As industry is progressing and standards of living are improved, the demand of electrical energy is expected to grow 8-9% annually. Therefore, the importance of electrical fire prevention technology with the ability of the power supply is being emphasized. According to the statistics of fire in Korea, fire occurred about 45,000 cases annually, and electrical fire possessed about 20%. The electrical fire by poor contact has increased gradually, can be connected as great fire to secondarily induce short circuit and earth fault. Then analysis of heating causes of electrical connections between copper and copper alloy is needed. Also, detection and analysis algorithm of oxide at copper alloy are necessary. In this research, in order to understand the characteristics of oxide growth with rising resistance and heating, it is demonstrated that the oxide at electrical connections can cause fire due to arcing.

• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.558-565
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• 1994

The horizontal continuous casting process with the heated mold was applied to obtain the unidirectionally solidified rods($4{\sim}8mm$ dia.) of pure copper with good surface quality. The results could be summarized as follows. 1. The unidirectional solidification of pure copper rods with good surface(mirror surface) quality could be obtained by placing the S/L interface inside the heated mold cavity even though the cast copper rods were covered with thin copper oxide layer. 2. The casting speed for 4mm dia. rods with mirror surfaces was affected significantly by the mold-cooler distance rather than the cooling flow rate when other casting conditions were fixed. 3. The casting speed was the main factor affecting the oxidation of copper during the continuous casting and the thickness of copper oxide layer decreased almost linearly as the casting speed increased.

• Journal of the Korean Ceramic Society
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• v.11 no.1
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• pp.3-9
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• 1974

The role of added metal oxide in the adherence mechanism of low melting glass to several metal plates such as oxygen free high conducting copper, low carbon steel, chrominum galvanized on copper, and stainless steel was investigated. The metal oxide which added to glass were cupric oxide, ferric oxide, chromic oxide, and stainless steel oxide. The glass to that various metla oxide were added, sealed with several metal plates in the electric furnace at $650^{\circ}C$ for 5 minutes. The results as follows; 1) The interfacial reaction was promoted and strong chemical bonding with glass and metals by which the surface energy was decreased showed excellent sealing by addition of metal oxide. 2) When the interfacial reaction of glass and metals was promoted by addition of metal oxide found out that various adhernece mechanism were related to the sealing. 3) When the amount of metal oxide addition was 3-5% the excellent sealing was achieved.

• Journal of Electrochemical Science and Technology
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• v.2 no.4
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• pp.204-210
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• 2011

Thin film electrodes have been intensively studied for active materials and current collectors to enhance the electrochemical performance. Here, porous structures of nickel-based oxide films, consisting of nickel oxide and copper (II) oxide, which was derived from the copper substrate during the annealing process, were deposited on metallic copper foils. The half-cell tests revealed excellent capacity retention after $80^{th}$ charge/discharge cycles. Some films showed an excess of the theoretical capacity of nickel oxides, which mainly originate from partially oxidized copper substrates during annealing. These results exhibit that both a preparation method of an active materials and partially oxidized current collectors could be important roles to apply thin film electrodes.

• Journal of the Korean Ceramic Society
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• v.38 no.11
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• pp.1000-1007
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• 2001

In an evacuated tube solar collector, the stable sealing of the heat pipe to the glass tube is important for the collector to use for a long period of time. The sealing of copper tube to the glass is quite difficult because of the large differences in the physical and chemical properties of the two materials. In this study, therefore, a proper copper oxide layer was induced to improve the chemical bonding of the two materials, and the oxidation state of copper and the interface between copper and glass were examined by XRD, SEM and EDS. Its bonding strength was also measured. Cu$_2$O was formed when the bare copper was heat-treated under 600$^{\circ}C$, while CuO oxide layer was formed above that temperature. The bonding state of CuO to the copper was very poor. The borate treatment of the copper, however, extend the stable forming of Cu$_2$O layer to 800$^{\circ}C$. Borosilicate glass tube was sealed to a copper tube by Housekeeper method only when the sealing part was covered with Cu$_2$O layer. The bonding strength at the interface was measured 354.4N, its thermal shock resistance was acceptable.

• Journal of Power System Engineering
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• v.9 no.4
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• pp.124-129
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• 2005

Copper oxide, CuO, are very important components include of high temperature super- conductors, and widely used. The properties of sintered materials were affected by the size and shape of copper oxide with starting materials in the solid-phase reaction. A homogeneous and fine CuO powder was prepared by thermal decomposition of the copper oxalate precursor. Copper oxalate was precipitated by the addition of copper nitrate solution to an oxalic acid solution. The influence of various factors such as temperature, pH, concentration as well as ultrasonic irradiation in the solution were investigated.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• Bulletin of the Korean Chemical Society
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• v.24 no.2
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• pp.209-218
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• 2003

Ecosystems in the Keweenaw Peninsula region of Lake Superior, USA, were disturbed by over 500 million tons of copper-rich mine tailings during the period 1850-1968. Metals leaching from these mine residues have had dramatic effects on the ecosystems. Vast acreages of exposed tailings that are over 100 years old remain unvegetated because of the combination of metal toxicity, absence of nutrients, and temperature and water stress. Therefore, it is important to characterize and fractionate solid copper phases for assessing labile forms of copper in soils and sediments contaminated by the mining wastes. X-ray diffraction analyses indicate that calcite, quartz, hematite, orthoclase, and sanidine minerals are present as major minerals, whereas cuprite,tenorite, malachite, and chalcopyrite might be present as copper minerals in the mining wastes. Sequential extraction technique revealed that carbonate and oxide fractions were the largest pools of copper (ca. 50-80%) in lakeshore and wetland stamp sands whereas the organic matter fraction was the largest reservoir (ca. 32%) in the lake sediments. The concentrations of iron and copper were inversely correlated in the oxide fraction suggesting that copper may occur as a surface coating on iron oxides. As particle size and water contents decrease, the percent of the copper bound to the labile carbonate fraction increases.

• Journal of the Korean Wood Science and Technology
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• v.13 no.2
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• pp.35-44
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• 1985

The purposes of this study were, first, to investigate retention levels of toxic elements and oxide individual plies for each panel and, second, to examine disproportioning of individual toxic elements Thirty five water gum plywood panels were treated with a copper-chromium-arsenic preservative (CCA) by the soaking process as the treament time were applied. Such individual plies at a distance of 2.5cm, 7.5cm from the edge were assayed for CuO, $CrO_3$, and $As_2O_5$ on the basis of copper, chromium and arsenic content by Atomic Absorption Spectrophotometry. In these experiments, 12mm thickness plywood panels made of water gum, which were selling, were selected for the preservative treatment. Treating solutions were prepared for 10%, dilute solution of copper-chromium-arsenic preservative and then 1, 3, 6, 12 and 24 hours soaking trements in CCA preservative were applied. The results obtained are as follows: 1. The retention of total oxide in the face and back plies (1+7) retained more than the retention of total oxide in the other plies. The total oxide retention for the individual plies except the face and back plies (1+7) was showed in the following orders; cross plies (3+5), cross plies (2+6), core ply (4). 2. The retentions of total oxide increased as the increase of treatment time. The CCA treated plywood retained high levels of total oxide retention in the face and back plies (1+7). 3. All the retentions in the face and back plies (1+7) is over 5Kg/$m^3$, New Zealand Timber Preservation Standards Specification, and after 6 hours, the retentions in the cross plies (3+5) is over 4. The relative penetration of copper, chromium, and arsenic were not affected by the treatment time. The proportion of arsenic decreased in relation to both copper and chromium and the proportion of copper increased in relation to both chromium and arsenic. 5. A disproportioning of copper, chromium occurred with longer distance from edge, and with longer distance from edge the leachability resistance of CCA treated specimens decreased. After 6 hours (soaking time), the proportion of active elements at a distance of 2.5cm from the edge was consistent. And after 24 hours-soaking, the proportion of active elements at a distance of 7.5cm from the edge was consistent.