• Journal of the Korean institute of surface engineering
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• v.29 no.2
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.

• Journal of the Korean Chemical Society
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• v.57 no.3
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• pp.322-328
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• 2013

Copper iodide was employed as a modifier for preparation of a new carbon ceramic electrode. For the first time, the catalytic oxidation of amoxicillin (AMX) was demonstrated by cyclic voltammetry, chronoamperometry and amperometry methods at the surface of this modified carbon ceramic electrode. The copper iodide modified sol-gel derived carbon ceramic (CIM-SGD-CC) electrode has very high catalytic ability for electrooxidation of amoxicillin. The catalytic oxidation peak current was linearly dependent on the amoxicillin concentration and the linearity range obtained was 100 to 1000 ${\mu}mol\;L^{-1}$ with a detection limit of 0.53 ${\mu}mol\;L^{-1}$. The diffusion coefficient ($D=(1.67{\pm}0.102){\times}10^{-3}\;cm^2\;s^{-1}$), and the kinetic parameter such as the electron transfer coefficient (${\alpha}$) and exchange current density ($j_0$) for the modified electrode were calculated. The advantages of the modified CCE are its good stability and reproducibility of surface renewal by simple polishing, excellent catalytic activity and simplicity of preparation.

• Resources Recycling
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• v.25 no.1
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• pp.3-9
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• 2016

The leaching behavior of gold from waste CPU chip using Iodide/Iodine solution was studied. The direct leaching of gold with Iodide/Iodine solution for CPU chip under the size of 150 mesh showed leaching ratio of 20%. It was assumed that the copper film was produced on the gold particle during grinding process and the copper film prevents lodine/Iodide solution from contacting with leachable gold. Meanwhile, the extraction of gold was improved to 90% by pretreatment process with $HNO_3$ solution. In order to explain the result, EDS and ICP analysis for the leaching residue were conducted. It was found that the copper coated on the surface of the gold particle was removed about 80% by $HNO_3$, resulting in the increment of gold leaching rate.

• Corrosion Science and Technology
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• v.6 no.4
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• pp.198-205
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• 2007

The initial stages of electrochemical oxidative CuI film formation on Cu(111), as studied by means of Cyclic Voltammetry (CV), in-situ Scanning Tunneling Microscopy (STM) and ex-situ Synchrotron X-ray Photoemission Spectroscopy (SXPS), indicate a significant acceleration of copper oxidation in the presence of iodide anions in the electrolyte. A surface confined supersaturation with mobile CuI monomers first leads to the formation of a 2D-CuI film via nucleation and growth of a Cu/I-bilayer on-top of a pre-adsorbed iodide monolayer. Structurally, this 2D-CuI film is closely related to the (111) plane of crystalline CuI (zinc blende type). Interestingly, this film causes no significant passivation of the copper surface. In an advanced stage of copper dissolution a transition from the 2D- to a 3D-CuI growth mode can be observed.

• Journal of the Korean Chemical Society
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• v.40 no.5
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• pp.341-346
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• 1996

Electrochemical determination of iodide was carried out by stripping voltammetry with a $(Cin)Cu(NO_3)_2$ modified-carbon paste electrode. Iodide was coordinated onto the electrode surface containing $(Cin)Cu(NO_3)_2$ via ion exchange. The oxidation peak potential of incorporated iodide was ＋0.72 V. The optimum analytical conditions for the determination of iodide were investigated using linear sweep voltammetry. Optimum conditions for the electrochemical determination of iodide were as follows: i) A predeposition solution was 0.1 M $KNO_3.$ ii) The deposition time was 10 min. iii) The composition of the electrode was 40% (w/w). The detection limit for iodide was $1.0{\times}10^{-6}M$ and the relative standard deviation was ${\pm}5.5%\;in\;2.0{\times}10^{-5}M$(four repetitions). The interference effect of other anions were also investigated. $Cl^-,\;Br^-,\;C_2O_4^{2-},\;and\;ClO_4^-$ ions do not interfere for the determination of iodide. When $SCN^-$ was added to the deposition solution, the oxidation peak current of iodide ion was decreased roughly 32%.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2679-2682
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• 2012

A simple one-pot synthesis of two derivatives of 1,4-dihydropyridines has been described under reflux conditions using copper iodide nanoparticles (CuI NPs) as a catalyst in high yields. This method demonstrated four-component coupling reactions of aldehydes and ammonium acetate via two pathways. In one route, the reaction was performed using 2 eq ethyl acetoacetate while in the other one 1 eq ethyl acetoacetate and 1 eq malononitrile were used. The CuI NPs was reused and recycled without any loss of activity and product yield. It is noteworthy to state that wide range of the 1,4-dihydropyridines have attracted large interest due to pharmacological and biological activities.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.492-495
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• 2008

Efficient top-emitting organic light-emitting diodes were fabricated using copper iodide (CuI) doped NPB as a p-doped hole injection layer to improve hole injection from a silver bottom electrode. The enhanced hole injection is originated from the formation of the charge transfer complex between CuI and NPB. The devices result in high efficiency of 69 cd/A with almost Lambertian emission pattern.

• Bulletin of the Korean Chemical Society
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• v.30 no.4
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• pp.961-964
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• 2009

• Journal of the Korean Chemical Society
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• v.57 no.2
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• pp.169-171
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• 2013

• Bulletin of the Korean Chemical Society
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• v.25 no.7
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• pp.1085-1087
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• 2004