• 한국분말재료학회지
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• 제30권4호
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• pp.339-345
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• 2023

This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520℃. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515℃ following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.

• Journal of Welding and Joining
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• 제13권3호
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• 한국기계가공학회지
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• 제20권2호
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• pp.93-100
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• 2021

Copper sheets has been used widely in electric and electron industry fields because they have good electric and heat conduction property of the material. And, in order to bond copper material, a kind of soldering process is generally used. But, because it is difficult to bond by soldering between overlapped thin copper sheets, so, another kind of brazing bonding process can be used in that case. But, because the brazing process needs wide bonding area, it needs heat treatment process in electric furnace. Generally, for spot welding of sheets, a conventional electric Resistance Spot Welding process(RSW) has been used, it has welding characteristics using contact resistance heating induced by electric current flow between sheets. But, because copper sheets has the low electric resistance, it is difficult to weld by electric resistance spot welding. So, in this study, an electric Resistance heated Surface Friction Spot Welding process(RSFSW) is suggested and is testified for the spot welding ability of thin copper sheets. It is known from the experimental results and simulation that the suggested spot welding process will be able to improve the spot welding ability of copper sheets by the combined three kinds of heating generated by surface friction by rotating pin, and conducted from heated steel electrode, and generated by contact resistance of electricity.

• Nuclear Engineering and Technology
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• 제55권6호
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• pp.2139-2146
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• 2023

During reactor operation, the divertor must withstand unprecedented simultaneous high heat fluxes and high-energy neutron irradiation. The extremely severe service environment of the divertor imposes a huge challenge to the bonding quality of divertor joints, i.e., the joints must withstand thermal, mechanical and neutron loads, as well as cyclic mode of operation. In this paper, potassium-doped tungsten (KW) is selected as the plasma facing material (PFM), oxygen-free copper (OFC) as the interlayer, oxide dispersion strengthened copper (ODS-Cu) alloy as the heat sink material, and reduced activation ferritic/martensitic (RAFM) steel as the structural material. In this study, a vacuum brazing technology is proposed and optimized to bond Cu and ODS-Cu alloy with the silver-free brazing material CuSnTi. The most appropriate brazing parameters are a brazing temperature of 940 ℃ and a holding time of 15 min. High-quality bonding interfaces have been successfully obtained by vacuum brazing technology, and the average shear strength of the as-obtained KW/Cu and ODS-Cu alloy joints is ~268 MPa. And a fabrication route for manufacturing the flat-type divertor target based on brazing technology is set. For evaluating the reliability of the fabrication technologies under the reactor relevant condition, the high heat flux test at 20 MW/m² for the as-manufactured flat-type KW/Cu/ODS-Cu/RAFM mockup is carried out by using the Electron-beam Material testing Scenario (EMS-60) with water cooling. This paper reports the improved vacuum brazing technology to connect Cu to ODS-Cu alloy and summarizes the production route, high heat flux (HHF) test, the pre and post non-destructive examination, and the surface results of the flat-type KW/Cu/ODS-Cu/RAFM mockup after the HHF test. The test results demonstrate that the mockup manufactured according to the fabrication route still have structural and interfacial integrity under cyclic high heat loads.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1990년도 특별강연 및 춘계학술발표 개요집
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• pp.76-80
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• 1990

• Journal of Welding and Joining
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• 제13권3호
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• pp.106-115
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• 1995

To know the bonding phenomena of Ti/Cu brazed joint, a characteristic of microstructures in bonding interlayer of vacuum brazed pure Ti to Cu has been studied in the temperature range from 1088 to 1133K for various bonding times using Ag-28wt%Cu filler metal. Also intermediate phases formed in bonded interlayer and behavior of layer growth have been investigated. The obtained results in this study are as follows: 1) Liquid insert metal width at the each brazing temperature was proportional to the square root of brazing time, and it was considered that the liquid insert metal width was controlled by the diffusion rate process of primary .alpha.-Cu formed at the Ti side. 2) Intermediate phases formed near the Ti interface were .betha.-Ti and intermetallic compounds TiCu, Ti$_{2}$Cu, Ti$_{3}$Cu, and TiCu. 3) .betha.-Ti formed in Ti base metal durig brazing transformed to lamellar structure, .alpha.-Ti + Ti$_{2}$Cu. The structure came from the eutectoil decomposition reaction in cooling. And the width of .betha.-Ti layer was proportional to the square root of brazing time, and it was considered that the growth of .betha.-Ti layer was controlled by interdiffusion rate process in .betha.-Ti. 4) The layer growth of TiCu, Ti$_{3}$Cu$_{4}$ and TiCu, phases formed near the Ti interface was linerface was linearly proportional to the brazing time, and it was considered that the layer growth of these phases was controlled by the chemical reaction rate at the interface.

• 전기화학회지
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• 제27권1호
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• pp.8-14
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• 2024

오스테나이트계 스테인리스강은 내식성 및 성형성이 양호하여 다양한 분야에 적용되며, 구리계의 합금을 용가재로 하는 브레이징을 통하여 다양한 형상의 제품으로 가공되어 활용되고 있다. 이때, 구리 기반의 용가재와 스테인리스강의 계면에서 갈바닉 셀을 형성하여 부식을 촉진할 수 있으며, 확산을 통해 스테인리스강에 고용 시 형성되는 구리 과다 영역(Cu-rich region)은 공식 발생의 기점이 되어 내식성을 저하시킨다. 본 연구에서는 브레이징이 적용된 스테인리스강의 내식성을 개선하고자, AISI 316L 스테인리스강에 암모니아 가스를 이용한 질화처리를 적용하였다. 질화처리한 시편은 처리 온도가 증가함에 따라 두께가 증가하고 표면 경도가 높아졌다. 동전위분극시험을 통해 내식성을 평가한 결과 질화층 내 고용된 질소의 용출 및 부동태 거동으로 모재대비 내식성이 개선되었지만 처리온도가 높아 크롬질화물(CrN) 분율이 증가하는 경우 내식성이 감소하였다.

• 한국정밀공학회지
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• 제12권9호
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• pp.126-136
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• 1995

Copper magnetron anode of a microsave-over consists of an cylindrical outer-tube and various inner-vanes. The magnetron anode is produced by the complex processes; vane blanking, pipe cutting and silver-alloy brazing of vanes. Recently, the backward extrusion process for forming vanes has been developed to avoid the complex procedures. The developed process is analyzed by using upper-bound elemental technique (UBET). In the UBET analysis, the upper-bound load, the configuration and the vane-height of final extruded product are determined by minimizing the roral power consumption with repect to chosen parameters. To verify theoretical analysis, experiments have been carried out with pure plasticine billets at room temperature, using different web-thickness and number of vanes. The theoretical predictions both for forming load and vane-height are in reasonable agreement with the experimental results.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.204-208
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• 1995

Copper magnetron anode of a microwave-oven consists of an cylindrical outer-tube and various inner-vanes. The magnetron anode is produced by the complex process ; vane blanking, pipe cutting and sliver-alloy brazing of vanes. Recently, the backward extrusion process for forming vanes has been developed to avoid the complex procedures. The developed process is analyzed by using upper-bound elemental technique(UBET). In the UBET analysis, the upper-bound load, the configuration and the vane-height of final extruded product are determined by minimizing the total power consumption with respect to chosen parameters. To verify theoretical analysis, experiments have been carried out with pure plasticine billets at room temperature, using different web-thickness and number of vanes. The theoretical predictions both for forming load and vane-height are in reasonable agreement with the experimental results.

• Journal of Advanced Marine Engineering and Technology
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• 제19권3호
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• pp.50-61
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• 1995

In recent years, many ceramic researchers have discoved various methods of joining ceramic to metal. However, most of these joining methods are perfomed under vacuum and pressured circumstances. So, when we join ceramic to metal,the proceedings are very complicated and require a very high cost. The purpose of this study is to develop a new joining method of an alumina ceramic to an aluminum metal in air atmosphere. The joining condition, such as copper metallizing, nickel plating, brazing, etc. was investigated through the shear strength test of the trial joint. The results obtained from the above experimenta are summarized as follows : 1) In the case of the $Al_2O_3$/$Al_2O_3$joint, the shear strength of the joint was affected by the various foctor such as kaolin content, copper metallizing thickness, firing temperature, firing time. 2) The better shear strength of the $Al_2O_3$/Al joint was obtained when Ni plating was conducted under higher current density than existing plating condition. 3) The shear strength of the $Al_2O_3$/Al joint increases with the Ni plating thickness is confined to the range of this paper. 4) The shear strength of the thermal-shocked specimen($Al_2O_3$/Al joint) was far more deteriorated than that of the as-bonded specimen.