• 보존과학연구
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• s.14
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• pp.45-76
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• 1993

Au-Cu alloyed coating layer were found by Hg-amalgam process and it seemed to be used Cu-amalgam process similar to Au-amalgam. Coated layer is dense and unique, Thickness of layer was 1.5 to $18.0\mum$ which had 95.3 to 99.8% purity of gold Matrix metal mostly cosists of forged copper alloy which had high purity and ferrite ($\alpha$) strusture. It showed excellent refining technical level at that time. Aowever, the nail, ferrous matrix used for strength needed, composed of silver foil packed and gold layer for adherence between ferrous matrix and gold layer

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• The Journal of the Korean dental association
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• v.11 no.5
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• pp.353-358
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• 1973

The purpose of this study was to determine the gingival response to the various restorations for 3 weeks, 5 weeks and 8 weeks respectively after they had been inserted in 42 tooth of 5dogs. The histopathological observation was also performed to evaluate the effect of the variuos restorations on gingival tissue. They inclued gold, copper and nickel-chrome alloy. The following findings were obtained. 1. The gingivae adjacent to the well adapted and polished restorations and their margins with a level of gingival crest were grossly and histopathologically found no specific changes. 2. The gingive adjacent to the ill fitting and unpolished restorations and their margins with subgingival extension of 1 to 1.5mm were not grossly found any changes but hitopathologically, the inflammatory changes. 3. Thee wee no obvious difference in gingival response among the various alloys in histopathological observation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.3
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• pp.445-451
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• 2016

General fuse elements of solution for fast acting operation characteristics made using silver or silver alloy, those are not able to dominate cost competition to the advanced global leaders that have not only high technology but competitive price. In this study, the method that compose the fuse elements manufactured solution of fast acting operation characteristics by using precision multi-layer thin film plating and helical cutting process from low-priced copper metal. Furthermore, in order to move rated current line of fuse due to the heat loses, the manufacture construction method of fixed resistor is introduced, and then Ni-P plating layer and Sn plating layer are introduced multiply for controling fine opening time characteristics. So this study can establish the high productive and low-priced production method.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.97-103
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• 2008

In this investigation, conductivity of conductive inks was measured. A particular attention has been given to the effect of metal powders with various conductivity on the overall conductivity of the bulk ink. The conductivity of various solutions simulating conductive inks consisting of copper and silver was measured and the results have been discussed in relation to various applications of conductive inks in practice. A conductivity model simulating systems consisting of various materials has been introduced and the results were discussed. Materials of good conductivity are adversely affected by mixing with materials of poor conductivity simply through serial connection. However, parallel connection has rather little effect on the overall conductivity. The practical implication of various mixtures of materials on conductive inks has been discussed.

• The Transactions of the Korean Institute of Power Electronics
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• v.4 no.3
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• pp.294-303
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• 1999

Resistance spot welding is commonly used for welding products of high quality because of clean welding and short w welding-time. But. conventional spot welders bring about the depreciation of welding products, iuespective of dynamic r resistance characteristics during welding time. This paper discussed dynamic resistance database implementation in t terms of welding performance improvement. On different welding conditions, we compared dynamic resistance, r respectively, about pure iron and Sn-Pb alloy on Copper. Also, it investigated the relation of tensile shear strength and d dynamic resistance in welded workpiece.

• Journal of the Korean institute of surface engineering
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• v.15 no.4
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• pp.192-207
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• 1982

A study has been made of the interaction parameters of Zn other elements in dilute solutesd solution of molten cadmium alloys over the temperature range of 450 to 570$^{\circ}C$. The experi-mental measurementss were made in a touch instant cell using a fusedd Licl-KCl electrolyte. The activity of zinc in binary and ternary solutions sexhibiteds a strong positive deviation from Raoult's law. The addition of silver, indium or lead increased the activity of zinc whereas addition of copper, bismuth or tin decreased the zinc activity slightly. The results for all the metallic solutions showed a linear dependence of reciprocal of ab-solute temperature over the experimental range. The interaction parameters obtained are as follows.

• Bulletin of the Korean Chemical Society
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• v.10 no.6
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• pp.524-529
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• 1989

A glow discharge mass spectrometric(GDMS) analytical method was developed for direct analysis of impurities in solids. Ions extracted from a glow discharge ion source with a sample as a cathode were analyzed by a quadrupole mass filter. Ion extractions were carried out through differentially-pumped orifices biased to positive and negative potentials. Operating parameters of the glow discharge source such as discharge current, orifice-to-cathode distance, energy analyzer setting and bias voltages have been optimized. The developed GDMS was applied to the analysis of KSS copper-base alloy standards certified by Korea Standards Research Institute(KSRI). In the analysis, the reproducibility and the detection limits were estimated to be about 2.5% RSD, and in the low ppm range, respectively.

• Restorative Dentistry and Endodontics
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• v.16 no.1
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• pp.6-15
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• 1991

The purpose of this study was to observe in vitro chloride corrosion behavior from 5 kinds of amalgam (Caulk spheracal, Amalcap, Dispersalloy, Tytin, Sybralloy) as a function of time after tritruration by using potentiostat. After each amalgam alloy and Hg was triturated as the direction of the manufacturer by the mechanical amalgamator, the triturated mass was inserted the cyrindrical matal mold ($12{\times}10mm$) and was condensed by using routine manner. The specimen was removed from the mold and was stored at room temperature for 1 week, 1 month and 3 months, and standard surface preparation was routine carried out. The 0.9% saline solution was used as electrolyte in pH 6.8~7.0 at $30{\pm}0.5.^{\circ}C$. The open circuit potential was determined after 30 minutes' immersion of 1 week, 1 month and 3 month old specimens. The scan rate was 1 mV/sec and the surface area of amalgam exposed to the solution was $0.65\;Cm^2$ for each specimen. All potentials reported are with respect to a silver / silver chloride electrode (SSE). The following result was obtained. 1. All amalgam specimens became more noble corrosion potentials which represent the improved corrosion resistance as the time elapsed. 2. Three kinds of high copper amalgam always exhibited more noble potential than low copper amalgam at 1 week, 1 month and 3 months. 3. Two kinds of low copper amalgam had the similar polarization curve pattern with 3 current peaks at each time period and current densities associated with these peaks were decreased as aging especially in caulk spherical amalgam. 4. All kinds of high copper amalgam had the similar polarization curve pattern with absence of prominent current peak at each time period, but the polarization curve of D amalgam had one apparent current peak at 1 week.

• Restorative Dentistry and Endodontics
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• v.13 no.2
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• pp.221-235
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• 1988

The purpose of this study was to observe characteristic properties through the polarization curves and EMPA images from 4 different types of amalgam obtained by using the potentiostats (EG & G PARC) & EPMA (Jeol JSM-35), to investigate the degree of corrosion of each phase of amalgam on the oxidation peak, and to identify corrosion products from the corroded amalgam by use of X-ray diffractometer(Rigaku). After each amlgam alloy and Hg were triturated as the direction of the manufacturer by means of the mechanical amalgamator(Shofu), the triturated mass was inserted into the cylindrical metal mold which was 12mm in diameter and 10mm in height and was condensed by means of routine manner. The specimen was removed from the mold and stored at room temperature for about 7 days. The standard surface preparation was routinely carried out. Anodic polarization measurement was employed to compare the corrosion behaviours of the amalgams in 0.9% saline solution(pH6.8~7.0) and artificial saliva (pH6.8~7.0) at $37^{\circ}C$. The open circuit potential was determined after 30 minutes' immersion of specimen in electrolyte and the potential scan was begun at the potential of 100mV cathodic from the corrosion potential. The scan rate was 1mV/sec and the surface area of amalgam exposed to the solution was 0.64$cm^2$ for each specimen. All the potentials reported are with respect to a saturated calomel electrode (SCE). EPMA images on the determined oxidation peaks of each amalgam in artificial saliva were observed. X-ray diffraction patterns of each sample were recorded before and after polarization in artificial saliva (Aristaloy, Caulk Spherical, Dispersalloy and Tytin: at +770mV, +585mV, +8.10m V and +680m V respectively) by use of a recording diffractometer. Nickel filtered Cu $K_{{\alpha}_1}$ radiation was used and sample was scanned at $4^{\circ}(2{\theta})/min.$ from $25^{\circ}$ to $80^{\circ}$. The following results were obtained. 1. Oxidation peak potential in artificial saliva shifted to more anodic direction than that in saline solution. 2. The corrosion potential of high copper amalgam was more anodic than the potential of low copper amalgam. 3. The current density was lower in artificial saliva than in saline solution. 4. One of the corrosion products, AgCl was identified by X-ray diffraction analysis. 5. ${\gamma}_2$ phase was the most susceptible to corrosion and e phase was stable in low copper amalgam and ${\eta}$' phase and Ag-Cu eutectic were susceptible to corrosion in high copper amalgam.