• Smart Structures and Systems
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• v.4 no.2
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• pp.247-259
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• 2008

The potential use of Cu-based shape memory alloys (SMA) in retrofitting historical monuments is investigated in this paper. This study is part of the ongoing work conducted in Tunisia within the framework of the FP6 European Union project (WIND-CHIME) on the use of appropriate modern seismic protective systems in the conservation of Mediterranean historical buildings in earthquake-prone areas. The present investigation consists of a finite element simulation, as a preliminary to an experimental study where a cantilever masonry wall, representing a part of a historical monument, is subjected to monotonic and quasi-static cyclic loadings around a horizontal axis at the base level. The wall was retrofitted with an array of copper SMA wires with different cross-sectional areas. A new model is proposed for heat-treated copper SMAs and is validated based on published experimental results. A series of nonlinear finite element analyses are then performed on the wall for the purpose of assessing the SMA device retrofitting capabilities. Simulation results show an improvement of the wall response for the case of monotonic and quasi-static cyclic loadings.

• Journal of the Korean Chemical Society
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• v.36 no.1
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• pp.95-99
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• 1992

A spectrophotometric method for the determination of copper using N,N'-Oxalylbis(salicylaldehyde hydrazone) as a chromogenic reagent has been developed. Determination has been performed by measuring the absorbances of the copper complexes in solutions containing 60% dimethylformamide (pH 2) at 422 nm. The method allows the determination of 0.4${\sim}$1.8 ${\mu}$g/ml of copper and has been applied to its determination in synthetic mixtures and alloy samples.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.39-43
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• 2015

The cement mixtures such as flyash, iron-slag and silica fume have been actively studied in order to increase the quality of concrete. In this study, the grinded copper-slag with different proportion was added to portland cement. The physical properties of the cement mortars, (i.e.) flowability, absorption, compressive strength and flexural strength, were investigated for the potential application to the cement. Also, the influence of the acid on the chemical resistance of the cement mortars with copper-slag was evaluated by monitoring the weight variation of the cement mortars under 5 % sulfuric acid for 28 days.

• Journal of the Korean Chemical Society
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• v.37 no.1
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• pp.112-118
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• 1993

A water-soluble chromogenic reagent, N,N'-oxalylbis(2-pyridyl-3'-sulphobenzoylhydrazone) has been synthesized. Spectrophotometric and first-and second-derivative spectrophotometric methods for the determination of copper with the reagent have been developed. Determination has been performed by measuring the absorbance and the first-and second-derivative values of the copper complexes in aqueous solutions (pH 1.89) at 379, 395, 363 and 421 nm, respectively. The method allows the determination of 0.12-1.20 ${\mu}g$ /ml of copper and has been applied to the analysis of aluminium alloy samples. The best results have been obtained from the measurements of the second-derivative values at 421 nm.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• Journal of the Korean Electrochemical Society
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• v.13 no.4
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• pp.270-276
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• 2010

Nickel-copper foam electrodes with pore gradient micro framework and nano-ramified wall have been prepared by using an electrochemical deposition process. Growth habit of nickel-copper co-deposits was quite different from that of pure nickel deposit. In particular, the ramified structure of the individual particles was getting clear with chloride ion content in the electrolyte. The ratio of nickel to copper in the deposits decreased with the distance away from the substrate and the more chloride ions in the electrolyte led to the more nickel content throughout the deposits. Compositional analysis for the cross section of a ramified branch, together with tactical selective copper etching, proved that the copper content increased with approaching central region of the cross section. Such a composition gradient actually disappeared after heat treatment. It is anticipated that the pore gradient nickel-copper nanostructured foams presented in this work might be a promising option for the high-performance electrode in functional electrochemical devices.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.5
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• pp.224-228
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• 2014

Recently, the demands for separation/recovery of valuable metals such as nickel or tin from copper based alloys has been attracting much attention from the viewpoints of environmental protection and resource utilization. In this report, experimental results on concentration increasement of nickel and tin compared to the previous report are investigated. Ni is successfully separated by a organic solvent and reduced to the metal powder whose concentration is over 98 %. Sn is separated by a selective solution method and its concentration is increased to 97.5 % by three consecutive solution and reduction process. Crystal structure, surface morphology and microstructure of the separated samples are studied.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.7
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• pp.112-117
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• 2003

The brazing of copper alloys and duplex stainless steels is an indispensable manufacturing technology for thrust chambers with regenerative cooling. For setting up the optimized brazing conditions, C18200 copper alloy plate with machined cooling channels and S31803 stainless steel plate are brazed with AMS4764 filler metals of which thickness is 50${\mu}m$ and 80${\mu}m$ They are tested by X-ray radiography, strength/leakage and fracture tests, and fracture surface inspection. The results obtained by the suggested conditions are that the specimen brazed with filler metal thickness of 50${\mu}m$ has good strength properties and brazed zone. However, the specimen with filler metal thickness of 80${\mu}m$ has the brazed zone with cooling channel obstruction and enlargement.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.484-488
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• 2007

Mo(Ti) alloy and pure Cu thin films were subsequently deposited on $SiO_2-coated$ Si wafers, resulting in $Cu/Mo(Ti)/SiO_2$ structures. The multi-structures have been annealed in vacuum at $100-600^{\circ}C$ for 30 min to investigate the outdiffusion of Ti to Cu surface. Annealing at high temperature allowed the outdiffusion of Ti from the Mo(Ti) alloy underlayer to the Cu surface and then forming $TiO_2$ on the surface, which protected the Cu surface against $SiH_4＋NH_3$ plasma during the deposition of $Si_3N_4$ on Cu. The formation of $TiO_2$ layer on the Cu surface was a strong function of annealing temperature and Ti concentration in Mo(Ti) underlayer. Significant outdiffusion of Ti started to occur at $400^{\circ}C$ when the Ti concentration in Mo(Ti) alloy was higher than 60 at.%. This resulted in the formation of $TiO_2/Cu/Mo(Ti)\;alloy/SiO_2$ structures. We have employed the as-deposited Cu/Mo(Ti) alloy and the $500^{\circ}C-annealed$ Cu/Mo(Ti) alloy as gate electrodes to fabricate TFT devices, and then measured the electrical characteristics. The $500^{\circ}C$ annealed Cu/Mo($Ti{\geq}60at.%$) gate electrode TFT showed the excellent electrical characteristics ($mobility\;=\;0.488\;-\;0.505\;cm^2/Vs$, on/off $ratio\;=\;2{\times}10^5-1.85{\times}10^6$, subthreshold = 0.733.1.13 V/decade), indicating that the use of Ti-rich($Ti{\geq}60at.%$) alloy underlayer effectively passivated the Cu surface as a result of the formation of $TiO_2$ on the Cu grain boundaries.

• The Journal of Korean Academy of Prosthodontics
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• v.52 no.3
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• pp.177-185
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• 2014

Purpose: This study is designed to investigate the various impacts of different types of scaler tips such as cooper alloy base tip and the others on the surface roughness of teeth and implant by the method which is currently in clinical use. Materials and methods: Four different types of disc shaped porcelain, titanium, zirconia, and Type III gold alloy dental materials sized 15 mm diameter, 1.5 mm thickness were used for the experiment. Plastic hand curette (Group PS), cooper alloy new tip (Group IS), and stainless steel tip (Group SS) were used as testing appliances. A total of 64 specimens were used for this study; Four specimens for each material and appliance group. Surface roughness was formed with 15 degree angle in ultrasonic scaler tip and with 45 degree angle in hand curette of instrument tip and the specimen surface with 5 mm long, one horizontal-reciprocating motion per second for 30 seconds by 40 g force. To survey the surface roughness of each specimen, a field emission scanning electron microscope, an atomic force microscope, and a surface profiler were used. (Ra, ${\mu}m$). Results: According to SEM, most increased surface roughness was observed in SS group while IS groups had minimal roughness change. Measurement by atomic force microscope presented that the surface roughness of SS group was significantly greater than those of PS, IS and control groups in the type III gold alloy group (P<.05). IS group showed lesser surface roughness changes compared to SS group in porcelain and gold alloy group (P<.05). According to surface profiler, surface roughness of SS group showed greater than those of PS, IS and control groups and IS group showed lesser than those of SS group in all specimen groups. Type III gold alloy group had large changes on surface roughness than those of porcelain, titanium, zirconia (P<.05). Conclusion: The result of this study showed that newly developed copper alloy scaler tip can cause minimal roughness impacts on the surface of implant and dental materials; therefore this may be a useful alternative for prophylaxis of implant and restored teeth.